Abstract: A feedstock material for use in an additive manufacturing apparatus is prepared from a first material and a metal organic framework (MOF). The MOF comprises a plurality of nodes and a plurality of linkers, the plurality of linkers coupled to the plurality of nodes, thereby forming a framework. The MOF has a lower coefficient of thermal expansion than a coefficient of thermal expansion for the first material. As a result, the feedstock material has a reduced coefficient of thermal expansion as compared to the first material alone and thus exhibits low thermal expansion as its temperature is increased. The coefficient of thermal expansion for the MOF may be modified by using a different plurality of nodes and/or a different plurality of linkers, as well as by incorporating guest molecules or atoms into the framework of the MOF.

Abstract: Methanol-to-gasoline (MTG) conversion may be performed with a methanol recycling. Methanol may be fed to a first reactor where it may be catalytically converted under dimethyl ether formation conditions in the presence of a first catalyst to form a product mixture comprising dimethyl ether (DME), methanol, and water. The DME may be separated from the methanol and the water and delivered to a second reactor. In the second reactor, the DME may be catalytically converted under MTG conversion conditions in the presence of a second catalyst to form a second product mixture comprising gasoline hydrocarbons and light hydrocarbon gas. The methanol and the water from the first reactor may be separated further to obtain substantially water-free methanol, which may be returned to the first reactor. The separation of methanol from the water may be performed using the light hydrocarbon gas to effect stripping of the methanol.

Abstract: A method and system for the hydraulic control of a concrete placing boom (14) comprising a plurality of boom arms (16), wherein hydraulic drive cylinders (18) for the boom arms (16), which are connected to one another in an articulated manner, are controlled by a hydraulic circuit (34), wherein a supply pressure is supplied via a hydraulic pump (32) to the hydraulic circuit (34), and wherein a pressure signal is captured in the drive cylinders (18) by at least one pressure sensor (38) for each cylinder. The maximum pressure in the drive cylinders (18) is determined from the pressure signals and the supply pressure is adjusted by an electronic control unit (36) according to the maximum pressure.

Abstract: Systems and methods to test an electric power delivery system include a communication subsystem to transmit test signals to one or more merging units, a test subsystem to transmit a test data stream to the one or more merging units via the communication subsystem, and a processor subsystem to receive looped back data from the one or more merging unit in response to the transmitted test data stream and to determine an operating condition based on the looped back data.

Abstract: Twin poppet mechanism (100) of a valve positioner (101) with progressively reduced leakage, comprising a poppet valve assembly (150) comprising a swivel assembly (110) and a pair of poppet valve assembly (150), a poppet assembly (320) of the poppet valve assembly (150) has a conical tilting freedom (103) around its axis of assembly (151), in a first stable state, the swivel assembly (110) tilts towards a first side (104A) and a rubbing or a lapping action is caused between the first sealing surface (241) and the outer sealing surface (332), and between an inner sealing surface (352) of the poppet body two (350) and the chamber sealing surface (316) of the guide chamber (301), in a second stable state, the swivel assembly (110) tilts towards a second side (104B) and the lapping action is caused between the second sealing surface (261) and the outer sealing surface (332), and between the inner sealing surface (352) of the poppet body two (350) and the chamber sealing surface (316) of the guide chamber (301).

Abstract: Methods of fabricating optical lenses and mirrors, systems and composite structures based on diffractive waveplates, and fields of application of said lenses and mirrors that include imaging systems, astronomy, displays, polarizers, optical communication and other areas of laser and photonics technology. Diffractive lenses and mirrors of shorter focal length and larger size, with more closely spaced grating lines, and with more exacting tolerances on the optical characteristics, can be fabricated than could be fabricated by previous methods.

Abstract: In a spherical lens surface processing method, a lens surface is ground to a spherical surface by forming a contact state in which a rotating cup-shaped grinding stone is placed in contact with the lens surface and a sphere center oscillation state in which the cup-shaped grinding stone oscillates along the lens surface centered on a sphere center. In the sphere center oscillation state, the distance from the center of the sphere center oscillation to the contact point of the cup-shaped grinding stone with the lens surface is set to be the same as the radius of the spherical surface. The oscillation width of the sphere center oscillation is set so that the contact point of the cup-shaped grinding store with the lens surface can move from one peripheral edge of the lens surface past the lens center on the lens surface to the other peripheral edge.

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.

Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.

Abstract: Electric power system voltage control and voltage stability may be calculated using energy packets. Sets of negative energy packet sets normalized by a set of positive and negative energy packet sets may be used for voltage control by adding or removing capacitive units. Energy packet voltage indicators may be calculated using energy packets, and used to determine voltage stability. Control actions may be taken depending on the determined voltage stability.

