Patents Assigned to Engineering
-
Patent number: 10344729Abstract: A cylinder block including: a plurality of cylinders; a cylinder head attached on the cylinder block and including, for each of the cylinders, an intake port extending from a combustion chamber upward and obliquely relative to an axis of the cylinder; a direct injector disposed at a position on an outer side of the intake port in a cylinder radial direction and directly injecting fuel into the combustion chamber; a port injector disposed at a position on a same side as the direct injector relative to the intake port, and injecting fuel into the intake port are provided. The intake port includes: a valve seat provided at an intake air inlet opened to the combustion chamber; and an arc portion protruding downward in a center area of the intake port on an upstream side of the valve seat, and an injection direction of the port injector is orientated in a direction in which the fuel injected from the port injector passes through a lower area of the arc portion.Type: GrantFiled: May 15, 2017Date of Patent: July 9, 2019Assignees: MITSUBISHI KOGYO KABUSHIKI KAISHA, MITSUBISHI JIDOSHA ENGINEERING KABUSHIKI KAISHAInventors: Takehiro Nishidono, Junji Takai, Toshio Yokoyama
-
Patent number: 10344736Abstract: The invention provides optimal control of a three-degree-of-freedom wave energy converter using a pseudo-spectral control method. The three modes are the heave, pitch and surge. A dynamic model is characterized by a coupling between the pitch and surge modes, while the heave is decoupled. The heave, however, excites the pitch motion through nonlinear parametric excitation in the pitch mode. The invention can use a Fourier series as basis functions to approximate the states and the control. For the parametric excited case, a sequential quadratic programming approach can be implemented to numerically solve for the optimal control. The numerical results show that the harvested energy from three modes is greater than three times the harvested energy from the heave mode alone. Moreover, the harvested energy using a control that accounts for the parametric excitation is significantly higher than the energy harvested when neglecting this nonlinear parametric excitation term.Type: GrantFiled: December 11, 2017Date of Patent: July 9, 2019Assignees: National Technology & Engineering Solution of Sandia, LLC, Michigan Technological UniversityInventors: Ossama Abdelkhalik, Giorgio Bacelli, Shangyan Zou, Rush D. Robinett, III, David G. Wilson, Ryan G. Coe
-
Patent number: 10345605Abstract: A cloaking device includes an object-side, an image-side and a cloaked region between the object-side and the image-side. An object-side polyhedron with an entrance side and an exit side parallel to the entrance side is positioned on the object-side and an image-side polyhedron with an entrance side and an exit side parallel to the entrance side is positioned on the image-side. The entrance side of the object-side polyhedron is oriented relative to a reference optical axis extending between the object-side and the image-side at an acute angle ? and the exit side of the image-side polyhedron is oriented relative to the reference optical axis at an oblique angle equal to 180°??. Light from an object positioned on the object-side of the cloaking device is redirected around the cloaked region, without total internal reflection of the light within the object-side polyhedron or the image-side polyhedron.Type: GrantFiled: November 15, 2017Date of Patent: July 9, 2019Assignee: Toyota Motor Engineering & Manufacturing North AmericaInventors: Kyu-Tae Lee, Chengang Ji, Songtao Wu, Debasish Banerjee
-
Publication number: 20190202721Abstract: A ballast water treatment device includes an oxidant supply amount control device in which a storage unit stores a relationship between an absorbance of a raw water for a ballast and a dissolved organic carbon concentration thereof and another relationship between the dissolved concentration and a residual oxidant concentration required after a predetermined time from an oxidant supply, to kill organisms and to suppress their regrowth in the ballast. A calculation unit derives the required residual oxidant concentration corresponding to the absorbance measured by a meter by referring to the relationships and calculates a target oxidant supply amount using the required residual oxidant concentration. For the target, a control unit controls an oxidant supply device.Type: ApplicationFiled: October 25, 2018Publication date: July 4, 2019Applicant: JFE Engineering CorporationInventors: Shigeki Fujiwara, Masanori Nagafuji, Yukihiko Okamoto, Yusuke Shimono
