Abstract: Disclosed are a spherical steel bearing, an intelligent bearing and a bearing monitoring system, belonging to the technical field of bearings. The spherical steel bearing comprises a top bearing plate, a bottom bearing plate, a spherical steel plate and a base plate, wherein the base plate are stacked together with the top bearing plate or the bottom bearing plate. A pressure sensing unit is arranged between the top bearing plate and the base plate or between the bottom bearing plate and the base plate. The intelligent bearing includes a data acquisition unit, a data output unit and the spherical steel bearing, the data acquisition unit transmitting the bearing pressure measured by the pressure sensing unit to the data output unit. The bearing monitoring system includes a data acquisition unit, a data output unit, a monitoring center and the spherical steel bearing.

Abstract: A semiconductor package structure and a fabrication method thereof are provided. The fabrication method comprises: providing a substrate strip, the substrate strip comprising a plurality of substrate units which comprise a substrate unit; disposing a plurality of chips on the plurality of substrate units; disposing a packaging encapsulant on the substrate strip to encapsulate the chips; forming a warp-resistant layer on a top surface of the packaging encapsulant; and dividing the substrate strip to separate the plurality of substrate units to further fabricate a plurality of semiconductor package structures which comprise a semiconductor package structure comprising the substrate unit, wherein the warp-resistant layer is formed of a selected material with a selected thickness to make a variation of warpage of the semiconductor package structure at a temperature between 25° C. and 260° C. to be smaller than 560 ?m.

Abstract: Disclosed herein are an apparatus and a method for mixing and/or mulling a sample, the apparatus comprising at least one container made of a flexible material and containing a sample, means for holding the container, and means for impacting the container, wherein the means for holding and the means for impacting are movable relative to each other, and wherein the means for holding, the means for impacting, and the container are arranged such that the means for impacting and the container can repeatedly collide, whereby an energy of collision can be imparted to the sample, thereby mixing and/or mulling the sample. Also disclosed is an assembly for performing high throughput experiments including the apparatus for mixing and/or mulling a sample and an extruder configured to receive a sample weighing less than 100 grams.

Abstract: Coupling apparatus (80) for coupling a mower (3) to a front three-point linkage of a tractor comprises a mounting element (17) for coupling to the three-point linkage and a carrier element (19) to which the mower (3) is coupled. A linkage mechanism (20) comprising upper link members (81) and a lower link member (23) couples the carrier element (19) to the mounting element (17). The lower link member (23) is pivotally coupled to the mounting element (17) about a first lower pivot axis (30). A pair of take-up springs (45) act between the lower link member (23) and the mounting element (17) to take up a portion of the weight of the mower (3). The take-up springs (45) are coupled between corresponding anchor elements (60) and corresponding anchor brackets (49) on the lower link member (23). The anchor elements (60) are carried on respective compensating arms (88), which in turn are pivotal on pivot shafts (53) carried on the mounting element (17).

Abstract: A parking notification system for identifying a location of a vehicle includes a controller, a processor, a non-transitory computer readable memory, a camera, and a machine-readable instruction set. The controller includes the processor and the non-transitory computer readable memory. The camera is communicatively coupled to the controller, where the camera automatically captures image data and transmits the image data to the controller. The machine-readable instruction set is stored in the non-transitory computer readable memory and causes the processor to determine when the vehicle enters a parking area, activate the camera in response to determining that the vehicle has entered the parking area, receive the image data from the camera once activated, determine when the vehicle is parked, determine parking information from the image data, and transmit the parking information automatically to an output of the controller in response to determining that the vehicle is parked.

Abstract: A robot device having a driven unit is proposed, wherein the driven unit is conceived for approaching surfaces. The driven unit according to the present invention is covered with a protective layer from a coating material which is electrically conductive and has a thickness of at least 4 millimeters.

Abstract: A modular reconfigurable surgical robot for use in association with a surgical tool is disclosed. The surgical robot includes a linear module for linear movement; a turret module for rotational movement, and elbow roll module for rotational movement, and a wrist tilt module for rotational movement. The turret module has a turret rotational axis. The elbow roll module for rotational has an elbow roll rotational axis at an angle to the turret rotational axis. The wrist tilt module has a wrist tilt rotational axis at an angle to the turret rotational axis and the elbow roll rotational axis. The linear module, turret module, elbow roll module and wrist tilt module are operably connectable together to form the surgical robot and one of the modules is operably connectable to the surgical tool. The surgical robot may include an arch device unit attachable to one of the other modules.

Abstract: The embodiments described herein generally relate a downhole probe assembly incorporating a Bluetooth device for wirelessly transmitting electrical information between the downhole probe assembly and a surface electronic interface such as a computer when the probe assembly is above ground. The downhole probe assembly includes sensors for sensing downhole conditions; a controller in electrical communication with the sensors and configured to receive and process information from the sensors; a housing enclosing the one or more than one sensor and the controller; the Bluetooth device in electrical communication with the controller; and an end cap assembly fitted at one end of the housing. The end cap assembly partially surrounds the Bluetooth device and is configured for transmission of the electrical information therethrough. Also described is an end cap assembly for fitting to one end of a downhole probe assembly including a transmission module mated with and electrically connected to the Bluetooth device.

Abstract: This invention relates to an apparatus and method for detecting the condition of a pipeline wall and analysis and estimate of the life of the pipeline by using an apparatus mounted externally of the pipeline and provided to be moved about and/or along at least a portion of the same. The apparatus includes at least one sensor array which includes a plurality of sensors axially offset to provide data for analysis and identification of pipeline defects.

