Abstract: A clip assembly includes a mating component that includes including a mating opening. The clip assembly may also include an attachment component that includes a base wall, a clip body, a pair of sidewalls, an end wall, and a base aperture formed in the base wall. The end walls extend between the pair of sidewalls such that the pair of sidewalls and the end wall at least partially bound the base aperture. The clip body connects with the pair of sidewalls, and the clip body includes an engagement member configured to engage with the mating opening of the mating component to releasably couple the attachment component with the mating component.

Abstract: Systems and a method for manufacturing a base stock from a light gas stream are provided. An example method includes oxidizing the light gas stream to form a raw ethylene stream. Water is removed from the raw ethylene stream, and carbon monoxide in the raw ethylene stream is oxidized. Carbon dioxide is separated from the raw ethylene stream, and the raw ethylene stream is oligomerized to form a raw oligomer stream. A light olefinic stream is distilled from the raw oligomer stream and a light alpha olefin is recovered from the light olefinic stream. A heavy olefinic stream is distilled from the raw oligomer stream. The heavy olefinic stream is hydro-processed to form a hydro-processed stream. the hydro-processed stream is distilled to form the base stock.

Abstract: Methods, systems, and techniques for determining whether an acoustic event has occurred along a fluid conduit having acoustic sensors positioned therealong. The method uses a processor to, for each of the sensors, determine a predicted acoustic signal using one or more past acoustic signals measured prior to measuring a measured acoustic signal using the sensor; determine a prediction error between the measured acoustic signal and the predicted acoustic signal; from the prediction error, determine a power estimate of an acoustic source located along a longitudinal segment of the fluid conduit overlapping the sensor; and determine whether the power estimate of the acoustic source exceeds an event threshold for the sensor. When the power estimate of at least one of the acoustic sources exceeds the event threshold, the processor attributes the acoustic event to one of the sensors for which the power estimate of the acoustic source exceeds the event threshold.

Abstract: An insert for connecting first and second parts each having holes, the insert having a cylindrical sleeve and a core. The cylindrical sleeve having a central void and an outer diameter sized to fit into the hole in the first part. The central void having a uniform diameter across a length of the cylindrical sleeve. The core having a through-hole and a tapered outer wall such that when the core is pulled into the cylindrical sleeve, the cylindrical sleeve expands against the hole of the first part to secure the insert to the first part. The through-hole of the core having a threaded portion at a first end of the core to engage with a threaded fastener to secure the second part to the first part. The first end of the core is press-fit into the cylindrical sleeve.

Abstract: Systems and a method for manufacturing a base stock from a hydrocarbon stream are provided. An example method includes cracking the hydrocarbon stream to form a raw hydrocarbon stream, separating an ethylene stream from the raw hydrocarbon stream and oligomerizing the ethylene stream to form a raw oligomer stream. A light olefinic stream is distilled from the raw oligomer stream and linear alpha olefins are recovered from the light olefinic stream. A heavy olefinic stream is distilled from the raw oligomer stream. The heavy olefinic stream is hydro-processed to form a hydro-processed stream. The hydro-processed stream is distilled to form the base stock.

Abstract: A vessel includes a heat exchanger for heat-exchanging compressed boil-off gas (hereinafter, referred to as “first fluid”) by using, as a refrigerant, the boil-off gas discharged from a storage tank, to cool the same; a main compression part for compressing a part of the boil-off gas discharged from the storage tank; a rest compression part provided in parallel to the main compression part so as to compress the other part of the boil-off gas discharged from the storage tank; and a decompression device for expanding the first fluid having been cooled by exchanging heat with the boil-off gas, which is discharged from the storage tank, in the heat exchanger. The first fluid is a flow in which the boil-off gas compressed by the main compression part and the boil-off gas compressed by the rest compression part join; or the boil-off gas compressed by the main compression part.

Abstract: The present disclosure relates to a seat ventilation system for deployment in a seat of a vehicle. Specifically, the seat ventilation system includes a three-dimensional mesh for maintenance of airflow channels and a ductless blower system to prevent system pressure loss. The air-permeable three-dimensional scaffold prevents compression and closure of pad-based airflow channels. The blower system reduces system air pressure loss by residing adjacent to the volume of interest, eliminating the need for ductwork.

Abstract: A co-catalyst system for the removal of NOx from an exhaust gas stream has a layered oxide and a spinel of formula Ni0.15Co0.85CoAlO4. The system converts to nitric oxide to nitrogen gas with high product specificity. The layered oxide is configured to convert NOx in the exhaust gas stream to an N2O intermediate, and the spinel is configured to convert the N2O intermediate to N2.

Abstract: This disclosure relates to the preparation of diphenyl compounds, especially dimethylbiphenyl compounds, in which there is one methyl group on each ring, and their oxidized analogues. These compounds, and particularly alkylated biphenyl compounds and biphenylcarboxylic acids, alcohols and esters, are useful intermediates in the production of a variety of commercially valuable products, including polyesters and plasticizers for PVC and other polymer compositions.

Abstract: An absorbent liquid which absorbs at least one of CO2 and H2S from a gas, including a secondary linear monoamine; a tertiary linear monoamine or a sterically hindered primary monoamine; and a secondary cyclic diamine, wherein a concentration of each of the secondary linear monoamine, the tertiary linear monoamine or the sterically hindered primary monoamine; and the secondary cyclic diamine is less than 30% by weight.