-
Publication number: 20190202371Abstract: A roof apparatus for an autonomous hardtop vehicle is described. The apparatus includes a vehicle roof having an opening for a sunroof and a roof cover that encloses sensor devices. The roof apparatus is mounted from the underside of the vehicle roof at the position for mounting a sunroof. The sensors include an array of cameras having a field of view of the full width of the vehicle in at least the front of the vehicle. The height of the roof cover above the vehicle roof is a minimal height to accommodate the height of the cameras.Type: ApplicationFiled: January 4, 2018Publication date: July 4, 2019Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventors: Scott L. Frederick, Andrew L. Sakowski, Bill Castleman
-
SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUDING HIGH DENSITY INTERCONNECTIONS
Publication number: 20190206684Abstract: A method of forming a semiconductor device package includes: (1) providing an electronic device including an active surface and a contact pad adjacent to the active surface; (2) forming a package body encapsulating portions of the electronic device; and (3) forming a redistribution stack, including: forming a dielectric layer over a front surface of the package body, the dielectric layer defining a first opening exposing at least a portion of the contact pad; and forming a redistribution layer (RDL) over the dielectric layer, the RDL including a first trace, wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending between the first portion of the first trace and the exposed portion of the contact pad, wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, andType: ApplicationFiled: March 8, 2019Publication date: July 4, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: John Richard HUNT, William T. Chen, Chih-Pin HUNG, Chen-Chao WANG -
Publication number: 20190206843Abstract: A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.Type: ApplicationFiled: March 8, 2019Publication date: July 4, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Li-Hao LYU, Chieh-Ju TSAI, Yu-Kai LIN, Wei-Ming HSIEH, Yu-Pin TSAI, Man-Wen TSENG, Yu-Ting LU
-
Publication number: 20190203675Abstract: A filter oil composition and a method for removing airborne molecular contaminants from air are provided. The composition includes a first portion comprising paraffinic oil by volume of the composition, a second portion comprising polyalphaolefin (PAO) by volume of the composition, and a third portion comprising red dye by volume of the composition. Applying the filter oil composition to a cotton air filter material causes tackiness throughout the air filter material, thereby enhancing filtration of air passing through the filter. The composition generally is substantially non-reactive, has an excellent oxidation stability, possesses good thermal stability, and retains a suitable viscosity at a normal operating temperatures of an automobile engine. In an embodiment, the composition comprises 96.74% paraffinic oil by volume, 3.20% polyalphaolefin (PAO) by volume, and 0.06% red dye by volume. A viscosity of the composition at 100 degrees-C ranges between substantially 7.2 and 7.6 centistokes (cSTs).Type: ApplicationFiled: March 8, 2019Publication date: July 4, 2019Applicant: K&N Engineering, Inc.Inventors: Steve Williams, Jere James Wall, Rick Daniels
-
Publication number: 20190206824Abstract: A semiconductor package structure includes a first semiconductor die, a second semiconductor die, a plurality of conductive elements, a first encapsulant and a second encapsulant. The second semiconductor die is disposed on the first semiconductor die. The conductive elements each comprises a first portion and a second portion and are disposed around the first semiconductor die and the second semiconductor die. The first encapsulant surrounds the first semiconductor die and the respective first portions of the conductive elements. The second encapsulant covers a portion of a top portion of the first semiconductor die and surrounds the respective second portions of the conductive elements.Type: ApplicationFiled: December 29, 2017Publication date: July 4, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wen-Long LU
-
