Patents Assigned to Engineering
  • Publication number: 20180056381
    Abstract: A die casting machine includes a stationary die half, an ejector holder block, and die core pieces that extend through the ejector holder block, defining a die cavity when closed. An ejector box backstops the closed ejector holder block and die core pieces. Melt is injected into the die cavity. After a first dwell time, the ejector box is retracted away from the ejector holder block while a closing force is simultaneously applied to maintain the ejector holder block closed on the stationary die half, and the die core pieces are retracted out of the die cavity. After a second dwell time, the melt completely freezes and the ejector block is separated from the stationary die half, opening the die cavity from which the resulting die cast block can be retrieved.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 1, 2018
    Applicant: EXCO ENGINEERING, A DIVISION OF EXCO TECHNOLOGIES LIMITED
    Inventor: WARREN J. BISHENDEN
  • Publication number: 20180062749
    Abstract: The present disclosure pertains to systems and methods for low-power optical transceivers. In one embodiment, a low-power optical transceiver may include a microcontroller and an optical receiver and an optical transmitter in communication with and controlled by the microcontroller. The optical receiver may include a photodetector configured to receive a first optical representation of a first signal to be received and to generate an electrical representation of the first signal. An amplifier may amplify the electrical representation of the first signal, and an output in electrical communication with the amplifier may generate an electrical output. The optical transmitter may include a laser diode configured to generate a second optical representation of a second signal to be transmitted. The microcontroller may be configured to control an output power of the laser diode.
    Type: Application
    Filed: August 22, 2017
    Publication date: March 1, 2018
    Applicant: Schweitzer Engineering Laboratories, Inc.
    Inventors: David M. Rector, Raymond W. Rice, Steven Watts, Vince B. Hadley
  • Publication number: 20180061813
    Abstract: A semiconductor device package including a first encapsulation layer, a redistribution layer disposed on the first encapsulation layer, a first die disposed on the redistribution layer, a second encapsulation layer covering the first die and the redistribution layer, and an electrical connection terminal electrically connected to the redistribution layer. The first encapsulation layer has a first surface and a second surface different from the first surface. The first encapsulation layer surrounds a portion of the electrical connection terminal and exposes the electrical connection terminal.
    Type: Application
    Filed: August 11, 2017
    Publication date: March 1, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Ming HSIEH, Yu-Pin TSAI, Man-Wen TSENG, Li-Hao LYU
  • Publication number: 20180058821
    Abstract: In one embodiment, there is disclosed a modular, blast resistant suspension module for an armored vehicle. Each suspension module has a first and second axle assembly. The first axle assembly has a Short-Long Arm (SLA) suspension system pivotally connected to a blast resistant differential housing and the second axle assembly has a Road Arm (RA) suspension system pivotally connected to the differential housing. The suspension modules may be used to form 4×4 or 8×8 vehicle configurations.
    Type: Application
    Filed: August 24, 2016
    Publication date: March 1, 2018
    Applicant: Pratt & Miller Engineering and Fabrication, Inc.
    Inventors: Kevin R. Kwiatkowski, Kris Houghton, Celyn M. Evans, Benjamin J. Wright
  • Publication number: 20180056583
    Abstract: A shaping device that shapes a 3D object includes: an inkjet head, which is a discharging head and discharges a material of shaping; a main scanning driver; a layering direction driver; and a controller, where the controller causes the inkjet head to carry out a plurality of main scanning operations with respect to each position within a plane orthogonal to a layering direction, and when an amount of the material of shaping discharged from the inkjet head per unit area in one main scanning operation with respect to a region to which the material of shaping is to be discharged is defined as a unit area discharging amount, the unit area discharging amount in some main scanning operations is less than the unit area discharging amount in the other main scanning operations of the plurality of main scanning operations carried out with respect to each position.
    Type: Application
    Filed: August 31, 2017
    Publication date: March 1, 2018
    Applicant: MIMAKI ENGINEERING CO., LTD.
    Inventors: Kazuhiro Ochi, Masakatsu Okawa
  • Publication number: 20180058820
    Abstract: An improved multiple layer hull system may be used in vehicle applications. An upper hull may be monolithic or may have a plurality of seams. A sacrificial lower hull may be entirely U-shaped or partially flat-bottomed, or may have a U-shaped or partially flat-bottomed base with outwardly extending wings complementing a lower surface of the upper hull. A blast deflector may be beneath the lower hull or base either as a separate part or as an integral part.
    Type: Application
    Filed: August 24, 2016
    Publication date: March 1, 2018
    Applicant: Pratt & Miller Engineering and Fabrication, Inc.