Abstract: A system for assisting a maneuver of a moving object is provided. The system includes a plurality of unmanned aerial vehicles, and a computing device comprising a controller configured to: identify a maneuver location of the moving object based on location information associated with the moving object, determine one or more unmanned aerial vehicles among the plurality of unmanned aerial vehicles based on a proximity of the maneuver location and the plurality of unmanned aerial vehicles, dispatch the one or more unmanned aerial vehicles to the maneuver location, and transmit an instruction signal to the one or more unmanned aerial vehicles, wherein the instruction signal causes the one or more unmanned aerial vehicles to generate an indication configured to assist one or more vehicles approaching the maneuver location.

Abstract: Disclosed herein are systems and methods for safe electric power delivery protection within a high-risk area while maintaining electric power availability in non-faulted areas. Fault signals from wireless sensors are used at a recloser to block reclosing onto a faulted high-risk zone. Fault signals from wireless sensors are used at a recloser to permit reclosing when the reclosing operation will not close onto a fault location within the high-risk zone. Portions of the power system may be selectively openable by sectionalizers. When a fault is reported by a wireless sensor as being on a portion of the power system selectively openable, a recloser may be permitted to attempt a reclose operation affecting the high-risk zone and the selectively openable portion.

Abstract: A semiconductor device package includes a carrier, an emitting element and a first package body. The carrier includes a first surface and a second surface opposite to the first surface. The emitting element is disposed on the first surface of the carrier. The first package body is disposed over the first surface of the carrier and spaced apart from the first surface of the carrier.

Abstract: Embodiments described herein generally relate to a canopy assembly. The canopy assembly includes a truck bed and a pair of retractable canopies. The truck bed includes a floor and a pair of spaced apart sidewalls. Each of the pair of sidewalls includes an exterior wall, an opposite interior wall, and an elongated cavity positioned between the exterior wall and the interior wall of each of the pair of sidewalls. The pair of retractable canopies are movable between a stored and use positions. In the stored position, each of the retractable canopies are positioned within the elongated cavity defined in each of the pair of sidewalls. In the use position, each of the pair of retractable canopies are positioned to extended at least partially outside of the elongated cavity of each of the pair of sidewalls and extend beyond the exterior wall of the sidewalls in a vehicle lateral direction.

Abstract: A substrate structure is disclosed. The substrate structure includes a carrier, a dielectric layer on the carrier, a patterned organic core layer in the dielectric layer, and a conductive via. The patterned organic core layer defines a passage extending in the dielectric layer towards the carrier. The conductive via extends through the passage towards the carrier without contacting the patterned organic core layer.

Abstract: A vehicle is provided including a bumper attachment member, a radiator support beam, and a bumper support assembly coupled to the bumper attachment member and the radiator support beam. The bumper support assembly includes a center stay fixed to the radiator support beam and a center stay support having a receiver, an arm, and an anti-rotation pin. The arm extends in a vehicle-longitudinal direction from the receiver. The receiver is configured to receive and engage the bumper attachment member. The anti-rotation pin extends in the vehicle-lateral direction proximate an end of the arm opposite the receiver and engages the center stay to inhibit movement of the bumper attachment member with respect to the radiator support beam.

Abstract: A semiconductor device package includes a first conductive structure, a stress buffering layer and a second conductive structure. The first conductive structure includes a substrate, at least one first electronic component embedded in the substrate, and a first circuit layer disposed on the substrate and electrically connected to the first electronic component. The first circuit layer includes a conductive wiring pattern. The stress buffering layer is disposed on the substrate. The conductive wiring pattern of the first circuit layer extends through the stress buffering layer. The second conductive structure is disposed on the stress buffering layer and the first circuit layer.

Abstract: A wiring structure and a method for manufacturing a wiring structure are provided. The wiring structure includes a first conductive structure, a second conductive structure, a dent structure and an adhesion layer. The first conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The second conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The dent structure is attached to the first conductive structure. The adhesion layer is interposed between the first conductive structure and the second conductive structure to bond the first conductive structure and the second conductive structure together. A periphery portion of the adhesion layer is disposed in a gap between the dent structure and the second conductive structure.

Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.

Abstract: A package structure and a testing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The wiring structure includes at least one dielectric layer, at least one conductive circuit layer in contact with the dielectric layer, and at least one test circuit structure in contact with the dielectric layer. The test circuit structure is disposed adjacent to the interconnection portion of the conductive circuit layer. The first electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the interconnection portion of the conductive circuit layer.