Patents Assigned to Engineering
  • Patent number: 10270859
    Abstract: The present disclosure provides systems and methods for generating a system-wide event report for electrical power delivery systems. A monitoring device within the power system may generate a key message upon the occurrence of a predetermined condition. A master IED within the power system may generate and/or transmit a system-wide key message to a plurality of monitoring IEDs within the power system. Digital process bus data, continuously recorded by a plurality of monitoring IEDs within the power system, may be saved locally by each monitoring IED within the power system and retrieved by a master IED within the power system. Alternatively, digital process bus data may be transmitted to a master IED and saved locally. A software and/or hardware module may be used to merge the local reports into a system-wide event report.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: April 23, 2019
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Qiaoyin Yang, Normann Fischer
  • Patent number: 10270311
    Abstract: A superconducting electrical machine includes a rotor and a stator. The stator defines a cavity. The rotor is configured to rotate about a longitudinal axis. The rotor is disposed at least partially within the cavity. The rotor includes a shaft configured to rotate with the rotor, a rotor active section including at least a rotor torque tube and a superconductor, and a first re-entrant end attaching the shaft to the rotor active section. At most a threshold fraction of a bending force applied to the shaft is communicated to the rotor active section.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: April 23, 2019
    Assignee: KATO ENGINEERING INC.
    Inventor: Darrell Morrison
  • Patent number: 10265825
    Abstract: A grinding device of a travel path, on which traveling wheels of a rail-type vehicle roll, includes a grinder which grinds a surface layer of a travel path, a frame on which the grinder is provided, and a device traveling wheel mounted on the frame. The device traveling wheel rolls along the travel path on the top surface of the standard rail extending in the extending direction of the travel path.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: April 23, 2019
    Assignee: MITSUBISHI HEAVY INDUSTRIES ENGINEERING, LTD.
    Inventors: Kosaku Murase, Kenta Fukaya
  • Patent number: 10269771
    Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: April 23, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Li-Hao Lyu, Chieh-Ju Tsai, Yu-Kai Lin, Wei-Ming Hsieh, Yu-Pin Tsai, Man-Wen Tseng, Yu-Ting Lu
  • Patent number: 10266622
    Abstract: A catalyst system comprising a combination of: 1) one or more catalyst compounds having at least one nitrogen linkage and at least one oxygen linkage to a transition metal; 2) a support comprising an organosilica material, which is a mesoporous organosilica material; and 3) an optional activator. Useful catalysts include ONNO-type transition metal catalysts, ONYO-Type transition metal catalysts, and/or oxadiazole transition metal catalysts. The organosilica material is a polymer of at least one monomer of Formula [z?OZ2 SiCH2]3(l), where Z1 represents a hydrogen atom, a C1-C4alkyl group, or a bond to a silicon atom of another monomer and Z2 represents a hydroxyl group, a C1-C4alkoxy group, a C1-C6alkyl group, or an oxygen atom bonded to a silicon atom of another monomer. This invention further relates to processes to polymerize olefins comprising contacting one or more olefins with the above catalyst system.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: April 23, 2019
    Assignee: EXXONMOBIL RESEARCH AND ENGINEERING COMPANY
    Inventors: Matthew W. Holtcamp, Matthew S. Bedoya, Charles J. Harlan, Quanchang Li, Machteld M. W. Mertens
  • Patent number: 10270332
    Abstract: According to the overload current limiting method for a voltage source converter, when a pole control system receives a water-cooling overload current limiting instruction, an active and reactive instruction are changed at the same time according to a specified slope, so that an absolute value of an arm current of the converter decreases in a fixed slope, and can be ensured that active power and reactive power fall to zero at the same time, and a water-cooling load limiting aim of the converter can be achieved by reducing the arm current. After a water-cooling overload power limiting instruction received by the pole control system is cancelled, a current value of the active power and the inactive power remain unchanged. When a water-cooling overload power limiting instruction is received again, decrease continues on the basis of current power values until the power falls to zero.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: April 23, 2019
    Assignees: NR ELECTRIC CO., LTD, NR ENGINEERING CO., LTD
    Inventors: Zhaoqing Hu, Yunlong Dong, Yu Lu, Haiying Li, Dongming Cao
  • Patent number: 10267041
    Abstract: An anchoring wedge with a separable bolt for a simple separation of the anchoring wedge from an anchoring device surrounding a tendon using the separable bolt through efficient adjustment of tensile force and a method of anchoring a tendon using the same are provided.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: April 23, 2019
    Assignee: KOREA INSTITUTE OF CIVIL ENGINEERING AND BUILDING TECHNOLOGY
    Inventors: Bum Yeon Cho, Heung Youl Kim
  • Patent number: 10267895
