Abstract: A wafer container with a latch mechanism that provides sealing for large wafer containers, such as for 450 mm wafers, accomplishes secure door closing and latching with reduced torque requirements for rotating the central rotatable cam plate. In various embodiments, a camming slot formed in the rotatable cammed plate is arcuate and defined by opposing cam surfaces which are selectively engaged by a cam follower, such as a roller, attached to a proximal end of a latch arm. The roller can include unitary axle portions that snap into the proximal end of the latch arm and is supported at both axial ends of the roller. The proximal end of the latch arm can include parallel extensions separated by a gap, and have guide in surfaces to deflect the extensions as the axle portions of the roller are forced into position thereby seating the roller at both axial ends.

Abstract: High-purity gas purifiers for purification of corrosive gases, such as halogen gases or halide gases, and noncorrosive gases, such as hydrogen and inert gases, methods of making and methods of using the gas purifiers, are described. The gas purifier includes a housing made of nickel or stainless steel. Within the housing, the gas purifier includes a purifier resin, including a modifier coated onto a substrate. The gas purifier further includes porous nickel membranes located at the inlets and outlets of the device. The inlets and outlets are capable of fluid communication with external fixtures.

Abstract: A dip tube assembly having a tubular portion and a coupler portion, the coupler configured for removable coupling with the mouth of a container storing contents therein. The coupler portion comprises a first end for connection with a tubular portion; a second end for connection with a connector assembly, wherein the connector assembly provides a pressure to the container; an outer surface and an inner surface with a thickness therebetween, wherein the inner surface defines a lumen that allows the chemical fluid to be conveyed from the chamber through the tubular portion to the connector assembly; and at least one pressure relief feature on the outer surface.

Abstract: A purifier for removing metal, such as chromium, from an organic solvent is disclosed. The purifier comprises a housing having a fluid inlet and a fluid outlet in fluid communication with the fluid inlet; a volume of ion-exchange resin disposed within the housing downstream of the fluid inlet; and a filtration member downstream of the volume of ion-exchange resin, the filtration member comprising at least one microporous membrane having a substantially neutral surface and a microporous polytetrafluoroethylene membrane downstream of the at least one microporous membrane. A method for removing metal, including chromium, from an organic solvent using a purifier of the invention is also disclosed.

Abstract: A front opening wafer container suitable for large wafers such as 450 mm utilizes componentry with separate fasteners to lock the componentry together in an expedient manner providing robust connections and cost efficiencies. A container portion has an open front and receives on a bottom surface a base plate secured by twist lock connectors that also provide recesses for purge grommets. Kinematic coupling components readily and robustly lock onto the base plate. Interior wafer support components latch onto brackets on the side walls utilizing a separate locking insert with holding tabs and locking detents. A wafer retainer provides support and counters enhanced wafer sag associated with 450 mm wafers when the door is installed and seated.

Abstract: Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten, and insulating materials from a microelectronic device having same thereon. The removal compositions are low pH and contain at least one oxidizing agent and at least one etchant as well as corrosion inhibitors to minimize metal erosion and passivating agents to protect dielectric materials.

Abstract: Described are filter products and methods of using filter products, wherein the filter products include multiple cells, each cell containing an individual circulating fluidized beds during use.

Abstract: Material management systems and methods include material storage vessels with information (e.g., electronic information) storage. Information may be communicated from a storage device to a process tool controller and employed to set or adjust a process tool operating parameter. Material information may be determined by remote analysis and subsequently communicated to an electronic information storage device of a vessel containing such material. Location and movement of material storage vessels within a customer facility may be automatically tracked, with further transfer of material-specific information. Product information may be associatively stored with material-specific information utilized in product manufacture.

Abstract: Embodiments as disclosed herein may include a sensor including a luminophor exposed to a fluid flow path. The luminophor may emit light in response to illumination by an excitation light source. The magnitude of light emitted by the luminophor in response to illumination may be determined. It can be determined if this magnitude is within a threshold of the baseline magnitude and an alarm state set based on this determination. This alarm state may indicate that the luminophor has reached an end-of-life state or otherwise should be replaced.

Abstract: Apparatus and method for use of solid dopant phosphorus and arsenic sources and higher order phosphorus or arsenic implant source material are described. In various implementations, solid phosphorus-comprising or arsenic-comprising materials are provided in the ion source chamber for generation of dimer or tetramer implant species. In other implementations, the ion implantation is augmented by use of a reactor for decomposing gaseous phosphorus-comprising or arsenic-comprising materials to form gas phase dimers and tetramers for ion implantation.

Abstract: An oblong diaphragm valve has curved surfaces carved into faces of a body and a plate. The curved surfaces have an oblong shape and define an oval or egg-shaped valve chamber when the body and the plate are joined and secured to each other, with a diaphragm sandwiched there-between. An inlet and an outlet are defined in the curved surface of the body at opposite ends defined by a length of the valve chamber. A flow passage is defined in the curved surface of the plate and has an opening centrally located relative to the valve chamber for actuation of the diaphragm to close or open the oblong diaphragm valve with minimal or no stress, ensuring durability and longevity of the oblong diaphragm valve with increased precision, while reducing fluid waste and pressure spikes in pumping operations.

