Abstract: A diffuser tower assembly having a diffuser with a flared end and a fitting with an offset portion and nipple sized for the flared end. The assembly may be configured for providing low coverage purging. Diffuser tower assemblies may be in the form of a kit for retrofitting existing front opening wafer containers. The inlet fitting may include structure that enhances purge characteristics near the base of the porous media diffuser for enhanced sweeping of the floor of the substrate container. Embodiments of the disclosure generate an uneven flow distribution that provides a non-uniform flow distribution at the opening. In an embodiment, where the opening is in a substantially vertical orientation, the non-uniform flow distribution is tailored to deliver a greater flow rate to the bottom half of the opening than to the top of the opening.

Abstract: A carbon pyrolyzate material is disclosed, having utility as an adsorbent as well as for energy storage and other applications. The pyrolyzate material comprises microporous carbon derived from low cost naturally-occurring carbohydrate source material such as polysaccharides. In adsorbent applications, the carbon pyrolyzate may for example be produced in a particulate form or a monolithic form, having high density and high pore volume to maximize gas storage and delivery, with the pore size distribution of the carbon pyrolyzate adsorbent being tunable via activation conditions to optimize storage capacity and delivery for specific gases of interest.

Abstract: Compositions and methods for selectively removing unreacted metal material (e.g., unreacted nickel) relative to metal germanide (e.g., NiGe), metal-III-V materials, and germanium from microelectronic devices having same thereon. The compositions are substantially compatible with other materials present on the microelectronic device such as low-k dielectrics and silicon nitride.

Abstract: Cobalt silylamide and cobalt carbonyl precursors are described, which are usefully employed in vapor deposition processes, such as chemical vapor deposition and atomic layer deposition, to deposit cobalt and to form high purity cobalt-containing films at temperatures below 400° C. These precursors and processes can be utilized in the manufacture of integrated circuitry and production of devices such as microprocessors, and logic and memory chips.

Abstract: Apparatuses and methods providing a ballast system for adjusting the center of gravity of a standardized front opening wafer container. Various embodiments of the disclosure present ballast systems that are low profile, do not require modifications to the shell of the wafer container, and can be retrofit to existing wafer carriers. In some embodiments, these capabilities are accomplished by a ballast that mounts to a kinematic coupling plate of the wafer container. In one embodiment, the ballasting can also provide sufficient counter force to the lifting forces associated with purging of the wafer container, thereby preventing “lift off” of the wafer container during purging operations. The ballasts can be removed for shipping of the wafer container, thereby decreasing shipping costs.

Abstract: A CMP pad conditioner for conditioning a polishing pad. Various embodiments of the disclosure include a plurality of elongated protrusions which work a conditioned surface of a polishing pad at a variety of attack angles as the CMP pad conditioner engages the polishing pad. Because of the elongated geometry of the protrusions, the variety of attack angles will tend to flex the conditioned face of the polishing pad in a multifaceted manner. Such multifaceted manipulation of the conditioned face enhances the cut rate of the conditioner assembly and the removal of debris in the pores of the polishing pad that are residual from the CMP process, to better open the pores of the polishing pad and to better maintain the removal rate in the CMP process.

Abstract: A fluid monitoring apparatus, including a circuitry housing containing circuitry for processing fluid sensing signals and responsively transmitting an output, with a sensor assembly adapted for mechanical and electrical coupling to the circuitry housing. The sensor assembly includes at least one sensing member arranged to respond to a fluid species of interest in the monitored fluid, for generation of an output. The apparatus includes at least one of (A) a printed circuit board adapted to engage the circuitry housing and to mechanically couple to the sensor assembly, (B) the sensor assembly including a base and sensing element removably connected to the base by press-fit coupling elements, and (C) the sensor assembly including a base and a sensing filament connected thereto, and a filament guard to protectively circumscribe the sensing filament.

Abstract: Compositions useful for the passivation of germanium-containing materials on a microelectronic device having same thereon.

Abstract: An improved wafer support mechanism in a wafer container useful for carrying a plurality of axially aligned thin mostly circular wafer substrates. The container includes a cassette that has a plurality of adjacently disposed teeth for receiving the substrates, wherein each rib member is continuous from the cassette open top to the cassette open bottom, a removable top cover portion, a removable bottom cover portion, a cushion assembly removably attached to the container top cover, and another cushion assembly removably located in the container bottom cover and held in place by the weight of the wafer cassette. The top cushions are formed of individual segments having an extended lead-in feature at the end of each segment, spring sections in each segment and each segment has a V-shaped cross section to receive the wafer edge. The top and bottom cushions are installed in the top and bottom container covers, respectively, and extend the wafer support to approximately the entire circumference of each wafer.

Abstract: A cap for a fluid container includes a cap body including a base surface at a first end and an opening at a second end. The cap body is engageable with the fluid container. The base surface includes a first engagement structure. The cap includes a first aperture in the base surface. The cap further includes a key code body including a second engagement structure engageable with the first engagement structure. The key code body includes a key code ring. A removable closure member includes a plurality of engagement surfaces and a sealing surface disposed opposite the plurality of engagement surfaces. The removable closure member includes a sealing mechanism including a sealing member on the sealing surface. The sealing member is engageable with a portion of the base surface that defines the first aperture.