    Abstract: Various technologies for identifying RF emitters in geolocation datasets are described herein. Doppler signatures of RF emitters and geolocation data of objects in a scene are collected simultaneously, then range-rate profiles of the movement of the RF emitters and the objects in the scene are computed. An RF emitter is identified in a geolocation dataset by comparing the motion of the RF emitter with the motion of an object in the scene as described by the respective range-rate profiles.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: April 23, 2019
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Richard M. Naething, Richard C. Ormesher
  • Patent number: 10268625
    Abstract: An input/output interface of a test device is configured, wherein the input/output interface is developed for connecting a hardware unit to a behavioral model present in the test device. The method includes the steps of: displaying a graphical representation of the input/output interface as a signal path between a hardware port for connection of the hardware and at least one model port for connecting the behavioral model via a selectable input/output function; receiving a first configuration for the signal path; receiving a test value that is predefinable at the hardware port or the model port of the signal path, but, for example, is also predefinable through the graphical representation of the hardware port or the model port; propagating a test signal associated with the test value along the signal path according to the first configuration for the signal path, and displaying the propagated test signal on the graphical representation of the model port or the hardware port.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: April 23, 2019
    Assignee: dSPACE digital signal processing and control engineering GmbH
    Inventor: Rafael Gilles
  • Patent number: 10267896
    Abstract: A variable bandwidth filter is described herein, wherein a bandwidth of a passband of the variable bandwidth filter is dynamically tunable. The variable bandwidth tuner is implemented on a CMOS chip, and acts to filter analog signals. The variable bandwidth filter comprises a plurality of finite impulse response (FIR) filters, wherein each FIR filter comprises a plurality of tunable transconductors. The tunable transconductors are tunable in their gain.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: April 23, 2019
    Assignees: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Christopher T. Rodenbeck, Jose Silva-Martinez, John Mincey, Eric Su
  • Patent number: 10270251
    Abstract: An emulator apparatus that emulates entities included in a microgrid is described herein. The emulator apparatus emulates a load with time-varying inductance/resistance or an energy storage device or combination of energy storage devices. The emulator apparatus is electrically coupled to a system or device that is desirably tested/maintained/designed. The emulator apparatus emulates a particular device, and response of the system of device to the emulated device is monitored for purposes of design, testing, or maintenance.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: April 23, 2019
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Jason C. Neely, Steven F. Glover
  • Publication number: 20190115294
    Abstract: A semiconductor package device includes an interconnection structure, an electronic component, a package body and an electrical contact. The dielectric layer has a top surface and a bottom surface. The dielectric layer defines a cavity extending from the bottom surface into the dielectric layer. A patterned conductive layer is disposed on the top surface of the dielectric layer. The conductive pad is at least partially disposed within the cavity and electrically connected to the patterned conductive layer. The conductive pad includes a first metal layer and a second metal layer. The second metal layer is disposed on the first metal layer and extends along a lateral surface of the first metal layer. The electronic component is electrically connected to the patterned conductive layer. The package body covers the electronic component and the patterned conductive layer. The electrical contact is electrically connected to the conductive pad.
    Type: Application
    Filed: October 13, 2017
    Publication date: April 18, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • Publication number: 20190115305
    Abstract: The present disclosure provides for a semiconductor package device and a method for manufacturing the same. The semiconductor package device includes a substrate, a shielding wall and a package body. The substrate has a top surface. The shielding wall is disposed on the top surface. The shielding wall has a conductive main body and a plurality of protruding portions extending from the conductive main body. The package body encapsulates the shielding wall.
    Type: Application
    Filed: October 17, 2017
    Publication date: April 18, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: JR-Wei LIN
  • Publication number: 20190113575
    Abstract: The present disclosure relates to systems and methods for detecting transient high-torque events associated with rotating machinery in an electric power system. In one embodiment, a relay may comprise an electrical parameters module configured to receive a representation of a voltage and a current at a terminal of rotating machinery in an electric power system. A torque calculation module may be configured to continuously determine a calculated torque value for the rotating machinery using the representation of the voltage and the current at the terminal of the rotating machinery; and to compare each calculated torque value to a threshold. An action module may be configured to generate an alarm when the calculated torque value exceeds the threshold. A log module may be configured to generate a log comprising a peak of the calculated torque value and a time at which the peak torque value occurs.
