Patents Assigned to Engineering
  • Patent number: 10332848
    Abstract: The present disclosure provides a semiconductor package device comprising: (1) a substrate comprising a first area and a second area; (2) a semiconductor device on the first area of the substrate; (3) an antenna pattern on the second area of the substrate; (4) a first electronic component on the antenna pattern; and (5) a first package body encapsulating the first area of the substrate and the semiconductor device and exposing the antenna pattern, the first electronic component and the second area of the substrate. An upper surface of the first package body is non-coplanar with the antenna pattern on the second area of the substrate.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: June 25, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chung-Hsin Chiang, Kuang-Ting Chi, Ming-Hsiang Cheng
  • Patent number: 10334756
    Abstract: Embodiments described herein generally relate to an assembly including a manifold structure. The manifold structure includes a fluid inlet and a fluid outlet. The fluid inlet is for receiving a cooling fluid into the manifold structure and the fluid outlet is for removing the cooling fluid from the manifold structure. The manifold structure also includes a first cooling surface and an opposite second cooling surface. The first cooling surface includes a cooling chip inlet opening fluidly coupled to a cooling chip outlet opening. The fluid inlet is fluidly coupled to the cooling chip inlet opening. The second cooling surface includes a cavity. A first integrated fluid channel fluidly couples the cooling chip outlet opening to the cavity and a second integrated fluid channel fluidly couples the cavity to the fluid outlet. A cooling chip includes a plurality of microchannels, which fluidly couple the cooling chip to the first cooling surface.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: June 25, 2019
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ercan M. Dede, Jongwon Shin, Yanghe Liu, Jae Seung Lee
  • Patent number: 10332757
    Abstract: A semiconductor substrate includes a dielectric layer, a first patterned conductive layer and a first connection element. The dielectric layer has a first surface. The first patterned conductive layer has a first surface and is disposed adjacent to the first surface of the dielectric layer. The first connection element is disposed on the first surface of the first patterned conductive layer. The first connection element includes a first portion, a second portion and a seed layer disposed between the first portion and the second portion. The first portion of the first connection element and the first patterned conductive layer are formed to be a monolithic structure.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: June 25, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Lin Shih, Chih Cheng Lee
  • Patent number: 10328299
    Abstract: An adjustable barbell or dumbbell or exercise device includes a handle device having a handle bar engageable into grooves of a number of weight members, the weight members each having two pivotal arms, a link pivotally connected between the arms, a hand grip disposed on the handle bar, and a number of plates disposed on the handle bar and rotated in concert with the hand grip, the plates are engageable between the weight members, and the plates each include an engaging element for engaging with the link and for moving the arms toward each other to engage with the handle device when the plates and the hand grip are rotated relative to the handle bar, and for anchoring a selected number of weight members to the handle device with the plates.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: June 25, 2019
    Assignee: Beto Engineering & Marketing Co., Ltd.
    Inventor: Lo Pin Wang
  • Patent number: 10329427
    Abstract: Methods are provided for predicting the properties of an asphalt fraction that contains two or more asphalt components based on measurements of the viscosity versus temperature profile for the components of the asphalt fraction. The viscosity versus temperature profile for each component can be used to determine characteristic (such as limiting) values for the viscosity and temperature for a component. Based on this ability to determine characteristic values for an asphalt blend based on the properties of individual blend components, appropriate blends of asphalts can be selected in order to arrive at an asphalt blend with desired properties.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: June 25, 2019
    Assignee: EXXONMOBIL RESEARCH AND ENGINEERING COMPANY
    Inventor: Eric B. Sirota
  • Patent number: 10332862
    Abstract: A semiconductor package structure includes a first substrate, at least one first semiconductor element and a second substrate. The first semiconductor element is attached to the first substrate. The second substrate defines a cavity and includes a plurality of thermal vias. One end of each of the thermal vias is exposed in the cavity, and the first semiconductor element is disposed within the cavity and thermally connected to the thermal vias.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: June 25, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Bo-Syun Chen, Tang-Yuan Chen, Yu-Chang Chen, Jin-Feng Yang, Chin-Li Kao, Meng-Kai Shih
  • Patent number: 10327891
    Abstract: An intra-annular mounting frame for an aortic valve having native aortic cusps is provided which includes a frame body with native leaflet reorienting curvatures and interconnecting points; the curvatures shaped to be received inside the valve below the native aortic cusps and to reorient the native aortic cusps within the aortic valve, where each of the curvatures extends concavely upward from a reference latitudinal plane tangential to each curvature's base.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: June 25, 2019
    Assignee: BIOSTABLE SCIENCE & ENGINEERING, INC.
