Patents Assigned to Engineering
  • Patent number: 12051906
    Abstract: A DC bus collection system for a wind farm reduces the overall required number of converters and minimizes the energy storage system requirements. The DC bus collection system implements a power phasing control method between wind turbines that filters the variations and improves power quality. The phasing control method takes advantage of a novel power packet network concept with nonlinear power flow control design techniques that guarantees both stable and enhanced dynamic performance.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: July 30, 2024
    Assignees: National Technology & Engineering Solutions of Sandia, LLC, Michigan Technological University
    Inventors: Wayne W. Weaver, David G. Wilson, Rush D. Robinett, III
  • Patent number: 12050056
    Abstract: A method for liquefying a feed gas stream. A refrigerant stream is cooled and expanded to produce an expanded, cooled refrigerant stream. Part or all of the expanded, cooled refrigerant stream is mixed with a make-up refrigerant stream in a separator, thereby condensing heavy hydrocarbon components from the make-up refrigerant stream and forming a gaseous expanded, cooled refrigerant stream. The gaseous expanded, cooled refrigerant stream passes through a heat exchanger zone to form a warm refrigerant stream. The feed gas stream is passed through the heat exchanger zone to cool at least part of the feed gas stream by indirect heat exchange with the expanded, cooled refrigerant stream, thereby forming a liquefied gas stream. The warm refrigerant stream is compressed to produce the compressed refrigerant stream.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: July 30, 2024
    Assignee: ExxonMobil Technology and Engineering Company
    Inventors: Yijun Liu, Fritz Pierre, Jr.
  • Patent number: 12049792
    Abstract: A double-channel fluid injection apparatus includes a main shaft, a bearing box, and a sealing box. The main shaft includes an outer tube and an inner tube. An internal channel of the inner tube and a vertical through channel constitute a first fluid passageway. The inner tube and the outer tube form an annular gap, and a channel D is radially formed at a lower part of the outer tube and is in communication with the annular gap, thus constituting a second fluid passageway. The bearing box is mounted on a boss of the outer tube. The sealing box includes a sealing cylinder fixedly connected to a lower end of a lower end cap of the bearing box. A channel E in communication with the second fluid passageway is radially formed at a position of the sealing cylinder corresponding to the channel of the outer tube.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: July 30, 2024
    Assignees: SINOPEC PETROLEUM ENGINEERING TECHNOLOGY SERVICE CO., LTD., SINOPEC SHENGLI PETROLEUM ENGINEERING CO., LTD., DRILLING TECHNOLOGY RESEARCH INSTITUTE OF SINOPEC SHENGLI PETROLEUM ENGINEERING CO., LTD.
    Inventors: Huangang Zhu, Jiancheng Li, Haoyu Sun, Qiang Cao, Yong Chen, Dejing Yang, Zongqing Li, Chang Wang, Rongrong Song, Ping Xu
  • Patent number: 12050164
    Abstract: A throughflow measurement system for measuring a fluid throughflow through a pipe includes a first measurement arrangement having at least two ultrasonic transducers and that is configured to determine a value for the fluid throughflow through the pipe on the basis of transit times of ultrasonic signals transmitted and received with and against the flow. A second measurement arrangement includes a plurality of hot-wire sensors that are arranged distributed over the cross-section of the pipe and that are each configured to determine a local flow value. An evaluation device is in signal connection with the first measurement arrangement and the second measurement arrangement and is configured to determine a flow profile on the basis of the local flow values determined by the hot-wire sensors and to modify the value for the fluid throughflow, which is determined by the first measurement arrangement, on the basis of the determined flow profile.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: July 30, 2024
    Assignee: SICK ENGINEERING GMBH
    Inventors: Markus Klemm, Eric Starke, Mario Künzelmann
  • Patent number: 12050449
    Abstract: The present disclosure relates to an online monitoring method of a nuclear power plant system based on an isolation forest method and a sliding window method. An isolation forest method used in the present disclosure is an abnormal detection model based on the idea of binary tree division, and has no requirements on the dimension and linear characteristics of monitoring data. In view of the characteristics of strong nonlinearity and high dimension of operation data of the nuclear power plant system, in the process of state monitoring, system abnormalities can be detected more quickly and accurately. In the present disclosure, a sliding window method is used to improve an isolation forest model, so that the improved isolation forest model has the functions of model online updating and real-time state monitoring, and the usability of an isolation forest state monitoring method is enhanced.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: July 30, 2024
    Assignee: Harbin Engineering University
    Inventors: Yongkuo Liu, Xin Ai, Longfei Shan, Xueying Huang
  • Publication number: 20240250053
    Abstract: A semiconductor device includes a semiconductor die having a first surface and a second surface opposite to the first surface, a plurality of first real conductive pillars in a first region on the first surface, and a plurality of supporters in a second region adjacent to the first region. An area density of the plurality of supporters in the second region is in a range of from about 50% to about 100% to an area density of the plurality of first real conductive pillars in the first region. A method for manufacturing a semiconductor package including the semiconductor device is also disclosed in the present disclosure.