    Inventors: Kevin R. Kwiatkowski, Kris Houghton, Celyn M. Evans
  • Publication number: 20180055398
    Abstract: An EEG monitor adapted for being arranged in the ear region of a person and including a housing (11) holding a power supply (25) and an EEG signal processor (10). The EEG monitor (5) includes an EEG sensing part (12) having EEG electrodes (17). The EEG sensing part (12) is adapted for arrangement subcutaneously at the scalp or in the ear canal of the person, and the housing (11) is individually shaped to fit behind or above an ear of the person and into the cleft between a pinna and the skull of the person.
    Type: Application
    Filed: November 1, 2017
    Publication date: March 1, 2018
    Applicant: T&W Engineering A/S
    Inventors: Soren Erik WESTERMANN, Rasmus Stig JENSEN
  • Publication number: 20180061727
    Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.
    Type: Application
    Filed: August 11, 2017
    Publication date: March 1, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Li-Hao LYU, Chieh-Ju TSAI, Yu-Kai LIN, Wei-Ming HSIEH, Yu-Pin TSAI, Man-Wen TSENG, Yu-Ting LU
  • Publication number: 20180063487
    Abstract: A method of monitoring and verifying weather information using a weather condition detection system of a vehicle is provided. The method includes receiving weather information by a computing device within the vehicle. The weather information is verified locally at the vehicle using the computing device. Verifying the weather information includes optically verifying the weather information using a vehicle video system of the vehicle comprising a camera.
    Type: Application
    Filed: August 26, 2016
    Publication date: March 1, 2018
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Sergei I. Gage, Arata Sato
  • Publication number: 20180060457
    Abstract: A computer-implemented method for comparing block diagrams, the block diagrams describing a temporal evolution and/or internal states of a dynamic system in a technical computing environment on a host computer, wherein a block in the block diagram may comprise input ports for receiving signals and output ports for sending signals. The method includes opening a first block diagram, converting the first block diagram to an intermediate form, the conversion comprising filtering using a filter script, opening a second block diagram, converting the second block diagram to an intermediate form, the conversion comprising filtering using a filter script, determining existing differences between the intermediate form of the first block diagram and the intermediate form of the second block diagram, and outputting the determined differences. Also, a non-transitory computer readable media and computer system is provided.
    Type: Application
    Filed: August 29, 2016
    Publication date: March 1, 2018
    Applicant: dSPACE digital signal processing and control engineering GmbH
    Inventors: Ulf HOMANN, Michael KNAUP
  • Publication number: 20180056658
    Abstract: A sub tank (40) which is mounted in an inkjet printer including an inkjet head for discharging UV ink and supplies UV ink to the inkjet head includes a space forming unit (41) which forms a space (40a) including an ink storage chamber (40b) for storing UV ink and a pump communication port communicating with a pump for making a pressure in the space (40a) negative, and a liquid-proof ventilation filter (44) which is disposed in the space (40a), allows gas to be circulated, and does not allow the UV ink to be circulated so as to prevent the UV ink from flowing out from the space (40a) to the pump communication port.
    Type: Application
    Filed: August 22, 2017
    Publication date: March 1, 2018
    Applicant: MIMAKI ENGINEERING CO., LTD.
    Inventor: Hiroshi Kobayashi
  • Publication number: 20180060467
    Abstract: A method for simulating a collision situation between two vehicles for testing a driver assistance system in a driving simulator or in a Vehicle-in-the-Loop scenario. A fellow vehicle simulated on a simulation computer is assigned a trajectory that passes through a point of collision of a planned collision between the fellow vehicle and an ego vehicle that is not controlled by the simulation computer. The driver assistance system is equipped to exchange data with the simulated environment in real time and to influence the driving behavior of the ego vehicle in a collision situation. A target distance to the point of collision is determined for the fellow vehicle that the fellow vehicle would have to have in order to arrive at the point of collision simultaneously or substantially simultaneously with the ego vehicle, under the assumption that it travels at the specified arrival speed.
    Type: Application
    Filed: August 30, 2017
    Publication date: March 1, 2018
    Applicant: dSPACE digital signal processing and control engineering GmbH
    Inventors: Sebastian SCHULTE, Frank Schuette, Rainer FRANKE, Martin KLUSTRACH
  • Publication number: 20180056880
    Abstract: A vehicle includes a rear door assembly having an open configuration that allows access to a rear storage volume and a closed configuration that inhibits access to the rear storage volume. A multi-level rear storage system is located in the rear storage volume. The multi-level storage system has a retracted configuration where a shelf member is relatively near a rear floor of the rear storage volume and an extended configuration with the shelf member spaced-apart from the rear floor thereby defining an upper rear storage volume above the shelf member and a lower rear storage volume below the shelf member.
