Patents Assigned to Engineering
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Patent number: 10479532Abstract: A metallic positive expulsion fuel tank with stress free weld seams may include a first hemispherical shell with a first edge; and a hemispherical rolling metal diaphragm with a first edge attached to the first hemispherical shell along matching first edges. A second hemispherical shell with a first edge may be attached to the first edge of the first hemispherical shell by a first weld seam thereby forming two interior chambers separated by the hemispherical rolling metal diaphragm. A pressurized gas inlet may be attached to the first hemispherical dome; and a fuel outlet fixture may be attached to the second hemispherical dome. The first weld seam may have been stress relieved by a localized post-weld heat treatment confined to an immediate vicinity of the first weld seam.Type: GrantFiled: May 7, 2015Date of Patent: November 19, 2019Assignee: Keystone Engineering CompanyInventors: Ian Ballinger, Wayne H. Tuttle
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Patent number: 10483912Abstract: Various technologies described herein pertain to non-inverting multi-mode oscillators. An oscillator circuit can include a non-inverting sustaining amplifier and a feedback network. The non-inverting sustaining amplifier includes an amplifier input and an amplifier output. The feedback network includes a crystal, an input portion, and an output portion. The crystal of the feedback network can be connected between the amplifier input and the amplifier output of the non-inverting sustaining amplifier. The input portion of the feedback network can be connected between the amplifier input and ground, and can include an inductor realized using a tank circuit. Further, the output portion of the feedback network can be connected between the amplifier output and ground, and can include a capacitor. Moreover, the crystal can operate in series resonance mode or parallel resonance mode.Type: GrantFiled: September 18, 2017Date of Patent: November 19, 2019Assignee: National Technology & Engineering Solutions of Sandia, LLCInventor: Kurt O. Wessendorf
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Patent number: 10482388Abstract: Methods and apparatus of quantum information processing using quantum dots are provided. Electrons from a 2DEG are confined to the quantum dots and subjected to a magnetic field having a component directed parallel to the interface. Due to interfacial asymmetries, there is created an effective magnetic field that perturbs the energies of the spin states via an interfacial spin-orbit (SO) interaction. This SO interaction is utilized to controllably produce rotations of the electronic spin state, such as X-rotations of the electronic spin state in a double quantum dot (DQD) singlet-triplet (ST) qubit. The desired state rotations are controlled solely by the use of electrical pulses.Type: GrantFiled: June 29, 2018Date of Patent: November 19, 2019Assignee: National Technology & Engineering Solutions of Sandia, LLCInventors: Ryan Michael Jock, Martin Rudolph, Andrew David Baczewski, Wayne Witzel, Malcom S. Carroll, Patrick Harvey-Collard, John King Gamble, IV, Noah Tobias Jacobson, Andrew Mounce, Daniel Robert Ward
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Publication number: 20190346305Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.Type: ApplicationFiled: May 7, 2019Publication date: November 14, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin-Ying HO, Ying-Chung CHEN
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Publication number: 20190348354Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.Type: ApplicationFiled: May 10, 2018Publication date: November 14, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Lin HO, Chih-Cheng LEE
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Publication number: 20190344413Abstract: A tool for assisting in the installation and/or removal of clips. The tool can include a handle and a tool head attached to the handle. The tool head includes a clip abutment portion having at least one surface operable to substantially abut at least a portion of a clip. A magnet in the tool head is configured to retain the clip proximate to the clip abutment portion such that a user can utilize a tool to apply a clip to an article. The tool head can also include a clip extrication element to facilitate removal of installed clips.Type: ApplicationFiled: May 14, 2018Publication date: November 14, 2019Applicant: The Rock Engineering, IncInventors: Pearce Carleton Kramer, Kristopher Kent Kramer
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Publication number: 20190346295Abstract: An optical fiber interrogator for interrogating optical fiber that includes fiber Bragg gratings (“FBGs”). The interrogator includes a light source operable to emit phase coherent light, amplitude modulation circuitry optically coupled to the light source and operable to generate pulses from the light, and control circuitry communicatively coupled to the amplitude modulation circuitry that is configured to perform a method for interrogating the optical fiber. The method includes generating a pair of light pulses by using the amplitude modulation circuitry to modulate light output by the light source without splitting the light.Type: ApplicationFiled: July 26, 2019Publication date: November 14, 2019Applicant: Hifi Engineering Inc.Inventors: Brian H. Moore, Walter Jeffrey Shakespeare, Phillip William Wallace, Viet Hoang, Tom Clement