    Type: Application
    Filed: October 13, 2017
    Publication date: April 18, 2019
    Applicant: Schweitzer Engineering Laboratories, Inc.
    Inventors: Dale S. Finney, Normann Fischer, Derrick Haas
  • Publication number: 20190111862
    Abstract: An electronics assembly comprising at least one circuit board substrate comprising a fluid inlet channel and a fluid outlet channel and at least one heat generating component coupled to the circuit board substrate. The at least one heat generating component is fluidly coupled to the fluid inlet channel and the fluid outlet channel. A heat exchanger is directly coupled to the circuit board substrate and comprises an inlet plenum fluidly coupled to the fluid outlet channel of the circuit board substrate and an outlet plenum fluidly coupled to the inlet channel of the circuit board substrate. A pump is fluidly coupled to the circuit board substrate and the heat exchanger.
    Type: Application
    Filed: October 12, 2017
    Publication date: April 18, 2019
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Ercan M. Dede
  • Publication number: 20190115813
    Abstract: A winding device includes a winding core configured to take up a wire, wherein the winding core includes an inner winding core configured to be rotated by a rotating part and an outer winding core configured to surround the inner winding core and rotate together with the inner winding core.
    Type: Application
    Filed: September 11, 2017
    Publication date: April 18, 2019
    Applicant: NITTOKU ENGINEERING CO., LTD.
    Inventors: Ryuto TOMINAGA, Koji KONDO
  • Publication number: 20190115456
    Abstract: A horizontal current bipolar transistor comprises; an n-hill layer on a substrate, forming a first pn-junction with the substrate; a n+ diffusion layer on the substrate, adjacent to the n-hill layer, forming a n+n junction with the n-hill layer; an intrinsic base layer on the n-hill layer and comprising a portion of a sidewall inclined at an acute angle to the substrate plane, forming a second pn-junction with the n-hill layer; an extrinsic base layer on the n-hill layer, forming a third pn-junction with the n-hill layer, and a p+p junction with the intrinsic base layer; a field limiting region on the n-hill layer, forming a fourth pn-junction with the n-hill layer. The field limiting region is spatially separated from the extrinsic base layer and the n+ diffusion layer. The extrinsic base layer and the field limiting region exhibit substantially equal impurity dopant distribution decay towards the substrate.
    Type: Application
    Filed: October 17, 2018
    Publication date: April 18, 2019
    Applicant: University of Zagreb, Faculty of Electrical Engineering and Computing
    Inventors: Marko Koricic, Tomislav Suligoj
  • Publication number: 20190112813
    Abstract: An anchoring wedge with a separable bolt for a simple separation of the anchoring wedge from an anchoring device surrounding a tendon using the separable bolt through efficient adjustment of tensile force and a method of anchoring a tendon using the same are provided.
    Type: Application
    Filed: December 21, 2017
    Publication date: April 18, 2019
    Applicant: KOREA INSTITUTE OF CIVIL ENGINEERING AND BUILDING TECHNOLOGY
    Inventors: Bum Yeon CHO, Heung Youl KIM
  • Publication number: 20190112890
    Abstract: A sealing arrangement having inboard and outboard dynamic seals in a housing separated by a barrier fluid and having a sealed relationship with a relatively movable bearing-guided shaft. A bearing chamber having bearing lubricant exposed to the inboard dynamic seal. The inboard dynamic seal is a hydrodynamic seal having a hydrodynamic pumping action in response to relative rotation between the shaft and the inboard dynamic seal. The hydrodynamic pumping action forcing a film of the bearing lubricant between the inboard dynamic seal and the shaft. The hydrodynamic pumping-related leakage of the inboard dynamic seal being returned to the bearing chamber in which the shaft guidance bearings are located.
    Type: Application
    Filed: October 16, 2018
    Publication date: April 18, 2019
    Applicant: KALSI ENGINEERING INC.
    Inventor: AARON PAUL RICHIE
  • Patent number: D846757
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: April 23, 2019
    Assignee: 3DS ENGINEERING PROCUREMENT CONSTRUCION SUZHOU CO., LTD.
    Inventor: Weiwei Zhu