    Inventor: J. Scott Rankin
  • Patent number: 10328949
    Abstract: A vehicle can be configured to indicate sensor blind spots to a vehicle occupant (e.g., a driver). Using one or more sensors, the vehicle can acquire driving environment data of an external environment of the vehicle. It can be determined whether one or more portions of the acquired driving environment data is unreliable. Responsive to determining that one or more portions of the acquired driving environment data is unreliable, an alert can be caused to be presented within the vehicle. The alert can indicate one or more locations in the external environment in which the driving environment data that is determined to be unreliable. In some instances, the alert can be a visual alert and/or an audial alert.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: June 25, 2019
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Nobuhide Kamata
  • Patent number: 10329166
    Abstract: The present invention provides an aqueous solution evaporative treatment method that makes it possible to efficiently perform evaporative treatment of an aqueous solution containing calcium, magnesium, and silica. The aqueous solution evaporative treatment method comprises a seed crystal mixing step of adding to and mixing with an aqueous solution containing calcium, magnesium, and silica at least any one of magnesium salt and silicate together with calcium salt as seed crystals, and an evaporative concentration step of evaporatively concentrating the aqueous solution together with the seed crystals.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: June 25, 2019
    Assignee: SASAKURA ENGINEERING CO., LTD.
    Inventors: Junji Mizutani, Yo Fujimoto, Tatsuya Taguchi, Yoshiyuki Hatano
  • Patent number: 10328802
    Abstract: System, methods, and other embodiments described herein relate to adapting a manner of braking according to brake wear of friction brakes of a vehicle. In one embodiment, a method includes identifying whether brake wear of at least one of the friction brakes satisfies a threshold for modifying a deceleration pattern of the vehicle. The deceleration pattern indicates how regenerative brakes and the friction brakes are engaged to decelerate the vehicle individually for each wheel of the vehicle. The method includes adjusting the deceleration pattern according to at least the brake wear of the at least one of the friction brakes to transition braking from the at least one of the friction brakes to the regenerative brakes. The method includes controlling the vehicle to decelerate according to the deceleration pattern upon receiving a control input.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: June 25, 2019
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Geoffrey David Gaither, Joshua D. Payne
  • Patent number: 10331804
    Abstract: A system for testing at least a first automatic control device via a plant model includes: a first subsystem; and a second subsystem which is spatially separated from the first subsystem. The plant model comprises an executable first model code and an executable second model code. The first subsystem comprises a first time-signal processing component configured to electronically assign a first time signal (Ts1) from a global time source to a first event. The first model code is configured to provide a first calculation result based on the first event. The second subsystem comprises a second time-signal processing component configured to electronically assign a second time signal (Ts2) from the global time source to a second event. The second model code is configured to provide a second calculation result based on the second event.
    Type: Grant
    Filed: April 13, 2016
    Date of Patent: June 25, 2019
    Assignee: DSPACE DIGITAL SIGNAL PROCESSING AND CONTROL ENGINEERING GMBH
    Inventors: Andreas Himmler, Matthias Klemm
  • Patent number: 10329888
    Abstract: The method and system describes monitoring and modeling the hydraulic fracturing of a reservoir. The microseismic events caused by hydraulic fracturing on a reservoir are captured by sensor arrays. The data captured by the sensor arrays are then analyzed to determine the source radius, and seismic moment tensor of microseismic events caused by the hydraulic fracturing. This information is then combined with a seismic velocity model to arrive at a discrete fracture network showing at least the orientation, source radius, and source mechanism of each microseismic event. This discrete fracture network is then used to determine the stimulated surface area, stimulated volume, and point of diminishing returns for the hydraulic fracturing process. Hydraulic fracturing engineers can use the algorithms to monitor the well and/or determine well completion.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: June 25, 2019
    Assignee: ENGINEERING SEISMOLOGY GROUP CANADA INC.
    Inventors: Theodore Ivan Urbancic, Adam Mirza Baig, Alice Guest, Kaitlyn Christine Mascher-Mace, Vladimir Sumila
  • Patent number: 10330432
    Abstract: A firearm includes: a rail secured to the firearm; and an adjustable firearm stock secured to the rail, the adjustable firearm stock including: a base removably secured to the rail of the firearm and defining an extension element bore; and an extension element positioned in the extension element bore, the extension element configured to move along an axis of the extension element bore. A method of using a firearm includes: mounting a base of an adjustable firearm stock to a rail of the firearm; and sliding an extension element of the adjustable firearm stock through an extension element bore of the base to adjust the adjustable firearm stock to a desired orientation.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: June 25, 2019
    Assignee: Elemental Engineering Corp.
