Patents Assigned to Engineering
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200402879
    Abstract: A semiconductor package structure includes a substrate; a first die on the substrate, wherein an active surface of the first die is facing away from the substrate; a second die on the active surface of the first die, electrically connected to the first die through a plurality of conductive terminals; and a sealing structure on the active surface of the first die, surrounding the plurality of conductive terminals and abutting the second die thereby forming a cavity between the first die and the second die. A method for manufacturing the semiconductor package structure is also provided.
    Type: Application
    Filed: June 21, 2019
    Publication date: December 24, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Hui-Chung LIU
  • AUTOMATIC CONTROL PANEL FOR VULCANIZING PRESS AND METHOD OF USING THEREOF
    Publication number: 20200400213
    Abstract: An automatic control unit for field vulcanizing press is provided. The control unit helps to monitor and control all three essential vulcanizing parameters viz. temperature, pressure and time, either locally or through remote access. Data logging, local monitoring & control of vulcanizing parameters or remote monitoring and control of vulcanizing parameters using a smart device are the major features of this control unit in which remote monitoring and control of vulcanizing parameters is the unique feature of this control unit. A video recording unit is also provided to record entire splicing operation and also there is option for online video streaming facility and it will help to monitor the entire splicing operation from a remote-control station.
    Type: Application
    Filed: August 29, 2018
    Publication date: December 24, 2020
    Applicant: Thejo Engineering Limited
    Inventors: Manoj Joseph KALLARACKAL, Jaimon JACOB, Manimaran ELUMALAI, Sabu MATHEW
  • INTERLOCKING PART TRANSFER CASSETTES
    Publication number: 20200399068
    Abstract: A transfer cassette including a base plate, an interlock assembly, a securement plate, and a plate tab. The interlock assembly is arranged on a first edge of the base plate and includes a support arranged on the base plate and a locking finger rotatably arranged on the support. The securement plate is arranged on a second edge of the base plate, opposite the first edge. The plate tab is partially secured to and extending from the base plate.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 24, 2020
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Randy L. Pfeiffer
  • SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20200402911
    Abstract: A semiconductor device package includes a first substrate, a second substrate disposed over the first substrate, and a surface mount device (SMD) component disposed between the first substrate and the second substrate. The SMD component includes a plurality of connection electrodes electrically connecting the first substrate to the second substrate, and the plurality of connection electrodes are electrically disconnected from each other.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 24, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang-Lin YEH, Jen-Chieh KAO
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200403305
    Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.
    Type: Application
    Filed: June 21, 2019
    Publication date: December 24, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
  • WIND SCOOP CHARGING SYSTEM
    Publication number: 20200398677
    Abstract: A system and methods are provided for a wind scoop charging system for recharging onboard batteries during operation of an electrically powered vehicle. The wind scoop charging system comprises a wind scoop configured to be coupled with a hood of the vehicle. One or more air inlets are disposed in the wind scoop to receive an airstream during forward motion of the vehicle. A wind turbine is disposed within the wind scoop and rearward of the air inlet. The wind turbine is configured to produce an electric current upon being turned by the airstream. A power cable is configured to direct the electric current from the wind turbine to one or more electronic devices that are configured to utilize the electric current. The electronic devices may include any of an onboard battery for powering the vehicle, mobile phones or smart phones, portable music players, tablet computers, cameras, and the like.
    Type: Application
    Filed: June 18, 2020
    Publication date: December 24, 2020
    Applicant: K&N Engineering, Inc.
    Inventors: Jonathan Richard Fiello, Steve Williams
  • GAS PURIFICATION DEVICE
    Publication number: 20200399548
    Abstract: A gas purification device removes a part of ammonia contained in a first gas; recovers a first off-gas containing the removed ammonia, removes hydrogen sulfide and ammonia from a second gas produced by removing the part of ammonia, recovers a second off-gas containing the removed hydrogen sulfide and ammonia, and combusts the first off-gas and the second off-gas. The gas purification device includes: a first combustion chamber in which combustion is performed in a reducing atmosphere; a second combustion chamber in which combustion is performed in a reducing atmosphere downstream of the first combustion chamber; and a third combustion chamber in which combustion is performed in an oxidizing atmosphere downstream of the second combustion chamber. The first off-gas flows into the first combustion chamber and the second off-gas flows into the third combustion chamber.
