Abstract: Catalysts including multi-transition metal doped copper-cobalt spinel mixed oxide catalyst materials for direct NOx decomposition with selectivity to N2 from combustion engine exhaust, while minimizing formation of the N2O product. In one example, the catalyst may include a ternary zinc-doped copper-cobalt spinel material or a quaternary manganese+zinc doped copper-cobalt spinel material. The catalysts are effective for reducing NO to N2 at suitable temperatures of 350-500° C., with and without excess O2 presence.

Abstract: Systems and methods to isolate faults and restore power are described herein. For example, an intelligent electronic device (IED) may receive a blocking signal indicating a fault is detected on a power line. The IED may obtain one or more current measurements of the power line. The IED may determine that a fault is not present on the power line at the IED based on the one or more current measurements. The IED may trip a first current interruption device of the IED The IED may send a close permissive signal to another IED indicating that the other IED is permitted to permitted to close an open current interruption device of the other IED to restore power to one or more loads.

Abstract: The present disclosure pertains to devices, systems, and methods for monitoring an electric power system. In one embodiment, a system may detect a failure in an electric power system. The system may include a communication interface to receive a first indication related to a condition in the electric power system, and a second indication related to the condition. The system may also include a test subsystem to compare the first indication to the second indication and to determine a discrepancy between the first indication and the second indication. A diagnostic subsystem may identify the failure based on the discrepancy between the first indication and the second indication. An alert subsystem may generate an alert based on the failure.

Abstract: A system, method, and device for cloud forensics and incident response is provided. In an embodiment, a computer-implemented method for performing cloud forensics and incident response includes intercepting, by a cloud incident response module (CIRM), communication between a virtual machine (VM) and a hypervisor. The method also includes extracting, by the CIRM, data from the communication between the VM and the hypervisor according to a forensic policy. Intercepting and extracting the data are transparent to the VM and to the hypervisor. Intercepting and extracting the data are independent of the VM and the hypervisor.

Abstract: Systems and methods are provided for presenting personalized information to one or more vehicle occupants as a vehicle approaches and/or passes a road sign. Characteristics of a vehicle, e.g., operating conditions, characteristics of the one or more vehicle occupants, e.g., age, demographic, driving record, purchase history, etc. and/or road conditions, e.g., weather-related road conditions, current traffic conditions, etc., may be obtained. Information relevant to the one or more vehicle occupants based on one or more of these characteristics/conditions may presented to the one or more vehicle occupants. In scenarios where the presentation of personalized information is unwanted/unwarranted, more generalized information and/or safety warnings or recommendations can be presented.

Abstract: Systems and methods for detecting an anomaly in a power semiconductor device are disclosed. A system includes a server computing device and one or more local components communicatively coupled to the server computing device. Each local component includes sensors positioned adjacent to the power semiconductor device for sensing properties thereof. Each local component receives data corresponding to one or more sensed properties of the power semiconductor device from the sensors and transmits the data to the server computing device. The server computing device utilizes the data, via a machine learning algorithm, to generate a set of eigenvalues and associated eigenvectors and select a selected set of eigenvalues and associated eigenvectors. Each local component conducts a statistical analysis of the selected set of eigenvalues and associated eigenvectors to determine that the data is indicative of the anomaly.

Abstract: The present disclosure relates to systems and methods for creating a data tunnel to communicate test data in a test configuration in an electric power system. In one embodiment, a remote unit may include a monitored equipment interface to receive information representative of a condition in the electric power system from a test set and a first test data port to communicate test data through the data tunnel in the test configuration. The remote unit may use a first communication subsystem to generate and transmit a stream of data packets comprising information from the monitored equipment interface and information from the first test data port to be routed through the data tunnel. A protection system may receive the stream of data packets from the first communication subsystem and separate information from the monitored equipment interface and information from the test data routed through the data tunnel.

Abstract: The present disclosure relates to controlling a capacitor bank using current measurements from different current sensors depending on the power flow direction. For example, the system may perform capacitor bank control operations using current measurements from a first current sensor coupled to the power line between an initial source and the capacitor bank when power is flowing in a first power flow direction on the power line. The system may determine that power flow on the power line has changed from flowing in the first power flow direction to flowing in a second power flow direction from an updated source, different from the initial source. The system may, upon detecting the change in the power flow direction perform control operations of the capacitor bank using current measurements from a second current sensor between an updated source and the capacitor bank.

Abstract: A method for automated detection of defects in a workpiece surface and generation of a robot program for the machining of the workpiece is described. In accordance with one embodiment, the method comprises the localization of defects in a surface of a workpiece as well as determining a three-dimensional topography of the localized defects and categorizing at least one localized defect based on its topography. Dependent on the defect category of the at least one defect, a machining process is selected and, in accordance with the selected machining process, a robot program for the robot-assisted machining of the at least one defect is generated with the assistance of a computer.

Abstract: Processes are provided for preparing molecular sieves for use as catalysts. The process involves preparing a synthesis mixture for the molecular sieve wherein the synthesis mixture includes a morphology modifier which may be selected from cationic surfactants having a single quaternary ammonium group comprising at least one hydrocarbyl group having at least 12 carbon atoms, nonionic surfactants, anionic surfactants, sugars, and combinations thereof.

