Patents Assigned to Engineering
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Patent number: 12051906Abstract: A DC bus collection system for a wind farm reduces the overall required number of converters and minimizes the energy storage system requirements. The DC bus collection system implements a power phasing control method between wind turbines that filters the variations and improves power quality. The phasing control method takes advantage of a novel power packet network concept with nonlinear power flow control design techniques that guarantees both stable and enhanced dynamic performance.Type: GrantFiled: March 2, 2022Date of Patent: July 30, 2024Assignees: National Technology & Engineering Solutions of Sandia, LLC, Michigan Technological UniversityInventors: Wayne W. Weaver, David G. Wilson, Rush D. Robinett, III
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Patent number: 12050056Abstract: A method for liquefying a feed gas stream. A refrigerant stream is cooled and expanded to produce an expanded, cooled refrigerant stream. Part or all of the expanded, cooled refrigerant stream is mixed with a make-up refrigerant stream in a separator, thereby condensing heavy hydrocarbon components from the make-up refrigerant stream and forming a gaseous expanded, cooled refrigerant stream. The gaseous expanded, cooled refrigerant stream passes through a heat exchanger zone to form a warm refrigerant stream. The feed gas stream is passed through the heat exchanger zone to cool at least part of the feed gas stream by indirect heat exchange with the expanded, cooled refrigerant stream, thereby forming a liquefied gas stream. The warm refrigerant stream is compressed to produce the compressed refrigerant stream.Type: GrantFiled: December 15, 2022Date of Patent: July 30, 2024Assignee: ExxonMobil Technology and Engineering CompanyInventors: Yijun Liu, Fritz Pierre, Jr.
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Patent number: 12049792Abstract: A double-channel fluid injection apparatus includes a main shaft, a bearing box, and a sealing box. The main shaft includes an outer tube and an inner tube. An internal channel of the inner tube and a vertical through channel constitute a first fluid passageway. The inner tube and the outer tube form an annular gap, and a channel D is radially formed at a lower part of the outer tube and is in communication with the annular gap, thus constituting a second fluid passageway. The bearing box is mounted on a boss of the outer tube. The sealing box includes a sealing cylinder fixedly connected to a lower end of a lower end cap of the bearing box. A channel E in communication with the second fluid passageway is radially formed at a position of the sealing cylinder corresponding to the channel of the outer tube.Type: GrantFiled: June 10, 2020Date of Patent: July 30, 2024Assignees: SINOPEC PETROLEUM ENGINEERING TECHNOLOGY SERVICE CO., LTD., SINOPEC SHENGLI PETROLEUM ENGINEERING CO., LTD., DRILLING TECHNOLOGY RESEARCH INSTITUTE OF SINOPEC SHENGLI PETROLEUM ENGINEERING CO., LTD.Inventors: Huangang Zhu, Jiancheng Li, Haoyu Sun, Qiang Cao, Yong Chen, Dejing Yang, Zongqing Li, Chang Wang, Rongrong Song, Ping Xu
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Patent number: 12050164Abstract: A throughflow measurement system for measuring a fluid throughflow through a pipe includes a first measurement arrangement having at least two ultrasonic transducers and that is configured to determine a value for the fluid throughflow through the pipe on the basis of transit times of ultrasonic signals transmitted and received with and against the flow. A second measurement arrangement includes a plurality of hot-wire sensors that are arranged distributed over the cross-section of the pipe and that are each configured to determine a local flow value. An evaluation device is in signal connection with the first measurement arrangement and the second measurement arrangement and is configured to determine a flow profile on the basis of the local flow values determined by the hot-wire sensors and to modify the value for the fluid throughflow, which is determined by the first measurement arrangement, on the basis of the determined flow profile.Type: GrantFiled: July 28, 2022Date of Patent: July 30, 2024Assignee: SICK ENGINEERING GMBHInventors: Markus Klemm, Eric Starke, Mario Künzelmann
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Patent number: 12050449Abstract: The present disclosure relates to an online monitoring method of a nuclear power plant system based on an isolation forest method and a sliding window method. An isolation forest method used in the present disclosure is an abnormal detection model based on the idea of binary tree division, and has no requirements on the dimension and linear characteristics of monitoring data. In view of the characteristics of strong nonlinearity and high dimension of operation data of the nuclear power plant system, in the process of state monitoring, system abnormalities can be detected more quickly and accurately. In the present disclosure, a sliding window method is used to improve an isolation forest model, so that the improved isolation forest model has the functions of model online updating and real-time state monitoring, and the usability of an isolation forest state monitoring method is enhanced.Type: GrantFiled: March 10, 2022Date of Patent: July 30, 2024Assignee: Harbin Engineering UniversityInventors: Yongkuo Liu, Xin Ai, Longfei Shan, Xueying Huang