Abstract: Organosilicon electrolytes exhibit several important properties for use in lithium carbon monofluoride batteries, including high conductivity/low viscosity and thermal/electrochemical stability. Conjugation of an anion binding agent to the siloxane backbone of an organosilicon electrolyte creates a bi-functional electrolyte. The bi-functionality of the electrolyte is due to the ability of the conjugated polyethylene oxide moieties of the siloxane backbone to solvate lithium and thus control the ionic conductivity within the electrolyte, and the anion binding agent to bind the fluoride anion and thus facilitate lithium fluoride dissolution and preserve the porous structure of the carbon monofluoride cathode. The ability to control both the electrolyte conductivity and the electrode morphology/properties simultaneously can improve lithium electrolyte operation.

Abstract: The present disclosure pertains to systems and methods for establishing trust relationships between a software defined network (SDN) controller and a SDN communication device. In one embodiment, a SDN controller may comprise a communications interface configured to communicate with a plurality of SDN network devices. A commissioning subsystem configured to detect a new device associated with the SDN. In response to a new device, a user interface subsystem may be configured to receive a user approval to commission the new device. A trust subsystem configured to establish a first SDN controller trusted credential and to transmit a first device trusted credential based on the first SDN controller credential to the new device. Programming instructions to the new device authenticated using the first SDN controller trusted credential by a SDN programming subsystem.

Abstract: According to various embodiments, an intelligent electronic device IED, such as a protective relay, includes a universal binary input circuit for receiving an AC or DC binary input with a voltage magnitude between approximately 0 Volts and 300 Volts. The universal binary input provides reinforced isolation via an input protection subcircuit and an optocoupler for communicating an optical signal with an electrically isolated controller based on the received binary input signal. In one embodiment, a duty cycle modulation subcircuit generates a pulse width modulated drive signal to drive the optocoupler based on the voltage magnitude of the received binary input. The duty cycle of the pulse width modulated drive signal is (linearly or nonlinearly) inversely proportional to the voltage magnitude of the received binary input.

Abstract: A device for influencing the force of a seatbelt acting on an occupant of a passenger vehicle during a collision, for example. The device includes a rotary damper with a magnetorheological fluid as a working fluid for damping a rotational movement of a damper shaft of the rotary damper when winding or unwinding the seatbelt. The rotary damper has a displacing device with displacing components which engage into one another and which are wetted by the magnetorheological fluid. By using a paired controller, a magnetic field of a magnetic field source with an electric coil can be controlled and the magnetorheological fluid can be influenced in order to adjust the damping of the rotational movement of the damper shaft.

Abstract: A semiconductor package structure includes a substrate having a patterned surface, the patterned surface including a first region and a second region, wherein a first line width in the first region is smaller than a second line width in the second region. The semiconductor package structure further includes a first die hybrid-bonded to the first region through conductive features adapted for the first line width, and a second die bonded to the second region through conductive features adapted for the second line width. The manufacturing operations of the semiconductor package structure are also disclosed.

Abstract: A semiconductor device package includes a carrier, a conductive pillar and a first package body. The carrier has a first surface and a second surface opposite to the first surface. The conductive pillar is disposed on the second surface of the carrier. The first package is disposed on the second surface of the carrier and covers at least a portion of the conductive pillar. The conductive pillar has an uneven width.

Abstract: The present application discloses a stent-graft prosthesis and a method for navigating such stent-graft prosthesis e.g. to a branch vessel. A first stent-graft prosthesis may include a main body and at least one lateral side branch connected to the main body. A further stent-graft prosthesis according to examples has a body having a generally tubular wall structure, the wall structure of the further stent-graft prosthesis including an orifice element for receiving a guiding element. Preferably the wall structure has an overlap region for interconnection, e.g. to the first stent-graft prosthesis. The orifice element is then arranged at said overlap region, wherein said overlap region is preferably arranged at a proximal end region of said body. The guiding element preferably is a textile thread or suture thread, optionally with a radiopaque marker, such as a fiducial marker and/or a radiopaque elongate marker extending at least along a portion of a length of said guiding element.

Abstract: A semiconductor device package includes a first dielectric layer, a conductive pad and an electrical contact. The first dielectric layer has a first surface and a second surface opposite to the first surface. The conductive pad is disposed within the first dielectric layer. The conductive pad includes a first conductive layer and a barrier. The first conductive layer is adjacent to the second surface of the first dielectric layer. The first conductive layer has a first surface facing the first surface of the first dielectric layer and a second surface opposite to the first surface. The second surface of the first conductive layer is exposed from the first dielectric layer. The barrier layer is disposed on the first surface of the first conductive layer. The electrical contact is disposed on the second surface of the first conductive layer of the conductive pad.

Abstract: A semiconductor device package includes a first substrate, an antenna, a support layer, a dielectric layer and a second substrate. The first substrate has a first surface and a second surface opposite to the first surface. The antenna element is disposed on the second surface of the first substrate. The support layer is disposed on the first surface of the first substrate and at the periphery of the first surface of the first substrate. The support layer has a first surface facing away from the first substrate. The dielectric layer is disposed on the first surface of the support layer and spaced apart from the first substrate. The dielectric layer is chemically bonded to the support layer. The second substrate is disposed on a first surface of the dielectric layer facing away from the support layer.

Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.