Publication number: 20190204514Abstract: An optical device package includes: (1) a waveguide, the waveguide including: a main body; and multiple forks, wherein each of the plurality of forks has a tapering end and is extended from the main body, and wherein each of the tapering ends of the forks includes a facet for receiving light; and (2) an optical fiber having a surface configured to output the light into the waveguide; wherein a lateral distance between the surface of the optical fiber and at least one of the facets is less than about 25 micrometers (?m).Type: ApplicationFiled: March 11, 2019Publication date: July 4, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Ju LU, Tai-Hsuan TU, Yi-Min CHIN, Wei Lun WANG, Jia-Hao ZHANG
-
Publication number: 20190202686Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.Type: ApplicationFiled: December 6, 2018Publication date: July 4, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chi Sheng TSENG, Lu-Ming LAI, Shih-Chieh TANG, Hsin-Ying HO, Hsun-Wei CHAN
-
Publication number: 20190206778Abstract: An electrical device includes a substrate and a via. The substrate has a first surface and defines a recess in the first surface. The via is disposed in the recess. The via includes an insulation layer, a first conductive layer and a second conductive layer. The insulation layer is disposed on the first surface of the substrate and extends at least to a sidewall of the recess. The first conductive layer is disposed adjacent to the insulation layer and extends over at least a portion of the first surface. The second conductive layer is disposed adjacent to the first conductive layer and extends over at least a portion of the first surface. The second conductive layer has a negative coefficient of thermal expansion (CTE).Type: ApplicationFiled: December 29, 2017Publication date: July 4, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wen-Long LU
-
Publication number: 20190202211Abstract: A printing system is provided. The printing system includes a medium of fabric; and a printing apparatus for performing printing of a design represented by a target color which is preset on the medium by an inkjet method. The printing apparatus includes an inkjet head for discharging an ink droplet of a target color ink which is an ink that is adjusted to present the target color on the medium. The design is formed by a plurality of patterns. Each of the plurality of patterns is drawn with the target color ink of only one color used in the inkjet head, and the inkjet head discharges the ink droplet to the plurality of patterns at a constant concentration which is preset for each of a plurality of target colors. The medium is capable of pulling out the ink not absorbed by the medium to the back surface of the medium.Type: ApplicationFiled: March 8, 2019Publication date: July 4, 2019Applicant: MIMAKI ENGINEERING CO., LTD.Inventor: MASARU OHNISHI
-
Publication number: 20190207374Abstract: A system for sealing one end of an existing conduit through which a number of cables extend and in which a number of elements are placed for holding each of the number of cables in a position in the conduit, the system comprising: a sealant for applying a first layer of sealant at an end of the existing conduit against the number of elements so that the first layer of sealant completely covers that end of the conduit as far as not occupied by any of the number of cables; a number of flexible elements which each have a first end for positioning that first end into the first layer of sealant when the first layer is still uncured, each of the number of flexible elements further having a second end at such a distance from the respective first end when the first ends are positioned in the first layer of sealant, that the second ends form together a structure against which a second layer of the sealant can be applied, a single-part or multiple part subsystem for constructing a rigid second conduit around the flexibType: ApplicationFiled: September 26, 2016Publication date: July 4, 2019Applicant: Beele Engineering B.V.Inventor: Johannes Alfred Beele
-
Publication number: 20190200874Abstract: The present disclosure relates to method for predicting location and depth of abnormal tissue in breast tissue by prediction system. The prediction system predicts location based on 2D thermal image generated based on temperature values and intermediate temperature values. The intermediate temperature values are estimated using triangular and rectangular patterns formed on pre-defined model of breast, thermal conductivity of breast tissue, 2D coordinates on one of triangular and rectangular patterns and temperature values at steady state of breast tissue. The depth is predicted based on 3D thermal image of breast tissue generated using temperature values and intermediate temperature values and error parameter.Type: ApplicationFiled: March 20, 2018Publication date: July 4, 2019Applicants: THE SECRETARY, MINISTRY OF ELECTRONICS AND INFORMATION TECHNOLOGY, GOVT. OF INDIA, THE DIRECTOR GENERAL, CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY (C-MET), THE PRINCIPAL, GOVERNMENT ENGINEERING COLLEGE, THE DIRECTOR, MALABAR CANCER CENTRE (MCC)Inventors: Seema Ansari, Muralidharan Malamal Neelanchery, Arathy Kottapurath, Eva Ignatious, Ranjith Kizhupadath Ravindran, Deepak Puthan Purayil, Sudheesh Raveendran Nair Sarojini, Satheesan Balasubramanian
