Abstract: The disclosure provides methodology for the synthesis of mono-alkylated cyclopentadiene structures, which can be obtained via fulvene intermediates. In one embodiment, the cyclopentadiene ring is substituted with a trialkylsilyl moiety, which enables the further reaction with certain metal halides to form metal adducts. For example, the monoalkyl cyclopentadienes substituted with a trimethylsilyl group can be reacted with TiCl4 to provide R*CpTiCl3 complexes, wherein R* is a group of the formula wherein R1 and R2 are as defined herein.

Abstract: An electrostatic chuck device having reduced charge injection may include a dielectric layer, a bonding layer, an electrode layer, and an isolator layer, the bonding layer being located between the dielectric layer and the electrode layer, the electrode layer being located between the bonding layer and the isolator layer, and the electrode layer does not directly contact the dielectric layer. The bonding layer comprises a non-electrically conductive polymeric material that covers the electrode layer such that a surface roughness of an upper surface of the bonding layer is less than a surface roughness of an upper surface of the electrode layer. The electrostatic chuck device may also include a charge barrier layer located between the bonding layer and the electrode layer to further reduce a surface roughness of the bonding layer as compared to the electrode layer. The reduced surface roughness reduces charge injection from the electrode layer.

Abstract: An overpack assembly and a method of making an overpack assembly is disclosed. The overpack assembly includes a liner positioned within an overpack. In one embodiment, the method includes making a liner including providing a first sheet including a fitment positioned over a second sheet, the first sheet attached to the second sheet along an attachment seam at an entire perimeter edge. The first sheet is pulled apart from the second sheet at a center of the liner, forming a three-dimensional liner with triangular wings. A vertical seam is formed across each triangular wing, the vertical seam being perpendicular to the attachment seam, where a length of the vertical seam corresponds to the height of the liner when in use. The liner is positioned within the overpack.

Abstract: Described are boron oxide-containing adsorbents that include porous adsorbent base and boron oxide on surfaces of the base, as well as devices that include the boron oxide-containing adsorbent, and related methods of preparing and using the boron oxide-containing adsorbent.

Abstract: A substrate container includes a shell and a door for an opening of the shell. The shell includes one or more first latch sockets and one or more second latch sockets. The door includes a first locking mechanism that includes a first latch with first latch tip insertable into the one or more first latch sockets and a second latch with a second latch tip extendable into the second latch sockets. A width of the one or more first latch sockets blocks the second latch tip from being inserted into the one or more first latch sockets. A door for a substrate container includes a door housing and a first locking mechanism disposed in the door housing. A method of closing a substrate container includes inserting a door into an opening of the substrate container and adjusting a first locking mechanism of the door.

Abstract: In a wafer container, diffusers are positioned such that they are closer to a center line of the wafer container. This improves the distribution of purge gas within the wafer container. The diffusers can be positioned such that their position corresponds to a recessed central panel of the back wall. The diffusers can be positioned such that an angle between the diffusers relative to a center of a wafer contained within the wafer container is 60 degrees or less. The diffusers can be joined to purge ports by offset connectors oriented such that the diffusers are closer to the center line of the wafer container than the purge ports. The distance from each of the diffusers to the center line of the wafer container can be less than one fourth of a diameter of the wafer that the wafer container is configured to accommodate.

Abstract: A front opening unified pod includes a housing and a purge port in the housing. The purge port includes a filter membrane and a purge filter support. The purge filter support includes an outer ring structure and a support frame working. The support framework extends from the outer ring structure The outer ring structure includes a plurality of supports that provide a support surface for the filter membrane. One or more of the supports respectively increase in thickness from a thickness for the upper support surface. A purge filter support includes an outer ring structure, and one or more openings, a support framework that extends from the outer ring structure. The support framework includes a supports that provide a support surface configured to contact and support a filter membrane. One or more supports each increase in thickness from a first thickness of the upper support surface.

Abstract: A removable filter cartridge includes a filter housing containing a filter for filtering liquid and a sealing valve assembly coupled to the filter housing and for removably coupling the filter cartridge to a filter head. The sealing valve assembly include an inlet passageway and an outlet passageway. The sealing valve also including an inlet sealing valve that blocks the inlet passageway and an outlet sealing valve that blocks the outlet passageway while the filter cartridge is uncoupled from the filter head. A method of retrofitting a filter housing includes removing the filter housing from a filter head, coupling a sealing valve assembly to the removable filter to form a removable filter cartridge, and coupling the removable filter cartridge to the filter head.