Abstract: An appliance lid hinge assembly includes a cam arm pivotally connected a base. A cam arm control system includes a spring rod adapted to move in a sliding reciprocal manner. A spring urges the spring rod toward an extended position. The spring rod is movable toward a retracted position. The cam arm is engaged with the spring rod through a cam follower such that: (i) pivoting movement of the cam arm in an opening direction corresponds with movement of the spring rod from the retracted position toward the extended position; and, (ii) pivoting movement of the cam arm in a closing direction opposite the opening direction corresponds with movement of the spring rod from the extended position toward the retracted position. An optional damper exerts a damping force on the spring rod or other part of the cam arm control system when the cam arm moves in a closing direction.

Abstract: Systems and methods including improving availability of protection of an electric power delivery system even upon unavailability of power system signals. Such protection relays may provide protection using signals from the power system and provide the signals to an integrator or another device. Upon unavailability of power system signals to a protection relay, the integrator sends substitute power system signals may be provided to the protection relay. The protection relay may continue to provide protection using the substitute power system signals.

Abstract: A polycarbonate resin composition for an optical component, the composition comprising 0.1 to 4 parts by mass of a polyalkylene glycol (B) and 0.005 to 0.5 parts by mass of a phosphorus-containing stabilizer (C) relative to 100 parts by mass of a polycarbonate resin (A), wherein the polyalkylene glycol (B) contains 40 to 80 mol % of a tetramethylene glycol unit (b1), 5 to 45 mol % of a (2-methyl)ethylene glycol unit (b2), and 5 to 50 mol % of an ethylene glycol unit (b3), and wherein at least two units selected from the tetramethylene glycol unit (b1), the (2-methyl)ethylene glycol unit (b2), and the ethylene glycol unit (b3) are contained as a copolymer component obtained by copolymerizing them.

Abstract: Methods of preparing organosilica materials using a starting material mixture comprising at least one compound of Formula [(RO)2SiCH2]3 (Ia) and at least one compound of Formula [R?ROSiCH2]3 (Ib), wherein each R? independently represents an RO—, an R group, or an (RO)3Si—CH2— group, at least one R? being (RO)3Si—CH2—; and R represents a C1-C4 alkyl group, in the absence of a structure directing agent and/or porogen are provided herein. Processes of using the organosilica materials, e.g., for gas separation, etc., are also provided herein.

Abstract: Sound absorption units for fluid ducts include two acoustically coupled pairs of Helmholtz resonators. The two resonators within each pair have identical resonance frequency, however the upstream resonator within each pair is partly filled with an acoustically lossy porous material, so that the upstream resonator within each pair has greater acoustic loss than its coupled downstream resonator. The upstream pair of resonators has a relatively low resonance frequency, while the downstream pair of resonators has a relatively high resonance frequency. The combination of frequency mismatch between the resonator pairs, and loss mismatch within each resonator pair, produces consistently high sound absorption across a broad frequency spectrum.

Abstract: The present invention provides a boom system 1 for breaking and manoeuvring oversize material. The boom system 1 is mounted or attached to a vehicle. The boom system 1 comprises a base 2, a column 5 protruding upwardly from the base 2 and a boom arm 3 moveably connectable to the upright column 5 at connection point 16. A moving arrangement 4 is provided to move all or part of the upright column 5 towards and away from the base 2 so that the connection 16 between the boom arm 3 and the upright column is moveable towards and away from the base 2. A mobile crusher comprising a boom system 1 for breaking and manoeuvring oversize material is also provided.

Abstract: Provided are a latch circuit and a flip-flop circuit each having more excellent tolerance to single event upset (SEU). The single event upset (SEU)-tolerant latch circuit of the present invention is configured such that three transistors for redundancy are added to each of eight transistors constituting a conventional DICE latch circuit, at respective positions consisting of a serial position, a parallel position and a parallel-serial position so as to form a four-transistor circuit in which a serially duplicated circuit is duplicated in parallel, and each of a first data input part and a second data input part is also made dually redundant.

Abstract: A method of forming a container, the method comprising the steps of: providing an injection moulded preform composed of a biaxially-orientable thermoplastic material, the preform being substantially planar and having a peripheral edge and a central portion; clamping at least a portion of the peripheral edge of the preform in a frame; heating the preform; stretch blow moulding the heated preform, clamped with the frame, within a mould cavity defined by a first female mould to form an intermediate article having a bottom wall and an annular sidewall beneath an upper edge clamped within the frame, the stretch blow moulding step using a stretch rod to engage an inner side of at least the central portion of the preform and axially to stretch at least a part of the central portion of the preform prior to blowing a pressurized gas against the inner side which urges the opposite side of the preform radially outwardly against the mould; and shrinking the intermediate article, clamped with the frame, onto a second male

Abstract: The present application provides a method and system for disposing wastewater effluent through laterals placed over a drain field without the need to level the terrain. The method provides calculating sizes of one or more orifices in positioned along the length of the laterals.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first substrate having a first surface and a second surface opposite to the first surface, an antenna module disposed on the first surface of the first substrate, an electronic component module disposed on the first surface of the first substrate, and a first package body encapsulating the antenna module and the electronic component module. The antenna module has a first surface facing the first surface of the first substrate, a second surface opposite to the first surface of the antenna module, and a lateral surface extending between the first surface of the antenna module and the second surface of the antenna module. The lateral surface of the antenna module faces the electronic component module. A method of manufacturing a semiconductor device package is also provided.