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Publication number: 20240250053Abstract: A semiconductor device includes a semiconductor die having a first surface and a second surface opposite to the first surface, a plurality of first real conductive pillars in a first region on the first surface, and a plurality of supporters in a second region adjacent to the first region. An area density of the plurality of supporters in the second region is in a range of from about 50% to about 100% to an area density of the plurality of first real conductive pillars in the first region. A method for manufacturing a semiconductor package including the semiconductor device is also disclosed in the present disclosure.Type: ApplicationFiled: March 5, 2024Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Hsin He HUANG
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Publication number: 20240246376Abstract: A device for fitting/removing tires comprising one supporting frame associable with a tire changing machine and movable along one substantially vertical direction of work, to vary the level thereof with respect to a rim of a wheel; one working tool associated in a movable manner with the supporting frame at least between a first working position and a second working position and adapted to interact with a tire to fit/remove the tire on/from the rim; one probe member connected to the supporting frame, adapted to abut against the tire and operatively connected to the working tool in such a way as to activate the displacement thereof with respect to the supporting frame from the first working position to the second working position due to the interaction of the probe member itself with the tire.Type: ApplicationFiled: May 23, 2022Publication date: July 25, 2024Applicant: M & B ENGINEERING S.r.l.Inventor: Cristiano TAROZZI
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Publication number: 20240246302Abstract: A method for joining unidirectional tapes is provided. The method includes placing a plurality of unidirectional tapes by abutting without overlapping an end of one of the unidirectional tapes with an end of other one of the unidirectional tapes at a butt joint. The unidirectional tapes includes a resin material and a plurality of fibers running in a running direction. The method further includes placing a prepreg including a resin material and a plurality of short fibers over the butt joint to cover an area surrounding the butt joint such that the short fibers run in the running direction. The method further includes fusing the prepreg by applying heat such that the short fibers are fused into a matrix of the unidirectional tapes at the butt joint.Type: ApplicationFiled: January 25, 2023Publication date: July 25, 2024Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki KaishaInventor: Nobuya Kawamura
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Publication number: 20240249988Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a substrate, an electronic component, an intermediate structure and a protective layer. The electronic component is disposed over the substrate. The intermediate structure is disposed over the substrate and comprises an interposer and a conductive element on the interposer. The protective layer is disposed over the substrate and has an upper surface covering the electronic component and being substantially level with an upper surface of the conductive element.Type: ApplicationFiled: January 19, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Chang CHEN, Wei-Tung CHANG, Jen-Chieh KAO
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Publication number: 20240250030Abstract: An electronic device is provided. The electronic device includes an inductor and a dielectric layer. The inductor includes a first magnetic layer, a conductive trace over the first magnetic layer, and a second magnetic layer over the conductive trace. The dielectric layer includes a first portion between the second magnetic layer and an inclined surface of the first magnetic layer. A substantially constant distance between the second magnetic layer and the inclined surface of the first magnetic layer is defined by the dielectric layer.Type: ApplicationFiled: January 23, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien Lin CHANG CHIEN, Yuan-Chun TAI, Chiu-Wen LEE, Yu-Hsun CHANG, Tai-Yuan HUANG
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Publication number: 20240249958Abstract: A method for manufacturing a semiconductor package and an apparatus for flattening a workpiece are provided. The method includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface; applying a first force to a first region of the upper surface of the panel along at least one direction from the panel toward the stage; and transferring the first force from the first region to a second region of the upper surface of the panel different from the first region.Type: ApplicationFiled: January 20, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ya Fang CHAN, Cong-Wei CHEN, Kuoching CHENG, Shih-Yu WANG
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Publication number: 20240247620Abstract: An apparatus and method are provided for a fuel bowl to supply liquid fuel to a carburetor. The fuel bowl comprises a float chamber and a fuel inlet cavity which receives a fuel delivery insert. The fuel delivery insert receives a fuel inlet valve and comprises passages to direct incoming fuel to a bottom portion of the float chamber. A float comprises an elongate member rotatably hinged within a float cavity of the fuel delivery insert, such that the float rises according to a quantity of fuel within the float chamber. The fuel inlet valve supplies liquid fuel to the float chamber by way of the passages according to the operation of the float within the float chamber. A ventilation chamber allows air and fuel vapors to exit as liquid fuel enters the float chamber while preventing liquid fuel from entering into the carburetor.Type: ApplicationFiled: April 1, 2024Publication date: July 25, 2024Applicant: K&N Engineering, Inc.Inventor: John Kyle
