Patents Assigned to Engineering
  • Patent number: 10996541
    Abstract: A display includes a plurality of elongated waveguides positioned adjacent to each other and extending along a first direction, a plurality of elongated upper electrodes positioned adjacent to each other on a first side of the waveguides and extending along the first direction, and a plurality of elongated lower electrodes positioned adjacent to each other on a second side of the waveguides opposite the first side and extending along a second direction transverse to the first direction. At least one of the waveguides comprises nonlinear materials having a third order susceptibility.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: May 4, 2021
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Sean P. Rodrigues, Ercan M. Dede
  • Patent number: 10997513
    Abstract: The present disclosure is directed to a decision support system or tool based on a Bayesian Network (BN) framework. The diagnostic support tool is created by using advanced Probabilistic Risk Assessment (PRA) method(s) to construct Bayesian Networks (BNs) that form a Bayesian Decision Support Process (BDSP) to provide science-based decision support for understanding and managing events in complex systems. In an embodiment, the PRA method(s) may include Discrete Dynamic Event Trees (DDETs) and simulations.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: May 4, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Katrina Groth, Matthew R. Denman
  • Patent number: 10994671
    Abstract: A vehicle includes a roof assembly including a roof panel. A headliner is located interior of the roof panel. An overhead console assembly is connected to the headliner. An overhead console wire bracket includes a longitudinal portion that extends in a vehicle longitudinal direction from the overhead console assembly toward a front edge of the headliner and a lateral portion that extends from the longitudinal portion in a vehicle lateral direction. The lateral portion engages a wire that extends over the front edge of the headliner.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: May 4, 2021
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Logan R. Astrike
  • Patent number: 10998639
    Abstract: A metallic component including a metallic material and having a skin depth ? of greater than or equal to 1.0 ?m in a frequency range from 20-40 GHz, as calculated by: ? = 2 ? ? ( 2 ? ? ? ? f ) ? ( ? 0 ? ? r ) ? 5 ? 0 ? 3 ? ? ? r ? f . In this equation, ? is skin depth in meters (m); ? is resistivity in ohm meter (?·m); f is frequency of an electromagnetic radiation in hertz (Hz); ?0 is permeability; and ?r is relative permeability of the metallic material. The metallic component may be a discrete metallic particle or a layer in a multilayer thin film.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: May 4, 2021
    Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventors: Debasish Banerjee, Songtao Wu, Naohide Uchida, Takeshi Yamakawa, Hidetaka Asano
  • Patent number: 10996000
    Abstract: An absorption cycle based system is disclosed for using waste heat from a vehicle and providing selective heating, cooling, and dehumidifying to a vehicle compartment. The system includes a waste heat loop in thermal communication with a power generating unit of the vehicle, and a vapor absorption subsystem. The vapor absorption subsystem may include a thermal compressor in thermal communication with the waste heat loop, a radiator unit, a condensing unit for heating the vehicle compartment, an evaporating unit for selectively cooling and dehumidifying the vehicle compartment, and a plurality of valves configured to selectively direct refrigerant through the vapor absorption subsystem. The vehicle compartment may include at least one of a passenger cabin, an electronics housing, a battery pack, an engine compartment, and a refrigeration compartment.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: May 4, 2021
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Feng Zhou, Douglas G. Thorpe, Ercan Mehmet Dede
  • Patent number: 10998638
    Abstract: A metallic component including NiCr and having a skin depth ? of greater than or equal to 1.0 ?m in a frequency range from 20-40 GHz, as calculated by: ? = 2 ? ? ? ( 2 ? ? ? ? ? f ) ? ( ? 0 ? ? r ) ? 503 ? ? ? ? r ? f . In this equation, ? is skin depth in meters (m); ? is resistivity in ohm meter (?·m); f is frequency of an electromagnetic radiation in hertz (Hz); ?0 is permeability; and ?r is relative permeability of the NiCr metallic material. The metallic component may be a discrete metallic particle or a layer in a multilayer thin film.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: May 4, 2021
    Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventors: Debasish Banerjee, Songtao Wu, Naohide Uchida, Takeshi Yamakawa, Hidetaka Asano
  • Patent number: 10995352
    Abstract: The present disclosure relates to glycolipid compositions, methods for making glycolipid compositions, and their uses thereof. Glycolipid compositions can be prepared via yeast-mediated catalyzed reaction, and exhibit excellent surfactant properties having high corrosion inhibition performance, good reducing surface tension efficiency. Processes of the present disclosure can provide glycolipid compositions having one or more of: a ratio of lactonic glycolipids to glycolipid acylic esters is from about 1:10 to about 10:1, a molecular weight of from about 400 g/mol to about 10,000 g/mol, a corrosion rate of carbon steel from about 0.5 MPY to about 100 MPY at room temperature and at pH 4-6. Furthermore, aqueous solutions of the glycolipid compositions of the present disclosure can have a surface tension of from about 20 mN/m to about 80 mN/m.