Abstract: Embodiments provide mixing methods, systems, apparatuses, devices and assemblies that enable high-accuracy mixing of two or more substances in a manner that controls the concentrations of one or more substances in the resulting mixture. A mixing apparatus (100) may enable mixing of two or more substances at a mixing zone or conduit (112). The mixing apparatus may include one or more sensors (120) for detecting one or more characteristics of the mixture during the mixing process. The sensors may detect the mixture characteristics continuously, at intervals or as prompted by a user. The mixture characteristics may be used, in the sensors or in control circuitry, to generate an indication of the concentration of a first constituent substance in the mixture. Based on the detected concentration, the mixing apparatus may automatically adjust a supply of the first substance to the mixing zone or conduit (112).

Abstract: A substrate support assembly for a substrate container. The assembly may include a pair of substrate support columns each including a stack of a plurality of shelf members and a plurality of support rods inserted through the stack for securing the stack together. Each shelf member may include a blade portion having first and second opposing surfaces and an inner and outer periphery. Each surface of the blade portion may include a rib structure and a plurality of bosses positioned towards the outer periphery and extending from a forward portion to a rearward portion of the blade portion. Interlocking features may be defined on the rib structures. The stack of the shelf members may include each shelf member stacked with one or more adjacent shelf members via the rib structures, thereby interlocking each shelf member with the one or more adjacent shelf members via the interlocking features.

Abstract: The present invention includes methods and materials for cleaning materials, particles, or chemicals from a substrate with a brush or pad. The method comprising: engaging a surface of a rotating wafer with an outer circumferential surface of a rotating cylindrical foam roller, the cylindrical foam roller having a plurality of circumferentially and outwardly extending spaced apart nodules extending from the outer surface, each nodule defining a height extending from the outer surface of the cylindrical foam roller to a substrate engagement surface of the nodule, the substrate engagement surface of one or more of the nodules having a rounded configuration; and positioning the cylindrical foam roller on the substrate such that the one or more nodules are positioned to have only the rounded substrate engagement surface contact the substrate such that no linear surface of the one or more nodules contacts the substrate.

Abstract: A full fill trench structure is described, including a microelectronic device substrate having a high aspect ratio trench therein and filled with silicon dioxide of a substantially void-free character and substantially uniform density throughout its bulk mass. A method of manufacturing a semiconductor product also is described, involving use of specific silicon precursor compositions for forming substantially void-free and substantially uniform density silicon dioxide material in the trench. The precursor fill composition may include silicon and germanium, to produce a microelectronic device structure including a GeO2/SiO2 trench fill material. A suppressor component may be employed in the precursor fill composition, to eliminate or minimize seam formation in the cured trench fill material.

Abstract: A wafer container utilizes a rigid polymer tubular tower with slots and a “getter” therein for absorbing and filtering moisture and vapors within the wafer container. The tower preferably utilizes a purge grommet at the base of the container and may have a check valve therein to control the flow direction of gas (including air) into and out of the container and with respect to the tower. The tower is sealingly connected with the grommet. The tower may have a getter media piece rolled in an elongate circular fashion forming or shaped as a tube and disposed within the tower and may have axially extending. The media can provide active and/or passive filtration as well as having capabilities to be recharged. Front opening wafer containers for 300 mm sized wafers generally have a pair of recesses on each of the left and right side in the inside rear of the container portions.

Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

Abstract: An improved system and method for purging a microenvironment to desired levels of relative humidity, oxygen, or particulates through the implementation of a purge gas delivery apparatus and method that provides even distribution of the purging gas within the microenvironment. A substrate container has a tower therein with a fluid flow passageway extending the length of the tower. Apertures with porous media between the aperture and fluid flow passageway regulate the volume and pressure of air discharging at each aperture. Alternatively, the tower may be formed of a porous tubular polymeric material. A sleeve may direct the discharge purge gas in the interior.

Abstract: Described herein are liquid-free traps for trace levels of an acidic or basic airborne molecular contaminant in a gas. In one version of the invention described herein, the liquid-free trap comprises a housing, comprising an inlet and an outlet; a flow path between the inlet and the outlet; and a rigid sintered hydrophilic material situated in the flow path between the inlet and the outlet and sealed in the housing. The rigid sintered hydrophilic material is functionalized with from about 0.05 molar milliequivalents to about 10 molar milliequivalents of a basic species for trapping an acidic airborne molecular contaminant in the gas or from about 0.05 molar milliequivalents to about 10 molar milliequivalents of an acidic species for trapping a basic airborne molecular contaminant in the gas. Methods of using the liquid-free traps to detect or measure trace levels of an acidic or basic airborne molecular contaminant are also described.

Abstract: A method is described for vapor phase etching of oxide material including at least one of hafnia (HfO2) and zirconia (ZrO2), in the absence of plasma exposure of the oxide material. The method involves contacting the oxide material with an etching medium including at least one of phosphorus chloride and tungsten chloride under conditions producing a removable fluid reaction product, and removing the removable fluid reaction product. The etching process may be controllably carried out by use of pressure swings, temperature swings, and/or modulation of partial pressure of Hf or Zr chloride in the reaction, e.g., to achieve precision etch removal in the manufacture of semiconductor devices such as 3D NAND, sub-20 nm DRAMs, and finFETs.