Abstract: An optical module includes a carrier, a light-emitting component disposed over the carrier, an optical sensor disposed over the carrier, a housing, and a lens. The housing is disposed over the carrier and encircles the light-emitting component and the optical sensor. The housing defines a first accommodation space including a first aperture and a second aperture below the first aperture. The housing includes a first sidewall surrounding the first aperture, a second sidewall surrounding the second aperture, and a first support portion where a bottom end of the first sidewall and a top end of the second sidewall meet. The lens is located in the first aperture and is supported by the first support portion. One of the light-emitting component or the optical sensor is located in the first accommodation space.

Abstract: A wing foil bearing may include one or more wing or tab foil layers. A tab foil layer may comprise a thin material with a two-dimensional array of tab shapes. A tab shape may be defined by a boundary of material separated from the thin material and having an integral edge and a free edge. Tab shapes may include one or more free-state bends relative to the thin material, forming a two-dimensional array of cantilever wings or tabs. Tab arrays may be one or more of various types or two-dimensional arrays, and a tab foil layer may include additional tab arrays and tabs. One or more tab foil layers may be engaged with a mounting surface layer and a counter-surface layer to form a wing foil bearing. Tab foil layers may be stacked and or nested, including partial nesting and complete nesting.

Abstract: A device manufacturing method forms a liquid immersion area under a projection system via which an exposure light is projected, while supplying a liquid via a liquid supply inlet of a liquid retaining member and collecting the supplied liquid along with a gas via a liquid recovery outlet of the liquid retaining member. The liquid retaining member surrounds a tip portion of the projection system, which has a last optical element having a surface. The liquid retaining member has a surface opposite to the surface of the last optical element with a gap between the surfaces. A substrate is exposed with the exposure light through the liquid of the liquid immersion area, while moving the substrate below and relative to the projection system and the liquid retaining member. One of the liquid and the gas is separated from the other which have been collected via the liquid recovery outlet.

Abstract: A method and a system for optimizing utilization of a programmable logic element for use in an electronic control unit for vehicles, wherein the programmable logic element has a soft CPU and/or an unused remaining area. A plurality of model variants is generated that reproduce functionality of the control unit, and generate a plurality of soft CPU configurations with differing configuration scope, which occupy an area corresponding to the configuration scope of the programmable logic element, and execute processor-in-the-loop simulations for the plurality of model variants and/or soft CPU configurations after instantiation of the soft CPU corresponding to the soft CPU configuration on a programmable logic element. The profiling data acquired for the soft CPU during the PIL simulation is used with regard to the processing of the input signal for optimizing utilization of the programmable logic element.

Abstract: An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.

Abstract: A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.

Abstract: A rectifying circuit for high-frequency power supply that rectifies an alternating voltage at a high frequency exceeding 2 MHz, the rectifying circuit for high-frequency power supply including a bridge rectifier circuit that rectifies the alternating voltage inputted from a reception antenna for power transmission, a matching functional circuit that matches a resonance condition to that of the reception antenna for power transmission, and a smoothing functional circuit that smooths the voltage rectified by the bridge rectifier circuit into a direct voltage, in which the rectifying circuit for high-frequency power supply causes the bridge rectifier circuit to perform partial resonant switching in a switching operation at the time of rectification by using the matching functional circuit and the smoothing functional circuit.

Abstract: Systems and methods for monitoring uterus contraction activity and progress of labor. The system of the subject invention can comprises (1) a plurality of sensors; (2) an amplifying/filtering means; (3) a computing means; and (4) a graphical user interface. Accurate clinical data, which can be extracted and provided to the user in real-time using the system of the invention, include without limitation, progress of labor, prediction and monitoring of preterm labor, and intrauterine pressure prediction. In a preferred embodiment, the system of the invention includes an intelligence means, such as a neural network system, to analyze and interpret clinical data for use in clinical diagnosis as well as delivery strategy.

Abstract: Sensors, devices, apparatus, systems and methods for replacing microlens arrays with one or more switchable diffractive waveplate microlens arrays for providing measurements of wavefronts and intensity distribution in light beams with high spatial resolution with a single optical radiation sensor. The device acts like a conventional Shack-Hartmann wavefront sensor when the microlens array elements are in focusing state, and the device performs light beam intensity profile characterization acting as a beam profiler when the optical power of lens array elements is switched off.

Abstract: The present disclosure relates to a semiconductor package structure and semiconductor process. The semiconductor package includes a first substrate, a second substrate, a die, a plurality of interconnection elements and an encapsulation material. Each of the interconnection elements connects the first substrate and the second substrate. The encapsulation material encapsulates the interconnection elements. The encapsulation material defines a plurality of accommodation spaces to accommodate the interconnection elements, and the profile of each accommodation space is defined by the individual interconnection element, whereby the warpage behavior of the first substrate is in compliance with that of the second substrate during reflow.

Abstract: A mechanical lumbar system for vehicle seating. The lumbar system may be compact in size so as to require a smaller space within vehicle seating. The lumbar system may be adjustable in 4-ways. The lumbar system may be adjustable in an in and out fashion so as to decrease and increase, respectively, the amount of lumbar support. The lumbar system may be adjustable vertically so as to allow the vertical position of the lumbar support to be moved to accommodate the occupant. The lumbar system may utilize a U-shaped lower bridge member that allows the motors to be positioned vertically higher in the seat back while also allowing the lumbar support to be positioned below the motors. The legs of the lower bridge may extend below the lower frame cross member in the vehicle seat.