    Type: Grant
    Filed: May 9, 2020
    Date of Patent: May 4, 2021
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Partha Nandi, Xiaozhou Zhang, Mohor Chatterjee, Vera Grankina, Changyub Paek, Fang Cao
  • Patent number: 10996036
    Abstract: A self-separating sabot-projectile assembly with a positive engaging attachment to eliminate rotational slippage between the sabot and projectile. The torque transmitting interface between the sabot and projectile consists of a geometric shaped depression in the rearward end surface of the projectile which mates with a matched projection of the sabot. The sabot projection is hollowed out to allow the charge pressure to aid in the engagement of the sabot and projectile.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: May 4, 2021
    Assignee: Quality Engineered Polymer Products Inc.
    Inventor: Marc Arthur Brookman
  • Patent number: 10994971
    Abstract: A crane, a method for assembly of a crane and a method for disassembly of a crane are disclosed. In accordance with the method, a first mast is fixed in a vertical position. A top mast section of a second mast is positioned adjacent to and outside of the first mast. The top mast section is moved vertically upwards, and this movement is guided by a guide system. Then, the top mast section is fixed relative to the first mast at a position which is at a larger vertical distance from the crane base. Then, a first intermediate mast section of the second mast is fixed to a lower end of the top mast section to build up the second mast. Then, the first intermediate mast section is connected to a pivot, and the second mast is pivoted away from the first mast.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: May 4, 2021
    Assignee: Mammoet Engineering B.V.
    Inventors: Anton Adrian Joachim Van Den Broek, Wessel Helmens, Pieter Maria Stoof
  • Patent number: 10993665
    Abstract: Embodiments of neural interfaces according to the present invention comprise sensor modules for sensing environmental attributes beyond the natural sensory capability of a subject, and communicating the attributes wirelessly to an external (ex-vivo) portable module attached to the subject. The ex-vivo module encodes and communicates the attributes via a transcutaneous inductively coupled link to an internal (in-vivo) module implanted within the subject. The in-vivo module converts the attribute information into electrical neural stimuli that are delivered to a peripheral nerve bundle within the subject, via an implanted electrode. Methods and apparatus according to the invention incorporate implantable batteries to power the in-vivo module allowing for transcutaneous bidirectional communication of low voltage (e.g. on the order of 5 volts) encoded signals as stimuli commands and neural responses, in a robust, low-error rate, communication channel with minimal effects to the subjects' skin.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: May 4, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Stephen P. Buerger, Kenneth E. Wojciechowski, Roy H. Olsson, Deepesh K. Kholwadwala, David K. Novick
  • Patent number: 10994634
    Abstract: A motor vehicle seat floor slide rail includes a lower slide rail assembly (100), an upper slide rail assembly (200) and a gap elimination mechanism (230, 230?), with a shaft-provided gap elimination cam (231L, 231R), on an upper slide rail longitudinal end, having a rotation center (232a) axis perpendicular to an upper rail longitudinal direction. A locking window face (117L, 117R) has an aluminum slide rail (110) longitudinal gap elimination face (113L, 113R). A rail locked state has a cam face (2311L, 2311R) in contact with the gap elimination face to eliminate a Y and Z direction gap. In a rail unlocked state, a locking mechanism (240) drives the gap elimination cam, such that the cam face loses contact with the gap elimination face. The gap elimination cam moves in linkage with the locking mechanism, reducing sliding friction, and having the advantage of low sliding assistance motive power.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: May 4, 2021
    Assignee: Adient Engineering and IP GmbH
    Inventors: Jianglin Zhang, Jiang Honghui, He Longhui, Yedi Fan, Tao Huijia
  • Publication number: 20210126388
    Abstract: Systems for interfacing a printed circuit board assembly (PCBA) adapter module to a receiver housing are provided. The receiver housing may have a first interface mounted on the receiver housing via a first mount and the PCBA adapter module may have a second interface mounted on the adapter module via a second mount. One of the interfaces has a protruding feature that aligns the interfaces when matingly engaged, while the other interface has a centering hole opposite the protruding feature. The first centering hole is enlarged with respect to an axis of an insertion-angle plane such that the protruding feature substantially clears the centering hole without causing either interface to exceed a limit of free-play between that interface and its respective mount.
    Type: Application
    Filed: March 9, 2020
    Publication date: April 29, 2021
    Applicant: Schweitzer Engineering Laboratories, Inc.
    Inventor: Greg Alden Lloyd
  • Publication number: 20210126454
    Abstract: Systems and methods may be used to determine whether waveforms of at least two transmission lines are synchronous. More particularly, this disclosure relates to sensing operations that use signals received by a local relay and a remote relay to determine whether two waveforms on opposing ends (e.g., supply side and load side, local side and remote side) of a transmission line are synchronous with one another. A system may determine whether a first waveform is synchronous with a second waveform based at least in part on a comparison of delay between a representation of the first waveform and a representation of the second waveform. The system may actuate a device (e.g., close a circuit breaker) in response to determining the first waveform is synchronous with the second waveform.