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Publication number: 20190348230Abstract: Systems and methods are disclosed herein relating to a momentary contact switch that can be both manually and electronically actuated. In some embodiments, an electronic module can be added to a manual momentary contact switch to enable electronic control. The momentary contact switch can be transitioned between first, second, and third electrical states based on the rotation of a shaft between first, second, and third rotational positions. Rotary arms are selectively engaged by pull arms connected to a master solenoid to selectively rotate the shaft from the first rotational position to the second and third rotational positions.Type: ApplicationFiled: May 10, 2018Publication date: November 14, 2019Applicant: Schweitzer Engineering Laboratories, Inc.Inventors: Carlos Baltazar Castro Maciel, Sergio David Esquivel Álvarez, José Ramón Martinez Ramírez, Héctor Jaime Alba, Eduardo Ángel Morales Delgado, Marco Antonio Hidrogo Ordaz, Gerardo Rodríguez Nájera
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Publication number: 20190348352Abstract: A wiring structure includes an insulating layer and a conductive structure. The insulating layer has an upper surface and a lower surface opposite to the upper surface, and defines an opening extending through the insulating layer. The conductive structure is disposed in the opening of the insulating layer, and includes a first barrier layer and a wetting layer. The first barrier layer is disposed on a sidewall of the opening of the insulating layer, and defines a through hole extending through the first barrier layer. The wetting layer is disposed on the first barrier layer. A portion of the wetting layer is exposed from the through hole of the first barrier layer and the lower surface of the insulating layer to form a ball pad.Type: ApplicationFiled: May 8, 2018Publication date: November 14, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wen Hung HUANG, Chien-Mei HUANG, Yan Wen CHUNG
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Publication number: 20190348351Abstract: A semiconductor substrate and a method of manufacturing the same are provided. The semiconductor substrate includes a carrier and a conductive post. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The carrier has a through hole extending between the first surface and the second surface. The carrier has a first opening on the lateral surface. The conductive post is disposed within the through hole.Type: ApplicationFiled: May 11, 2018Publication date: November 14, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tsann Huei LEE, Lu-Ming LAI
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Publication number: 20190348385Abstract: An electronic device includes a first dielectric layer, a second dielectric layer and at least one first stud bump. The second dielectric layer is disposed on the first dielectric layer. The first stud bump is disposed in the first dielectric layer and the second dielectric layer. The first stud bump includes a bump portion and a stud portion, and the stud portion is disposed on the bump portion.Type: ApplicationFiled: May 8, 2018Publication date: November 14, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wen-Long LU
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Publication number: 20190348371Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.Type: ApplicationFiled: May 11, 2018Publication date: November 14, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsu-Nan FANG, Chun-Jun ZHUANG, Yung I. YEH
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Publication number: 20190348344Abstract: A connection structure is provided. The connection structure includes an intermediate conductive layer, a first conductive layer and a second conductive layer. The intermediate conductive layer includes a first surface and a second surface opposite to the first surface. The intermediate conductive layer has a first coefficient of thermal expansion. The first conductive layer is in contact with the first surface of the intermediate conductive layer. The first conductive layer has a second CTE. The second conductive layer is in contact with the second surface of the intermediate conductive layer. The first conductive layer and the second conductive layer are formed of the same material. One of the first CTE and the second CTE is negative, and the other is positive.Type: ApplicationFiled: May 8, 2018Publication date: November 14, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wen-Long LU, Jen-Kuang FANG