    Type: Application
    Filed: August 26, 2016
    Publication date: March 1, 2018
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Sergei I. Gage, Arata Sato
  • Publication number: 20180056343
    Abstract: Embodiments of the invention provide an intake apparatus for a local ventilation system. According to at least one embodiment, the intake apparatus includes a connection opening, a hood configured to connect an intake opening larger than the connection opening, an intake duct coupled to the hood while communicating with the connection opening. and an intake fan which is installed at a peripheral portion of the intake opening so as to generate an intake air current in the direction of the connection opening.
    Type: Application
    Filed: October 26, 2016
    Publication date: March 1, 2018
    Applicant: JEJIN ENGINEERING CO., LTD.
    Inventor: Hyung Ryer KIM
  • Publication number: 20180057317
    Abstract: A lifting apparatus may include a bolt assembly and a nut assembly. The bolt assembly may include a support plate, a bolt and a lifting eye attached to the support plate. The nut assembly may include a support plate, a nut and a handle attached to at least one of the support plate and the nut. A tether may also be included to connect the bolt assembly to the nut assembly.
    Type: Application
    Filed: August 27, 2017
    Publication date: March 1, 2018
    Applicant: Safety Products Engineering Group, Inc.
    Inventor: Scott Spencer
  • Publication number: 20180056815
    Abstract: An improved seating system is provided for vehicles, including military vehicles. Center-facing seats are staggered to provide for a narrow vehicle profile, improved ingress and egress, and increased blast survivability. Seats may be reclined or reclinable, and seats may have seat pans upwardly movable away from a center aisle between rows of seats to increase an effective width of the aisle for improved ingress and egress.
    Type: Application
    Filed: August 24, 2016
    Publication date: March 1, 2018
    Applicant: Pratt & Miller Engineering and Fabrication, Inc.
    Inventors: Kevin R. Kwiatkowski, Kris Houghton, Celyn M. Evans
  • Publication number: 20180060036
    Abstract: A vehicle service system configured to modify an ongoing vehicle service procedure in response to changes in vehicle wheel alignment angles which alter the vehicle tracking, thrust line, or thrust angle, in a manner which will affect the operation of an onboard vehicle safety system sensor which is aligned or calibrated relative to a selected characteristic of the vehicle.
    Type: Application
    Filed: August 29, 2017
    Publication date: March 1, 2018
    Applicant: Hunter Engineering Company
    Inventors: Ryan J. Frisch, Blackford F. Brauer
  • Publication number: 20180061767
    Abstract: A semiconductor package structure includes a semiconductor substrate, at least one semiconductor die, an encapsulant, a protection layer, a plurality of conductive elements and a redistribution layer. The semiconductor die is disposed on the semiconductor substrate. The encapsulant covers at least a portion of the semiconductor die, and has a first surface and a lateral surface. The protection layer covers the first surface and the lateral surface of the encapsulant. The conductive elements surround the lateral surface of the encapsulant. The redistribution layer electrically connects the semiconductor die and the conductive elements.
    Type: Application
    Filed: August 31, 2017
    Publication date: March 1, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuan-Feng CHIANG, Cong-Wei CHEN, I-Ting CHI, Shao-An CHEN
  • Publication number: 20180062205
    Abstract: An aqueous electrolyte composition suitable for a lithium ion battery is provided. The aqueous electrolyte composition contains water, at least one of a linear ether and a cyclic ether and a lithium fluoroalkylsulfonyl salt. A lithium ion battery containing the aqueous electrolyte and a vehicle at least partially powered by the battery are also provided.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 1, 2018
    Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Kensuke TAKECHI, Ruidong YANG
  • Publication number: 20180061805
    Abstract: A semiconductor package structure includes at least one semiconductor die, at least one conductive pillar, an encapsulant and a circuit structure. The semiconductor die has an active surface. The conductive pillar is disposed adjacent to the active surface of the semiconductor die. The encapsulant covers the semiconductor die and the conductive pillar. The encapsulant defines at least one groove adjacent to and surrounding the conductive pillar. The circuit structure is electrically connected to the conductive pillar.
    Type: Application
    Filed: August 22, 2017
    Publication date: March 1, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsu-Nan FANG, Chun-Jun ZHUANG