    Type: Application
    Filed: March 5, 2019
    Publication date: December 24, 2020
    Applicant: Mitsubishi Heavy Industries Engineering, Ltd.
    Inventors: Kaori Yoshida, Ayumu Yamazaki, Rikio Kan, Seiji Kakesako
  • Molecular tracers and modified proppants for monitoring underground fluid flows
    Patent number: 10871066
    Abstract: The present invention relates to modified proppants and methods of using the modified proppants that use metal ligand tracers to characterize subterranean fluid flow. The metal and ligands are best chosen to be a strongly-coordinating, chelating ligand with a functional group for the chosen flow environment.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: December 22, 2020
    Assignees: National Technology & Engineering Solutions of Sandia, LLC, STC.UNM
    Inventors: Richard A. Kemp, Timothy J. Boyle
  • Centralizer for downhole probes
    Patent number: 10871041
    Abstract: An assembly for use in subsurface drilling includes a downhole probe supported by a centralizer. The centralizer comprises a tubular member that extends around the downhole probe. A wall of the centralizer is fluted to provide inward contact points that support the downhole probe and outward contact points that bear against a bore wall of a section of drill string. The downhole probe may be supported for substantially its entire length.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: December 22, 2020
    Assignee: Evolution Engineering Inc.
    Inventors: Aaron W. Logan, Justin C. Logan, Patrick R. Derkacz
  • Manually-initiated synchronization apparatuses for connecting independently-driven platforms to conveying platforms for movement therewith
    Patent number: 10870542
    Abstract: An independently-driven platform used in vehicle assembly includes a side frame and a manually-initiated synchronizing apparatus mounted to the side frame. The manually-initiated synchronizing apparatus includes a linear actuator including a cylinder portion mounted to the side frame and a rod portion that extends and retracts from the cylinder portion. A conveying platform engagement member has a front that faces a conveying direction when synchronizing with a synchronization tab of a conveying platform, a rear that faces an upstream direction and a top connected to the rod portion of the manually-initiated synchronizing apparatus. The conveying platform engagement member has a notch in the rear that is configured to engage the synchronization tab.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: December 22, 2020
    Assignees: Toyota Motor Engineering & Manufacturing, North America, Inc.
    Inventors: Ronald Scott Friend, Brian McElroy, Robert Aaron Allex
  • Hydroprocessing of catalytic slurry oil and coker bottoms
    Patent number: 10870806
    Abstract: Systems and methods are provided for upgrading a mixture of catalytic slurry oil and coker bottoms by hydroprocessing. Optionally, the upgrading can further include deasphalting the mixture of catalytic slurry oil and coker bottoms to form a deasphalted oil and a deasphalter residue or rock fraction. The mixture of catalytic slurry oil and coker bottoms and/or the deasphalted oil can then be hydroprocessed to form an upgraded effluent that includes fuels boiling range products. Optionally, in some aspects where the feed mixture is deasphalted prior to hydroprocessing, the feed mixture can further include a portion of a (sour) vacuum resid.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: December 22, 2020
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Stephen H. Brown, Brian A. Cunningham, Randolph J. Smiley, Samia Ilias, Brenda A. Raich, Tien V. Le
  • Material melting device
    Patent number: 10870149
    Abstract: A material melting device (10) for melting a work material, and discharge of the melted work material, is described. The material melting device (10) comprises a cold part (12) and a hot part (30), and a work material duct (22) for supplying said work material. The work material duct (22) extends at least partially through the cold part (12) to a melting chamber (33) arranged in the hot part (30). The hot part (30) comprises a nozzle duct (34) extending from the melting chamber (33) to a nozzle opening (35) such that melted work material can be flowed from the melting chamber (33) and discharged from the nozzle opening (35). The melting chamber (33) has a cross-sectional area which is larger than the cross-sectional area of the work material duct (22).