    Inventors: Ryan Andrew Silverman, Rabun Nolan Vaughn, Jr., Everett Mcdowell Steil
  • Patent number: 10332849
    Abstract: A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first surface of the substrate, a second portion protruding from the first portion, and a third portion disposed on the second portion and contacting the second portion of the permeable element; (3) a first electrical element disposed on the substrate and surrounded by the second portion of the permeable element; and (4) a coil disposed on the substrate and surrounding the second portion of the permeable element.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: June 25, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chang-Lin Yeh, Jen-Chieh Kao, Chih-Yi Huang, Fu-Chen Chu
  • Patent number: 10328583
    Abstract: Lifting equipment for lifting a waffle slab used in a construction includes a main body bracket, a sliding member and a plurality of clamping mechanisms for clamping the waffle slab. The main body bracket has a through hole in a center thereof. The sliding member is slidably disposed in the through hole of the main body bracket. The sliding member includes an engagement member located at the top of the sliding member, a shaft portion connected to the bottom of the engagement member and slidably disposed in the through hole of the main body bracket, a sleeve fitted to an outer circumference of the shaft portion, and a flange fixed to the bottom of the shaft portion for preventing the sleeve from moving downward.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: June 25, 2019
    Assignee: RUENTEX ENGINEERING & CONSTRUCTON, CO., LTD.
    Inventors: Samuel Yin, Tzu-Liang Wu
  • Patent number: 10333312
    Abstract: This disclosure includes various systems and methods for determining an operating stage based on electrical conditions in electric power delivery systems and identifying a control strategy based upon the operating stage. The control strategy may be selected and customized to avoid or to ameliorate stresses in an electric power delivery system while maintaining the stability of electric power delivery systems. Various embodiments consistent with the present disclosure may include a distributed controller configured receive a plurality of indications of electrical conditions from a plurality of control devices in electrical communication with the electrical power delivery system. The distributed controller may determine an operating stage from among a plurality of operating stages based upon the plurality of indications of electrical conditions. The distributed controller may further identify a control strategy based upon the operating stage.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: June 25, 2019
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Gregary C. Zweigle, Ellery A. Blood
  • Publication number: 20190184419
    Abstract: In a microvolume-liquid dispenser, there is performed an application operation for dispensing a microvolume liquid present in an amount measured in nanoliters or picoliters from a nozzle tip-end opening and applying the microvolume liquid to an application surface. When the application operation has not been performed over a time interval longer than a set time interval ta, a tip-end liquid surface of an application liquid in the nozzle tip-end opening is caused to vibrate at a high amplitude that includes the position of a liquid surface height from immediately before application in the case of application at equal time intervals. The subsequently performed application operation is performed at a point in time when the liquid surface height has returned to the liquid surface height. The operation for applying the microvolume application liquid can be precisely performed in the same manner as when application is performed at equal time intervals.
    Type: Application
    Filed: November 27, 2018
    Publication date: June 20, 2019
    Applicant: Engineering System Co., Ltd.
    Inventors: Kazuki TOMITA, Kentaro FUKUDA
  • Publication number: 20190187371
    Abstract: A semiconductor device package includes: (1) a substrate having a first surface; (2) a waveguide disposed in the substrate; and (3) an optical device including: (a) a first portion extending into the substrate and not extending beyond the first surface of the substrate, and (b) a second portion extending along the first surface of the substrate, wherein the second portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate, and wherein the protrusion of the second portion of the optical device engages with the groove of the substrate.
    Type: Application
    Filed: February 26, 2019
    Publication date: June 20, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yi-Min CHIN, Yung-Shun CHANG, Mei-Ju LU, Jia-Hao ZHANG, Wen-Chi HUNG
  • Publication number: 20190190359
    Abstract: A manufacturing apparatus of an electrical rotating machine includes a coil segment shaping section for shaping a linear wire rod with a predetermined length into a coil segment with a predetermined shape consisting of a pair of slot insertion port ions extending substantially in parallel with each other and a linking portion for coupling the pair of slot insertion portions, and a coil assembling section for assembling a coil by circularly arranging the coil segments shaped in the coil segment shaping section. The coil segment shaping section and the coil assembling section are constituted to continuously perform the shaping and the assembling of the coil segment in each coil segment unit, based on control data set depending on a coil to be fabricated.
    Type: Application
    Filed: February 21, 2019
    Publication date: June 20, 2019
    Applicant: ODAWARA ENGINEERING CO., LTD.
    Inventors: Noburo Miyawaki, Takayuki Mochizuki, Yuji Miyazaki, Wataru Wakui, Hisayoshi Watanabe, Kodai Kono, Daiki Saito, Ryo Honda, Tomohiro Ishizuka
  • Patent number: D852245
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: June 25, 2019
    Assignee: Mitsubishi Hitachi Tool Engineering, Ltd.
    Inventors: Yoshiyuki Kobayashi, Hayato Takahashi, Shoujirou Touma