    Type: Application
    Filed: March 5, 2024
    Publication date: July 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Hsin He HUANG
  • Publication number: 20240246376
    Abstract: A device for fitting/removing tires comprising one supporting frame associable with a tire changing machine and movable along one substantially vertical direction of work, to vary the level thereof with respect to a rim of a wheel; one working tool associated in a movable manner with the supporting frame at least between a first working position and a second working position and adapted to interact with a tire to fit/remove the tire on/from the rim; one probe member connected to the supporting frame, adapted to abut against the tire and operatively connected to the working tool in such a way as to activate the displacement thereof with respect to the supporting frame from the first working position to the second working position due to the interaction of the probe member itself with the tire.
    Type: Application
    Filed: May 23, 2022
    Publication date: July 25, 2024
    Applicant: M & B ENGINEERING S.r.l.
    Inventor: Cristiano TAROZZI
  • Publication number: 20240246302
    Abstract: A method for joining unidirectional tapes is provided. The method includes placing a plurality of unidirectional tapes by abutting without overlapping an end of one of the unidirectional tapes with an end of other one of the unidirectional tapes at a butt joint. The unidirectional tapes includes a resin material and a plurality of fibers running in a running direction. The method further includes placing a prepreg including a resin material and a plurality of short fibers over the butt joint to cover an area surrounding the butt joint such that the short fibers run in the running direction. The method further includes fusing the prepreg by applying heat such that the short fibers are fused into a matrix of the unidirectional tapes at the butt joint.
    Type: Application
    Filed: January 25, 2023
    Publication date: July 25, 2024
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventor: Nobuya Kawamura
  • Publication number: 20240249988
    Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a substrate, an electronic component, an intermediate structure and a protective layer. The electronic component is disposed over the substrate. The intermediate structure is disposed over the substrate and comprises an interposer and a conductive element on the interposer. The protective layer is disposed over the substrate and has an upper surface covering the electronic component and being substantially level with an upper surface of the conductive element.
    Type: Application
    Filed: January 19, 2023
    Publication date: July 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Chang CHEN, Wei-Tung CHANG, Jen-Chieh KAO
  • Publication number: 20240250030
    Abstract: An electronic device is provided. The electronic device includes an inductor and a dielectric layer. The inductor includes a first magnetic layer, a conductive trace over the first magnetic layer, and a second magnetic layer over the conductive trace. The dielectric layer includes a first portion between the second magnetic layer and an inclined surface of the first magnetic layer. A substantially constant distance between the second magnetic layer and the inclined surface of the first magnetic layer is defined by the dielectric layer.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien Lin CHANG CHIEN, Yuan-Chun TAI, Chiu-Wen LEE, Yu-Hsun CHANG, Tai-Yuan HUANG
  • Publication number: 20240249958
    Abstract: A method for manufacturing a semiconductor package and an apparatus for flattening a workpiece are provided. The method includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface; applying a first force to a first region of the upper surface of the panel along at least one direction from the panel toward the stage; and transferring the first force from the first region to a second region of the upper surface of the panel different from the first region.
    Type: Application
    Filed: January 20, 2023
    Publication date: July 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ya Fang CHAN, Cong-Wei CHEN, Kuoching CHENG, Shih-Yu WANG
  • Publication number: 20240247620
    Abstract: An apparatus and method are provided for a fuel bowl to supply liquid fuel to a carburetor. The fuel bowl comprises a float chamber and a fuel inlet cavity which receives a fuel delivery insert. The fuel delivery insert receives a fuel inlet valve and comprises passages to direct incoming fuel to a bottom portion of the float chamber. A float comprises an elongate member rotatably hinged within a float cavity of the fuel delivery insert, such that the float rises according to a quantity of fuel within the float chamber. The fuel inlet valve supplies liquid fuel to the float chamber by way of the passages according to the operation of the float within the float chamber. A ventilation chamber allows air and fuel vapors to exit as liquid fuel enters the float chamber while preventing liquid fuel from entering into the carburetor.