Abstract: A fluid supply package is described, which includes a fluid storage and dispensing vessel, and a fluid dispensing assembly coupled to the vessel and configured to enable discharge of fluid from the vessel under dispensing conditions, wherein the fluid supply package includes an informational augmentation device thereon, e.g., at least one of a quick read (QR) code and an RFID tag, for informational augmentation of the package. Process systems are described including process tools and one or more fluid supply packages of the foregoing type, wherein the process tool is configured for communicative interaction with the fluid supply package(s). Various communicative arrangements are described, which are usefully employed to enhance the efficiency and operation of process systems in which fluid supply packages of the foregoing type are employed.

Abstract: The invention relates to a gas purifier that removes moisture and oxygen from inert gases and reducing gases, for example, at sub-atmospheric pressures. The purifier can remove part per million levels of moisture in a gas stream to less than 100 parts per trillion by volume, and has a low pressure drop and a sharp breakthrough curve.

Abstract: Improved fitment assemblies for headspace gas removal. In one configuration, a fitment assembly includes a fitment defining a fluid pathway between an interior and an exterior of a container, the fitment including a tubular body having an upper neck portion and a lower neck portion, the lower neck portion depending from the upper neck, the upper neck portion including a proximal end defining a proximal opening. The lower neck portion including a distal end defining a distal opening, the tubular body defining a central bore that passes therethrough, the central bore being concentric about a central axis and passing through the proximal opening and the distal opening a flange for coupling with a container, the flange extending radially outward at a junction with the upper neck portion and the lower neck portion, wherein the lower neck portion is configured to extend into the interior of the container.

Abstract: A cap for a fluid container includes a cap body including a base surface at a first end and an opening at a second end. The cap body is engageable with the fluid container. The base surface includes a first engagement structure. The cap includes a first aperture in the base surface. The cap further includes a key code body including a second engagement structure engageable with the first engagement structure. The key code body includes a key code ring. A removable closure member includes a plurality of engagement surfaces and a sealing surface disposed opposite the plurality of engagement surfaces. The removable closure member includes a sealing mechanism including a sealing member on the sealing surface. The sealing member is engageable with a portion of the base surface that defines the first aperture.

Abstract: An ion implantation system is described, including: an ion implanter comprising a housing defining an enclosed volume in which is positioned a gas box configured to hold one or more gas supply vessels, the gas box being in restricted gas flow communication with gas in the enclosed volume that is outside the gas box; a first ventilation assembly configured to flow ventilation gas through the housing and to exhaust the ventilation gas from the housing to an ambient environment of the ion implanter; a second ventilation assembly configured to exhaust gas from the gas box to a treatment apparatus that is adapted to at least partially remove contaminants from the gas box exhaust gas, or that is adapted to dilute the gas box exhaust gas, to produce a treated effluent gas, the second ventilation assembly comprising a variable flow control device for modulating flow rate of the gas box exhaust gas between a relatively lower gas box exhaust gas flow rate and a relatively higher gas box exhaust gas flow rate, and a mot

Abstract: A front opening wafer container has a container portion and a door sized to close an open front of the container portion. The container portion has shelves for holding wafers defining a seating position and has forward and rearward wafer supports to suspend wafers therebetween in a transport position above the seating position. Shock condition cushion portions are arranged adjacent the transport position for protecting the wafers during a shock condition. The wafers may be bonded wafers having a thinned wafer side and a carrier substrate side. Wafer engagement pads and finger members extend in opposing directions from a central strip on the door providing a balance wafer engagement. When closing the door, a primary wafer support portion engages the wafers first and a secondary elastomeric wafer support engages the wafer secondly.

Abstract: A high dielectric constant (k?40), low leakage current (?10?6 A/cm2 at 0.6 nm or lower equivalent oxide thickness) non-crystalline metal oxide is described, including an oxide of two or more compatible metals selected from the group consisting of bismuth, tantalum, niobium, barium, strontium, calcium, magnesium, titanium, zirconium, hafnium, tin, and lanthanide series metals. Metal oxides of such type may be formed with relative proportions of constituent metals being varied along a thickness of such oxides, to enhance their stability. The metal oxide may be readily made by a disclosed atomic layer deposition process, to provide a metal oxide dielectric material that is usefully employed in DRAM and other microelectronic devices.

Abstract: Microporous membrane composites that are non-dewetting are disclosed. These microporous membrane composites are wet with solutions of methanol and water and are non-dewetting following autoclave treatment in water. The microporous membrane composites comprise a microporous membrane support that is coated with a crosslinked ionomer comprising hydrophilic groups. Compared to the microporous membrane support, the microporous membrane composite has a flow loss on average in isopropyl alcohol of less than 82%.

Abstract: An amine-free composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The amine-free composition preferably includes at least one oxidizing agent, at least one complexing agent, at least one basic compound, and water and has a pH in the range from about 2.5 to about 11.5. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.

Abstract: A sensor comprises a sensor layer comprising a ceramic material; an adhesion layer comprising chromium, the adhesion layer adhered to one or more portions of a liquid facing surface of the sensor layer; and an isolator film comprising a polymer, the isolator film overlaying a liquid facing surface of the adhesion layer. The isolator film may be used to protect the sensor from corrosive and high temperature fluids, for example to protect the sensor from long term exposure to hot water between 85° C. and 100° C.