Abstract: Described are systems and methods of storing adsorbing diborane on carbon adsorption medium. The invention discloses a vessel for storing diborane. The vessel includes: a vessel interior; microporous carbon adsorbent in the vessel interior; diborane in the vessel interior at least partially adsorbed on the microporous adsorbent. The microporous adsorbent includes slit pores between graphite layers at a graphite layer spacing that increases an activation energy required for diborane degradation relative to an activation energy of degradation of non-adsorbed gaseous diborane at ambient pressure, and at the same temperature.

Abstract: A door of a reticle pod includes a window having a lens, sidewall, and a ledge. The window may be positioned or affixed internally in a door between the housing and a cover. A compressive seal may be used in conjunction with the window. The sidewalls, the ledge and the compressive seal work together to enable a compression fit in the door while maintained the desired level of protection from external contaminants.

Abstract: An electrostatic discharge tubing segment includes a porous non-conductive interior surface and an adjacent conductive polymer portion. The conductive polymer portion is configured to transfer electrostatic charge generated by a charged fluid passing through the tubing segment to ground such that electrostatic discharge can be mitigated.

Abstract: The present invention relates to compositions and methods for selectively etching silicon nitride in the presence of silicon oxide, polysilicon and/or metal silicides at a high etch rate and with high selectivity. Additives are described that can be used at various dissolved silica loading windows to provide and maintain the high selective etch rate and selectivity.

Abstract: Described are porous sintered metal bodies and methods of making porous sintered metal bodies by additive manufacturing methods.

Abstract: An aseptic closure assembly for a fluid container that includes a cap connectable to an opening of the fluid container and a fluid dispenser connectable to an outer surface of the housing of the cap. The fluid dispenser includes a main body and fluid lines provided within the main body, a shell housing provided around the main body, and an insert connectable to a second end of the main body. The main body includes apertures nearer the second end that are connected to the fluid lines and configured to be in fluid communication with the fluid container when the fluid dispenser is connected to the cap. The fluid dispenser is configured such that a downward directed force towards the fluid container fits the insert into the support of the cavity and disconnects the insert from the main body of the fluid dispenser to seal the fluid container.

Abstract: A flow path for a fluid from a fluid supply which may include a plurality of operative components including a body portion and a plurality of tubing connector fittings. The operative components may be connected by a plurality of tubing segments. Each body portion may include a nonconductive fluoropolymer portion and an outer conductor that extends between each of the plurality of tubing connector fittings and that is unitary with the non-conductive fluoropolymer portion. The plurality of tubing segments may include a non-conductive fluoropolymer tubing portion and an axial strip of conductive polymer. The outer conductor of each body portion conductively connected with tubing segments connected thereto. Each of the connectors may include a bridging component for conductively connecting the respective outer conductor of the body portion to the strip of conductive polymer of the connecting tubing segments.

Abstract: A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer promotes charge dissipation by the conductive polymeric layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymeric layer to be photopatterned. The extent to which the conductive polymeric layer is conductive and photosensitive may be modulated by varying the relative amounts of the conductive polymer and the photosensitive polymer.

Abstract: Coatings applicable to a variety of substrate articles, structures, materials, and equipment are described. In various applications, the substrate includes metal surface susceptible to formation of oxide, nitride, fluoride, or chloride of such metal thereon, wherein the metal surface is configured to be contacted in use with gas, solid, or liquid that is reactive therewith to form a reaction product that is deleterious to the substrate article, structure, material, or equipment. The metal surface is coated with a protective coating preventing reaction of the coated surface with the reactive gas, and/or otherwise improving the electrical, chemical, thermal, or structural properties of the substrate article or equipment. Various methods of coating the metal surface are described, and for selecting the coating material that is utilized.

Abstract: Described are filter cartridges, filter apparatuses, and related methods that involve a filter cartridge that includes a cartridge support that includes centering surfaces, a helical strand, or both.