    Type: Application
    Filed: April 1, 2024
    Publication date: July 25, 2024
    Applicant: K&N Engineering, Inc.
    Inventor: John Kyle
  • Publication number: 20240250080
    Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.
    Type: Application
    Filed: March 12, 2024
    Publication date: July 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU
  • Publication number: 20240250427
    Abstract: The present disclosure provides an electronic device. The electronic device includes an antenna. The antenna includes a first conductive element, a second conductive element, and a switch circuit. The first conductive element is configured to transmit a first signal along a first direction. The second conductive element is configured to transmit a second signal along a second direction different from the first direction. The switch circuit is configured to electrically couple a ground to the first conductive element and/or the second conductive element.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Hao CHANG, Wei-Chun LEE
  • Publication number: 20240248007
    Abstract: An autonomous surface vessel includes an elongate body, and a sampling system operatively coupled to the body and including one or more sampling modules, wherein each sampling module includes a housing including a storage container, a sampling material receivable within the storage container, an actuation system operatively coupled to the sampling material via a lead line, and an end cap operatively coupled to the lead line and matable with an open end of the storage container. A computer system is in communication with the sampling system to operate the actuation system, wherein each sampling module is actuatable between a stowed state, where the sampling material is received within the storage container and the end cap sealingly engages the open end, and a deployed state, where the end cap is disengaged from the open end and the sampling material is drawn out of the sampling container.
    Type: Application
    Filed: April 22, 2022
    Publication date: July 25, 2024
    Applicant: EXXONMOBIL TECHNOLOGY AND ENGINEERING COMPANY
    Inventors: William P. Meurer, David T. Wang, Gregory W. Shipman, Jeffrey D. Spitzenberger, Michael Sutton, Jeffrey C. Bridges, Paul Moreno
  • Publication number: 20240250006
    Abstract: The present disclosure provides a package structure. The package structure includes a die bonding region and a first lead region. The first lead region extends along a first direction. The first direction is along a first edge of the die bonding region. The first lead region includes a first high density lead region and a first low density lead region. The first high density lead region overlaps the first low density lead region in the first direction.
    Type: Application
    Filed: January 19, 2023
    Publication date: July 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: I-Jen CHEN
  • Publication number: 20240246109
    Abstract: Systems and methods herein provide for covering the tips of nozzles of urethane robots. A tip cover includes a first housing portion having a first inner wall curved to form a first cavity, the first housing portion having a first channel recessed into the first inner wall. A second housing portion has a second inner wall curved to form a second cavity, the second housing portion having a second channel recessed into the second inner wall. The first and second housing portions are configured to be mated together such that the first and second cavities together form a chamber to enclose or surround a nozzle tip, and the first and second channels together form an O-ring channel for receiving and sealing around an O-ring disposed around the nozzle tip.
    Type: Application
    Filed: January 24, 2023
    Publication date: July 25, 2024
    Applicants: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: EDWARD A. FOLEY, Matthew T. Downs, Ryan T. Creech
  • Publication number: 20240250518
    Abstract: A system for high-impedance differential protection for power systems using a variety of signals from the power system. A fault may be detected using filtered phase current or filtered phase voltage magnitudes from current transformers (CTs) connected in parallel by phase. A fault may be detected using filtered phase voltages and raw phase voltages from the CTs. A fault may be detected using raw phase currents and raw phase voltages from the CTs. A fault may be detected using filtered phase currents and raw phase currents. A fault may be detected using raw phase currents and raw neutral currents. The embodiments herein maintain dependability and security of a differential element even when low-class CTs are used. The embodiments herein may allow users to optimize pickup settings even when low-class CTs are used.
    Type: Application
    Filed: January 22, 2024
    Publication date: July 25, 2024
    Applicant: Schweitzer Engineering Laboratories, Inc.
    Inventors: Normann Fischer, Anushka M. Dissanayake, Jay Hartshorn, Marcos A. Donolo
  • Patent number: D1037169
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: July 30, 2024
    Assignee: Schweitzer Engineering Laboratories, Inc
    Inventors: Christopher L. Douglas, Dana E. Anderson
  • Patent number: D1037323
    Type: Grant
    Filed: September 14, 2023
    Date of Patent: July 30, 2024
    Assignee: SLICE ENGINEERING LLC
    Inventor: Christopher Mark Montgomery