    Type: Application
    Filed: October 23, 2019
    Publication date: April 29, 2021
    Applicant: Schweitzer Engineering Laboratories, Inc.
    Inventor: Ashish Upreti
  • Publication number: 20210125905
    Abstract: A wiring structure includes a semiconductor assembly, a conductive structure, an adhesion layer and at least one through via. The semiconductor assembly includes a reconstitution module and a redistribution structure. The reconstitution module includes a plurality of semiconductor elements and an encapsulant. The semiconductor elements are disposed side by side. The encapsulant bonds the semiconductor elements together. The redistribution structure is in direct contact with the reconstitution module. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The adhesion layer bonds the semiconductor assembly and the conductive structure together. The through via electrically connects the conductive structure and the redistribution structure of the semiconductor assembly.
    Type: Application
    Filed: October 24, 2019
    Publication date: April 29, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen Hung HUANG
  • Publication number: 20210125909
    Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
    Type: Application
    Filed: January 4, 2021
    Publication date: April 29, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Chen Yuang CHEN
  • Publication number: 20210127242
    Abstract: Apparatuses, systems, and methods to identify a first communication transmitted based on a first communication identifier that identifies a first vehicle. The first communication originates from a second vehicle that includes a code associated with a second communication identifier that identifies the second vehicle. The technology identifies based on the first communication, a third communication identifier that identifies a third vehicle. The technology causes a second communication to be transmitted based on the third communication identifier.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 29, 2021
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ethan Pomish, Danil Prokhorov
  • Publication number: 20210121063
    Abstract: A large field-of-view adaptive optics retinal imaging system and method with common optical path beam scanning, the system comprises: a light source module (1), an adaptive optics module (2), a beam scanning module (3), a defocus compensation module (4), a sight beacon module (6), a pupil monitoring module (7), a detection module (8), a control module (9) and an output module (10). The beam scanning module is configured in different scanning modes for carrying out different scanning imaging functions including a large field-of-view imaging function, a small field-of-view high-resolution imaging function and a large field-of-view high-resolution imaging function. The system is simple in structure, and the common optical path structure can obtain three types of retinal imaging images, which meets the requirements of different application scenarios and improves the application range of retinal imaging.
    Type: Application
    Filed: October 23, 2019
    Publication date: April 29, 2021
    Applicant: Suzhou Institute of Biomedical Engineering and Technology, Chinese Academy of Sciences
    Inventors: Guohua SHI, Yi HE, Feng GAO, Wen KONG, Lina XING, Wanyue LI, Xin ZHANG, Jing WANG
  • Publication number: 20210126425
    Abstract: An optoelectronic package includes a substrate having a first surface and a second surface opposite to the first surface, an optoelectronic device on the first surface of the substrate, and a first conductive through via connecting the first surface and the second surface of the substrate. The optoelectronic device is electrically connected to the first conductive through via. A method for manufacturing the optoelectronic package is also provided.
    Type: Application
    Filed: October 24, 2019
    Publication date: April 29, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang-Yu LIN, Chi-Han CHEN, Pei-Jung YANG
  • Publication number: 20210122011
    Abstract: A magnetic clamping device is provided with a magnetic force generating mechanism at which a housing cover body comprising soft magnetic material is arranged centrally at a hollow housing portion, a nonmagnetic metal frame body comprising a nonmagnetic body is made to engage with the outside circumference thereof, a plurality of arcuate nonreversible permanent magnets are arranged in annular fashion within an annular magnet housing space at the back of this nonmagnetic metal frame body, a reversible permanent magnet and a magnetic polarity switching coil disposed peripherally with respect thereto are provided at the back of the housing cover body, and a base cover body that blocks a back opening of the hollow housing portion is provided, the magnetic clamping device being characterized in that the metal frame body is joined in integral fashion to the housing cover body and the baseplate.
    Type: Application
    Filed: June 12, 2019
    Publication date: April 29, 2021
    Applicant: Pascal Engineering Corporation
    Inventors: Ichiro Kitaura, Taichiro Kitaura, Hiroo Hashimoto
  • Publication number: 20210125946
    Abstract: An electronic device package includes a redistribution layer and a conductive substrate. The RDL includes a first surface. The conductive substrate is disposed on the first surface and electrically connected to the RDL. A circuit density of the RDL is higher than a circuit density of the conductive substrate, and an edge of the RDL laterally protrudes out from a respective edge of the conductive substrate.
    Type: Application
    Filed: October 24, 2019
    Publication date: April 29, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen Hung HUANG