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Publication number: 20190346436Abstract: The present invention provides for a composition for ionizing a target comprising: a substrate comprising a plurality of nanoparticles bound to a surface of the substrate, which allows one to directly extract undesired contaminants during passive sample drying without require manual interventions, such as washing and vortexing.Type: ApplicationFiled: July 22, 2019Publication date: November 14, 2019Applicants: National Technology & Engineering Solutions of Sandia, LLC, The Regents of the University of CaliforniaInventors: Todd A. Duncombe, Trent R. Northen
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Patent number: 10476268Abstract: The present disclosure describes load shedding management systems and methods. A load shedding management system may simulate multiple load shedding actions. Based on the simulations the load shedding management system may select a load shedding action. The load shedding management system may send a signal to trip a set of breakers to implement the load shedding action.Type: GrantFiled: February 9, 2018Date of Patent: November 12, 2019Assignee: Schweitzer Engineering Laboratories, Inc.Inventors: Krishnanjan Gubba Ravikumar, Scott M. Manson, Benjamin E. Armstrong
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Patent number: 10471531Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride or other ceramics, and the pieces may be brazed with a high purity silicon or a silicon alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the interior of a heater or electrostatic chuck.Type: GrantFiled: December 21, 2015Date of Patent: November 12, 2019Assignee: Component Re-Engineering Company, Inc.Inventors: Brent Elliot, Alfred Grant Elliott
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Patent number: 10471935Abstract: A vehicular cowl louver assembly, a vehicular windshield assembly and a vehicle. A cowl louver that makes up a portion of the vehicular cowl louver assembly has one or more recesses formed in an upper-facing surface with which to provide storage of an ice scraper. A resiliently-biased clip allows the ice scraper to be selectively removable from the cowl louver to enable a person to scrape ice, snow or other debris from a vehicular windshield. The ice scraper may be returned to the recess after use, where the clip keeps the two secured to one another, even during vehicular movement. In one form, the surface of the ice scraper may be made to form a substantially flush, continuous fit with the portion of the surface of the cowl louver that is adjacent the recess to improve aerodynamic and aesthetic features of the cowl louver assembly.Type: GrantFiled: November 21, 2017Date of Patent: November 12, 2019Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Paxton S. Williams, Scott L. Frederick
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Patent number: 10473541Abstract: A device and system for detecting dynamic strain. The device comprises a longitudinally extending carrier and an optical fiber embedded along an outer surface of a length of the carrier. The optical fiber comprises at least one pair of fiber Bragg gratings (FBGs) tuned to reflect substantially identical wavelengths. The system comprises the device and an interrogator comprising a laser source and a photodetector. The interrogator is configured to perform interferometry by shining laser light along the optical fiber and detecting light reflected by the FBGs. The interrogator outputs dynamic strain measurements based on interferometry performed on the reflected light.Type: GrantFiled: July 4, 2014Date of Patent: November 12, 2019Assignee: Hifi Engineering Inc.Inventors: John Hull, Seyed Ehsan Jalilian
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Patent number: 10472183Abstract: A singulator apparatus and system for use with a product conveying and/or sorting system to place products in a single layer line of such products that are also separated from each other so the products may be more effectively and efficiently sized, inspected, sorted or otherwise processed in the processing area of the conveying and/or sorting system. The singulator apparatus has at least one pair, preferably a plurality, of adjacent cylindrical assemblies that are linearly aligned to be parallel with each other and define a valley between the adjacent cylindrical assemblies. Jumbled products are directed to the valleys from a product transfer area that receives the products. The cylindrical assemblies each have a cylindrical member and a shaft, with the shaft connected to a rotating mechanism that rotates the cylindrical assemblies to singulate and separate the products as they move along the valley between cylindrical assemblies.Type: GrantFiled: June 22, 2018Date of Patent: November 12, 2019Assignee: Exeter Engineering Inc.Inventor: Jeffrey A. Batchman
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Patent number: 10472938Abstract: Components for a perforation gun system are provided including combinations of components including a self-centralizing charge holder system and a bottom connector that can double as a spacer. Any number of spacers can be used with any number of holders for any desired specific metric or imperial shot density, phase and length gun system.Type: GrantFiled: March 20, 2019Date of Patent: November 12, 2019Assignees: DynaEnergetics GmbH & Co. KG, JDP Engineering and Machine IncInventors: David C. Parks, Frank Haron Preiss, Liam McNelis, Eric Mulhern, Thilo Scharf