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Publication number: 20240250080Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.Type: ApplicationFiled: March 12, 2024Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
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Publication number: 20240250427Abstract: The present disclosure provides an electronic device. The electronic device includes an antenna. The antenna includes a first conductive element, a second conductive element, and a switch circuit. The first conductive element is configured to transmit a first signal along a first direction. The second conductive element is configured to transmit a second signal along a second direction different from the first direction. The switch circuit is configured to electrically couple a ground to the first conductive element and/or the second conductive element.Type: ApplicationFiled: January 23, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Hao CHANG, Wei-Chun LEE
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Publication number: 20240248007Abstract: An autonomous surface vessel includes an elongate body, and a sampling system operatively coupled to the body and including one or more sampling modules, wherein each sampling module includes a housing including a storage container, a sampling material receivable within the storage container, an actuation system operatively coupled to the sampling material via a lead line, and an end cap operatively coupled to the lead line and matable with an open end of the storage container. A computer system is in communication with the sampling system to operate the actuation system, wherein each sampling module is actuatable between a stowed state, where the sampling material is received within the storage container and the end cap sealingly engages the open end, and a deployed state, where the end cap is disengaged from the open end and the sampling material is drawn out of the sampling container.Type: ApplicationFiled: April 22, 2022Publication date: July 25, 2024Applicant: EXXONMOBIL TECHNOLOGY AND ENGINEERING COMPANYInventors: William P. Meurer, David T. Wang, Gregory W. Shipman, Jeffrey D. Spitzenberger, Michael Sutton, Jeffrey C. Bridges, Paul Moreno
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Publication number: 20240250006Abstract: The present disclosure provides a package structure. The package structure includes a die bonding region and a first lead region. The first lead region extends along a first direction. The first direction is along a first edge of the die bonding region. The first lead region includes a first high density lead region and a first low density lead region. The first high density lead region overlaps the first low density lead region in the first direction.Type: ApplicationFiled: January 19, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: I-Jen CHEN
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Publication number: 20240246109Abstract: Systems and methods herein provide for covering the tips of nozzles of urethane robots. A tip cover includes a first housing portion having a first inner wall curved to form a first cavity, the first housing portion having a first channel recessed into the first inner wall. A second housing portion has a second inner wall curved to form a second cavity, the second housing portion having a second channel recessed into the second inner wall. The first and second housing portions are configured to be mated together such that the first and second cavities together form a chamber to enclose or surround a nozzle tip, and the first and second channels together form an O-ring channel for receiving and sealing around an O-ring disposed around the nozzle tip.Type: ApplicationFiled: January 24, 2023Publication date: July 25, 2024Applicants: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: EDWARD A. FOLEY, Matthew T. Downs, Ryan T. Creech
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Publication number: 20240250518Abstract: A system for high-impedance differential protection for power systems using a variety of signals from the power system. A fault may be detected using filtered phase current or filtered phase voltage magnitudes from current transformers (CTs) connected in parallel by phase. A fault may be detected using filtered phase voltages and raw phase voltages from the CTs. A fault may be detected using raw phase currents and raw phase voltages from the CTs. A fault may be detected using filtered phase currents and raw phase currents. A fault may be detected using raw phase currents and raw neutral currents. The embodiments herein maintain dependability and security of a differential element even when low-class CTs are used. The embodiments herein may allow users to optimize pickup settings even when low-class CTs are used.Type: ApplicationFiled: January 22, 2024Publication date: July 25, 2024Applicant: Schweitzer Engineering Laboratories, Inc.Inventors: Normann Fischer, Anushka M. Dissanayake, Jay Hartshorn, Marcos A. Donolo
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Patent number: D1037169Type: GrantFiled: November 30, 2021Date of Patent: July 30, 2024Assignee: Schweitzer Engineering Laboratories, IncInventors: Christopher L. Douglas, Dana E. Anderson
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Patent number: D1037323Type: GrantFiled: September 14, 2023Date of Patent: July 30, 2024Assignee: SLICE ENGINEERING LLCInventor: Christopher Mark Montgomery