Abstract: A personalized tourniquet cuff assembly comprises a sterile tourniquet cuff, a machine-readable instrument symbol, machine-readable personalization data and a sterile connector. The instrument symbol identifies a predetermined first type of tourniquet instrument from a plurality of types of tourniquet instruments, and is adapted for contactless reading by an optical tourniquet interface of the first type of tourniquet instrument. The personalization data represents a value of a personalization parameter for safe operation of the tourniquet cuff with the first type of tourniquet instrument and is adapted for contactless reading by the optical tourniquet interface. The connector is adapted for releasably connecting the tourniquet cuff to the first type of tourniquet instrument.

Abstract: A package structure includes at least one electronic device, a protection layer and an encapsulant. The electronic device has a first surface and includes a plurality of bumps disposed adjacent to the first surface thereof. Each of the bumps has a first surface. The protection layer covers the bumps and the first surface of the electronic device, and has a first surface. The encapsulant covers the protection layer and at least a portion of the electronic device, and has a first surface. The first surfaces of the bumps, the first surface of the protection layer and the first surface of the encapsulant are substantially coplanar with each other.

Abstract: The powder drying system comprises a powder processing unit (1), and a filter unit (400) defining a central vertical axis (405) and including a filtering chamber (401) accommodating a plurality of bag filters (407), each having a bag filter wall and a top opening, a top portion (402), and an exhaust chamber (403) at or near the top portion (402). The filtering chamber (401) is provided with an inlet (410) configured to allow entry of powder carrying gas to be filtered, and the exhaust chamber (403) has an outlet (420) configured to allow exhaust of filtered gas. In the filtering chamber (401), gas flows through the wall of the bag filters (407), upwards and out through the top opening of the bag filters (407), into the exhaust chamber (403) and further to the outlet (420).

Abstract: Systems and methods for detecting a failover capability of a network device of a computer network are disclosed. A network controller, upon detecting incoming traffic from a network device, can disable the port of the network where the incoming traffic is detected. The network controller can then detect if the network device has failed over to send network traffic to the network via another port of the network, or determine the network device is incapable of failover communication if network traffic from the network device only arrives at the original port after that port is re-enabled.

Abstract: An adapter for a tactile display is disclosed. The adapter can be used with a tactile display, such as a display that presents braille characters, to change or modify what is presented to a user. In some embodiments, the braille dots which make up a braille character can be made smaller or larger; spaced closer together or further apart; have a different shape; and/or an image or non-braille characters can be presented to a user of the tactile display using the disclosed adapter.

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

Abstract: A semiconductor package includes a semiconductor die having a first surface and a second surface opposite to the first surface, a conductive wiring layer stacked with the semiconductor die and proximal to the first surface, an encapsulant encapsulating the semiconductor die and stacked with the conductive wiring layer, and a replacement structure exposing from the encapsulant and being free of fillers. A method for manufacturing the semiconductor package is also disclosed in the present disclosure.

Abstract: A method and apparatus for separating production fluids using a system designed to minimize the heating requirements through thermodynamic efficiency and reduce equipment costs.

Abstract: Catalyst material comprising a ternary spinel mixed oxide for treatment of an exhaust gas stream via direct decomposition removal of NOx to N2 and O2. The low temperature (from about 400° C. to about 650° C.), direct decomposition is accomplished without the need of a reductant molecule. In one example, Mn may be incorporated into metal oxide, such as CuyCo3-yO4 spinel oxide, synthesized using co-precipitation techniques.

Abstract: A hinge assembly for an associated appliance door includes an arm and a lever pivotally connected to the arm. The lever and arm are adapted to pivot relative to each other about a main pivot axis between a first position that corresponds to a closed position of the associated appliance door and a second position that corresponds to an opened position of the associated appliance door. A slide link is located adjacent the lever. A damper engagement structure is connected to the slide link. A biasing system urges the arm and lever toward the first position. A damper system includes a damper that damps pivoting movement between the arm and the lever for at least part of the movement between the arm and the lever when the arm and lever pivot relative to each other from the first position toward the second position.

Abstract: An intelligent electronic device (IED) may monitor wet stack residue buildup of a diesel engine. Once the wet stack residue accumulates to a certain amount, the IED may perform a mitigation procedure. Additionally, tracking wet stack residue buildup may allow an IED to attempt to prevent or reduce accumulation of the wet stack residue. The IED may track an operating power level of the diesel engine to estimate the rate of residue buildup.

Abstract: A semiconductor device package includes a redistribution layer, a plurality of conductive pillars, a reinforcing layer and an encapsulant. The conductive pillars are in direct contact with the first redistribution layer. The reinforcing layer surrounds a lateral surface of the conductive pillars. The encapsulant encapsulates the first redistribution layer and the reinforcing layer. The conductive pillars are separated from each other by the reinforcing layer.

Abstract: A semiconductor device package includes a substrate, an electronic component disposed on the substrate, a supporting structure disposed on the substrate and surrounding the electronic component, and a heat spreading structure disposed on the supporting structure. A length of the supporting structure and a length of the heat spreading structure are greater than a length of the substrate.

Abstract: A semiconductor device package and a method for manufacturing the same are provided. The semiconductor device package includes a circuit layer and an antenna module. The circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface. The lateral surface extends between the first surface and the second surface. The circuit layer has an interconnection structure. The antenna module has an antenna pattern layer and is disposed on the first surface of the circuit layer. The lateral surface of the circuit layer is substantially coplanar with a lateral surface of the antenna module.

Abstract: A semiconductor device package includes a substrate and an interposer. A bottom surface of the interposer is attached to a top surface of the substrate by a conductive adhesive layer including a spacer.

Abstract: A semiconductor device package includes an electronic component. The electronic component has an active surface, a back surface opposite to the active surface, and a lateral surface connected between the active surface and the back surface. The electronic component has an electrical contact disposed on the active surface. The semiconductor device package also includes a redistribution layer (RDL) contacting the back surface of the electronic component, a first dielectric layer surrounding the electrical contact on the active surface of the electronic component, and a second dielectric layer surrounding the lateral surface of the electronic component and the first dielectric layer. The second dielectric layer has a first sidewall in contact with the lateral surface of the electronic component and a second sidewall opposite to the first sidewall. The second sidewall of the second dielectric layer has a first portion proximal to the RDL and a second portion distal from the RDL.

Abstract: A vehicle seat longitudinal adjuster (2) includes two guide rail pairs (P1, P2) with a first guide rail (3) and a second guide rail (4) movable with respect to the first guide rail, a motor unit (12), a gear unit (G) with a gear rotary shaft (6) connected to the first guide rail and a rotatable gear element (7). A transmission unit (11) is coupled with the gear unit and the motor unit to transmit torque to the gear rotary shaft. A gearbox (9) receives the gear unit. A support (5) receives the gearbox inside a gap (BR) formed between the guide rails and passes through a second rail opening (13) and extends out of the guide rail opening and closes the second rail opening. A vehicle seat (1), has the longitudinal adjuster for mechanically and longitudinally adjusting the vehicle seat.

Abstract: Provided is a three-dimensional (3D) capacitor including conductors formed at a high density inside holes of an anodic oxide film, and a first electrode layer and a second electrode layer electrically connected to the conductors. Thus, a high capacitance relative to a size of the 3D capacitor may be easily achieved.