Abstract: Described are filtration membranes that include a porous fluoropolymer membrane and thermally stable ionic groups; filters and filter components that include these filtration membranes; methods of making the filtration membranes, filters, and filter components; and method of using a filtration membrane, filter component, or filter to remove unwanted material from fluid.

Abstract: The disclosure provides a process for preparing an oleophobic fluoropolymer emulsion. The resulting fluoropolymer emulsion has excellent hydrophobic and oleophobic modification ability (as coatings) on polyester fibers such as polyester (PET), polypropylene (PP) and woven and nonwoven fabrics. Accordingly, the woven and nonwoven materials so coated are useful in venting filter applications.

Abstract: Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, and electrostatic chuck base components prepared by an additive manufacturing technique.

Abstract: The present disclosure relates to the field of precursors, more specifically precursors containing at least one fluorinated group. In some embodiments, the precursors are hafnium, zirconium, and titanium bis(cyclopentadienyl) precursors containing fluorinated alkoxides and amides. In some embodiments, the present disclosure relates to using precursors for deposition of group 4 containing thin films, such as HfOx, ZrOx, and TiOx film applications. These thin films can be used in a variety of applications including semiconductor device structures. The compounds of the present disclosure have been developed and synthesized to generate compounds that provide improvements in film applications, such as HfOx, ZrOx, and TiOx film applications. The improvements to the compounds of the present disclosure include increased molecule stability at delivery temperature and deposition temperature, improvements related to precursor film impurity levels, molecule volatility, molecule melting point, and step coverage.

Abstract: Provided is a method for purification of iodosilanes, such as diiodosilane. In this method, trace amounts of certain metal ion contaminants are removed, thus providing certain liquid compositions comprising the iodosilanes, which can be used advantageously in the deposition of silicon-containing films onto microelectronic device substrates.

Abstract: A substrate container includes a shell defining an interior space and a purge flow distribution system. The shell includes a front opening, a bottom wall, and a rear wall. The purge flow distribution system receives a stream of purge gas and includes an inlet and a network of separate gas distributing devices configured to distribute the stream of purge gas into the interior space. A supply line is also included that is connected to the inlet and configured to divide the supply of purge gas to the network of separate gas distributing devices. A method of purging an open substrate container includes supplying a stream of purge gas to an inlet of a purge flow distribution system and dividing the purge gas to supply a network of separate gas distributing devices to distribute the stream of purge gas into the interior space.

Abstract: A bag holder for a blast freezing process includes a bag tray. The bag tray is genderless and can be combined with an identical bag tray to form the bag holder. The bag holder includes a basin, side walls, and an end wall. The first and second side walls each include a set of alternating extended and recessed sections and a channel extending through at least a portion of the set of alternating extended and recessed sections. The alternating extended and recessed sections are offset from one another such that where a set on one side wall has an extended section, the set on the other side wall has a recessed section and vice versa. Methods include forming these bag trays, and placing a bag in one bag tray, then joining another bag tray to form the holder around the bag.

Abstract: A system for polishing a hardmask comprises a composition comprising a permanganate ion of a permanganate oxidizer; a substrate comprising a hardmask that comprises at least one of a non-carbon boron component, a boron-carbon component, a non-carbon silicon component, a non-carbon chromium component, a non-carbon zirconium component, or any combination thereof; and a chemical mechanical planarization (CMP) apparatus configured to bring the composition and the substrate into contact so as to remove at least a portion of the hardmask of the substrate.

Abstract: Embodiments provide a filter with a generally rectangular, non-cylindrical profile. The filter may have multiple pleat packs positioned between pleat covers that define regions and flow channels in a cavity of the filter body. The pleat covers have openings that allow a fluid to flow through the multiple pleat packs via parallel flows or series flows. End caps bonded to the body define flow passages for directing the fluid from an inlet to an outlet via the pleat packs for series or parallel filtration. The pleat packs may be made of the same or different materials and may be configured with the same or different heights based on flow requirements. A cage or a separator may be positioned between the pleat packs. The pleat packs may be made of a continuous pleated membrane with bridges defining a space between the pleat packs to accommodate the cage or separator.

Abstract: An apparatus includes a reticle pod. The reticle pod includes a baseplate having a first surface, a cover having a second surface, and a stand-off mechanism on at least one of the cover and the baseplate. The first surface includes a first sealing surface on a periphery of the baseplate. The second surface includes a second sealing surface on a periphery of the cover. The stand-off mechanism is configured to create a linear gap between the first sealing surface and the second sealing surface when the cover is attached to the baseplate.