-
Publication number: 20190206775Abstract: A semiconductor device package includes a carrier, a first conductive post and a first adhesive layer. The first conductive post is disposed on the carrier. The first conductive post includes a lower surface facing the carrier, an upper surface opposite to the lower surface and a lateral surface extended between the upper surface and the lower surface. The first adhesive layer surrounds a portion of the lateral surface of the first conductive post. The first adhesive layer comprises conductive particles and an adhesive. The first conductive post has a height measured from the upper surface to the lower surface and a width. The height is greater than the width.Type: ApplicationFiled: December 29, 2017Publication date: July 4, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Yu-Ying LEE
-
Publication number: 20190201912Abstract: A magnetic separation device for immunoassay using a two-sided plate for multi-well microplate separation via a flat side containing a magnetic block and a back side of magnetic microplate structure containing a matrix of permanent magnets. The present invention relates to a multi-purpose magnetic separation device that has two sides of magnetic separation function. The flat side of magnetic separation device includes magnet block, metal or plastic sheet on top surface and a pin to secure the assay plate. The back side of magnetic separation device is a multi-well structure that includes a plurality of permanent magnets placed in the spaces between the adjacent wells. There are different magnetic configurations for the multi-well structure, which ensures that each well is pulled by at least one strong permanent magnet. These strong permanent magnets are polarized laterally, i.e., its magnetic flux line points toward the side of the well.Type: ApplicationFiled: January 3, 2018Publication date: July 4, 2019Applicant: AMERICAN MAGNETIC ENGINEERING, INC.Inventors: Kang Yao, Nan An, Khanh Duc Huynh
-
Publication number: 20190207694Abstract: The present disclosure pertains to systems and methods for publishing time-synchronized information. In one embodiment, a system may include a time interface configured to receive a common time signal and a network interface configured to transmit a plurality of data packets using a network. A publishing subsystem may be configured to cause the system to publish at least one data value according to a schedule and the common time signal. A processing sequence number subsystem may be configured to generate a processing sequence number to be included in the plurality of data packets and to reset the processing sequence number at a fixed interval based on the common time signal. A data packet subsystem may be configured to generate a plurality of data packets comprising a respective processing sequence number and the at least one data value.Type: ApplicationFiled: March 6, 2019Publication date: July 4, 2019Applicant: Schweitzer Engineering Laboratories, Inc.Inventors: David J. Dolezilek, Jorge Fernando Calero, Amandeep Singh Kalra, Brian T. Waldron
-
Publication number: 20190200616Abstract: In one aspect, the present disclosure belongs to the new material field and can be used to produce atomic-state fluid iodine by iodine atom rearrangement occurring in the pseudo-critical reaction system. In one aspect, the atomic-state fluid iodine has a specific gravity of about 3.8-4.0 g/mL and maintains stable physical state under 10-100 C and light environment without sublimation or decomposition.Type: ApplicationFiled: December 10, 2018Publication date: July 4, 2019Applicant: Chinese Academy of Agricultural Engineering Planning & DesignInventors: Shikui WANG, Zhiqing TIAN, Liang LIANG, Xuefang HU, Zhimin ZHANG
-
Patent number: D853315Type: GrantFiled: April 30, 2018Date of Patent: July 9, 2019Assignee: BLACK DONUTS ENGINEERING OYInventors: Jouni Juhani Raatikainen, Henri Sakari Kossi, Mikko Valtteri Sironen