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: December 22, 2020
    Assignee: Marna Engineering AS
    Inventor: Daniel Oftedal
  • Low resistance, multivalent metal anodes
    Patent number: 10873079
    Abstract: A low resistance multivalent metal anode is provided. The metal is present in the anode as a Riecke highly active particle. Anode resistivity of 1000 ?·cm2 or lower can be obtained. Metals employed include magnesium, calcium, zinc and aluminum. Electrochemical cells containing the low resistance multivalent metal anodes are also provided.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: December 22, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Claudiu B. Bucur, John G. Muldoon
  • Method and apparatus for forming high strength products
    Patent number: 10870230
    Abstract: A system and method are presented in which a flow of plastic is extruded to obtain nano-sized features by forming multiple laminated flow streams, flowing in parallel through the non-rotating extrusion system. Each of the parallel laminated flow streams are subjected to repeated steps in which the flows are compressed, divided, and overlapped to amplify the number of laminations. The parallel amplified laminated flows are rejoined to form a combined laminated output with nano-sized features. The die exit is formed to provide a tubular shape.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: December 22, 2020
    Assignee: Guill Tool & Engineering Co., Inc.
    Inventors: Richard Roy Guillemette, Robert Peters, Christopher J Hummel
  • Endoscopic systems, devices, and methods
    Patent number: 10869593
    Abstract: Example embodiments relate to endoscopic systems. Endoscopic system includes main body and control section. Control section includes extendible section that extends and contracts to change length between extendible section ends. Control section includes first expandable member. When first expandable member is in an expanded configuration, first expandable member includes proximal side wall and distal side wall. Distal side wall of first expandable member includes first protrusions. Control section includes second expandable member. When second expandable member is in an expanded configuration, second expandable member includes distal side wall and proximal side wall. Proximal side wall of second expandable member includes second protrusions. First and second protrusions configurable to cooperate to form a sieve portion between first and second expandable members.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: December 22, 2020
    Assignee: Bio-Medical Engineering (HK) Limited
    Inventors: Chung-Kwong Yeung, Wing Fai Lam
  • THERMOLYSIN FOR EASY-CLEANING OF INSECT BODY STAINS
    Publication number: 20200392432
    Abstract: A substrate or coating is provided that includes a protease with enzymatic activity toward a component of a biological stain. Also provided is a process for facilitating the removal of a biological stain is provided wherein an inventive substrate or coating including a protease is capable of enzymatically degrading of one or more components of the biological stain to facilitate biological stain removal from the substrate or said coating.
    Type: Application
    Filed: July 20, 2020
    Publication date: December 17, 2020
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Motor Corporation
    Inventors: Songtao Wu, Hongfei Jia, Masahiko Ishii, Minjuan Zhang
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200395327
    Abstract: A semiconductor package structure includes a semiconductor die having an active surface, a conductive bump electrically coupled to the active surface, and a dielectric layer surrounding the conductive bump. The conductive bump and the dielectric layer form a planar surface at a distal end of the conductive bump with respect to the active surface. The distal end of the conductive bump is wider than a proximal end of the conductive bump with respect to the active surface.
    Type: Application
    Filed: June 17, 2019
    Publication date: December 17, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200395261
    Abstract: A semiconductor package structure includes a first semiconductor die, an encapsulant surrounding the first semiconductor die, and a redistribution layer (RDL) electrically coupled to the first semiconductor die. The encapsulant has a first surface over the first semiconductor die and a second surface under the first semiconductor die. The RDL has a first portion under the first surface of the encapsulant and a second portion over the first surface of the encapsulant.
    Type: Application
    Filed: June 17, 2019
    Publication date: December 17, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200395275
    Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.
    Type: Application
    Filed: June 14, 2019
    Publication date: December 17, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuang-Hsiung CHEN, Chih-Hung HSU, Mei-Lin HSIEH, Yi-Cheng HSU, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU
  • 3D printer hotend
    Patent number: D905768
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: December 22, 2020
    Assignee: Slice Engineering LLC
    Inventor: Christopher Mark Montgomery