Abstract: A phase-shift reticle for a photolithography process in semiconductor fabrication is provided. The reticle includes a substrate, a reflective structure, a pattern defining layer and a phase shifter. The reflective structure is disposed over the substrate. The pattern defining layer includes a first material and is deposited over the reflective structure. The pattern defining layer comprises a pattern trench. The phase shifter includes a second material and disposed in the pattern trench. A transmittance of the second material is different from a transmittance of the first material.

Abstract: The invention provides certain fluorinated alkyl tin compounds which are believed to be useful in the vapor deposition of tin-containing films onto the surface of microelectronic device substrates. Also provided are processes for the preparation of the precursor compounds and processes for the use of such compounds in the deposition of tin-containing films onto microelectronic device substrates.

Abstract: Provided are certain liquid silicon precursors useful for the deposition of silicon-containing films, such as films comprising silicon, silicon nitride, silicon oxynitride, silicon dioxide, silicon carbide, carbon-doped silicon nitride, or carbon-doped silicon oxynitride. Also provided are methods for forming such films utilizing vapor deposition techniques.

Abstract: Provided are compositions and methods for selectively etching hard mask layers and/or photoresist etch residues relative to low-k dielectric layers that are present. More specifically, the present invention relates to a composition and process for selectively etching titanium nitride and/or photoresist etch residues relative to low-k dielectric layers. Other materials that may be present on the microelectronic device should not be substantially removed or corroded by said compositions.

Abstract: Provided are certain activated carbonaceous materials which have been treated with dilute mineral acids to modify their surface chemistry and morphology. The modified activated carbonaceous materials of the disclosure are useful in removing certain contaminants from gaseous streams. In one embodiment, the contaminants are compounds containing silicon and oxygen moieties, such as alkyl silanols and alkyl siloxanes. The modified activated carbonaceous materials can be incorporated into filters and filter systems.

Abstract: This disclosure provides operative components that mitigate electrostatic charge in fluid circuits. Illustrative embodiments include diaphragm valves that provide fluid control and allow static charge to dissipate when these diaphragm valves are grounded.

Abstract: Gaskets for wafer containers include a seal body and a retention projection. The retention projection includes a retention segment extending from the seal body, a compression relief segment extending from the retention segment, and a bead disposed at an end of the compression relief segment. The compression relief segment has a cross-sectional width less than a cross-sectional width of the retention segment. The bead has a shape including portion having a width greater than a cross-sectional width of the gland at a corresponding depth in the gland. The gasket can be provided in a wafer container or a door of the wafer container.

Abstract: A gas sampling trap includes a first stage and a second stage. The first stage includes a metal salt that reacts with sulfurous species to produce acidic gas. The second stage configured to receive the acidic gas produced in the first stage. An adsorbent substrate in the second stage adsorbs the acidic gas. A method of sampling a gas includes directing gas onto a metal stage within a first stage to produce acidic gas, directing the acidic gas into the second stage, and adsorbing the acidic gas in the second stage with an adsorbent substrate. A method of detecting a concentration of sulfurous species in a gas includes sampling the gas with a sampling trap, desorbing adsorbed acidic gas from an adsorbent substrate of the sampling trap with a solvent, and testing the solvent with ion chromatography.

Abstract: A reticle pod includes an outer pod, an inner pod cover and an inner base plate. A reticle is supported on the base and is contained within the environment created by the inner pod cover and the inner pod base. The inner pod cover can include a plurality of reticle retainers configured to contact a side wall of the reticle and limit movement of the reticle in a horizontal direction.

Abstract: The disclosure is directed to removal of metal contaminants from fluids, as well as ligand-modified filter materials useful for carrying out such methods. The filters and methods of this disclosure are particularly effective for removal of metals from liquid compositions comprising amines. Such liquid compositions with significantly reduced amounts of metals can be used in a microelectronic manufacturing process, such as liquids for removing photoresist or liquids used in etching. The ligand-modified filters, such as ligand-modified porous membranes, can be configured for use in a microelectronic manufacturing system, which can be utilized in the system as a point of use metal-removal feature for liquids entering the system.