Patents Assigned to Epcos AG
  • MEMS microphone assembly and method of manufacturing the MEMS microphone assembly
    Patent number: 9319765
    Abstract: The present invention concerns a MEMS microphone assembly (1) comprising a MEMS transducer element (2) comprising a MEMS die (3), a back plate (4) and a diaphragm (5) displaceable in relation to the back plate (4), and a sound inlet (16) for acoustically coupling the MEMS transducer element (2) to the exterior of the MEMS microphone assembly (1), wherein the MEMS die (3) comprises an indentation (17) that forms at least a part of the sound inlet (16). Further, the present invention concerns a method of manufacturing said MEMS microphone assembly (1).
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: April 19, 2016
    Assignee: Epcos AG
    Inventor: Jan Tue Ravnkilde
  • Bipolar transistor with lateral emitter and collector and method of production
    Patent number: 9306017
    Abstract: A bipolar transistor includes a substrate of semiconductor material, a high-mobility layer in the substrate, and a donor layer adjacent to the high-mobility layer. An emitter terminal forms an emitter contact on the donor layer, and a collector terminal forms a collector contact on the donor layer. A base terminal is electrically conductively connected with the high-mobility layer. The transistor can be produced in a HEMT technology or BiFET technology in GaAs.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: April 5, 2016
    Assignee: EPCOS AG
    Inventors: Léon C. M. van den Oever, Ray J. E. Hueting
  • Current-compensated choke and circuit arrangement with a current-compensated choke
    Patent number: 9305695
    Abstract: A current-compensated choke features several current paths and includes several windings that are connected in parallel and wound around a common core. The windings preferably are alternately wound on the core in such a way that windings of a common current path are not arranged directly one on top of another.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: April 5, 2016
    Assignee: EPCOS AG
    Inventors: Manfred Karasek, Markus Straub
  • Piezoelectric multilayer component and method for producing the same
    Patent number: 9299909
    Abstract: The piezoelectric multilayer component includes a piezo stack having an alternating sequence of piezoelectric ceramic layers and inner electrodes, and a passivation on an outer side. The passivation is produced from a piezoelectric ceramic material which is different from the material of the ceramic layers. In the production method, the passivation is polarized together with the ceramic layers.
    Type: Grant
    Filed: September 27, 2011
    Date of Patent: March 29, 2016
    Assignee: EPCOS AG
    Inventor: Martin Galler
  • Reactance filter comprising suppression in the stop band and duplexer component
    Patent number: 9294065
    Abstract: A reactance filter comprising suppression in the stop band comprises an input connection for applying an input signal, an output connection for outputting an output signal, at least series resonator, which is connected in a signal path between the input connection and the output connection, a parallel resonator, which is connected between the signal path and a connection in order to apply a reference potential, and an inductor, which is connected in series to the parallel resonator. A capacitor is connected by means of one connection between the at least one parallel resonator and the inductor and by means of the additional connection to the output connection. By connecting the reactance filter as a transmission filter in a duplexer component, the isolation in the receiving band of the duplexer component can be improved.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: March 22, 2016
    Assignee: EPCOS AG
    Inventors: Tobias Krems, Wolfgang Till, Ravi Challa
  • Pressure sensor having a compressible element
    Patent number: 9291514
    Abstract: The invention relates to a pressure sensor (1, 41) comprising a chamber (3) in which a sensor element (4) for measuring pressure is arranged. The pressure sensor (1, 41) further comprises a compressible element (6, 7) for overpressure protection, said compressible element (6, 7) being arranged outside the chamber (3).
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: March 22, 2016
    Assignee: EPCOS AG
    Inventor: Christian Wohlgemuth
  • Ceramic material and capacitor comprising the ceramic material
    Patent number: 9293256
    Abstract: A ceramic material for capacitors uses multilayer technology of the general formula: Pb1?1.5a?0.5b+1.5d+e+0.5f)AaBb(Zr1?xTix)(1?c?d?e?f)LidCeFefSicO3+y.PBO wherein A is selected from the group consisting of La, Nd, Y, Eu, Gd, Tb, Dy, Ho, Er and Yb; B is selected from the group consisting of Na, K and Ag; C is selected from the group consisting of Ni, Cu, Co and Mn; and 0<a<0.12; 0.05?x?0.3; 0<b<0.12; 0?c?0.12; 0<d<0.12; 0?e?0.12; 0?f?0.12; 0?y?1, and wherein b+d+e+f>0.
    Type: Grant
    Filed: February 18, 2013
    Date of Patent: March 22, 2016
    Assignee: EPCOS AG
    Inventors: Günter Engel, Michael Schossmann, Markus Koini, Andrea Testino, Christian Hoffmann
  • Duplexer with balun
    Patent number: 9294070
    Abstract: A duplexer is proposed with a substrate which has at least one patterned metallization plane and on which, at least to some extent, a transmission path (TX) and a reception path (RX) are arranged, both of which are connected to an antenna connection (ANT). The duplexer comprises a transmission filter (TXF) which is arranged in the transmission path (TX) and which has a first acoustic wave filter (BAW1) with one or more resonators. Furthermore, the duplexer (DPL) comprises a reception filter (RXF) which is arranged in the reception path (RX) on the antenna side and which has a second acoustic wave filter (BAW2) with one or more resonators and also a single-ended output.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: March 22, 2016
    Assignee: EPCOS AG
    Inventor: Jürgen Kiwitt
  • Light-emitting diode arrangement, module, and method for producing a light-emitting diode arrangement
    Patent number: 9287247
    Abstract: A light-emitting diode arrangement includes a light-emitting diode and a coding resistor for coding the light-emitting diode. The coding resistor is embodied as a star connection of a number of resistors. Furthermore, a module includes a plurality of light-emitting diode arrangements. Furthermore, a method for producing a light-emitting diode arrangement is specified, wherein the coding of a coding resistor is carried out depending on a determined characteristic of the light-emitting diode.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: March 15, 2016
    Assignee: EPCOS AG
    Inventors: Christian Faistauer, Stefan Leopold Hatzl, Sebastian Brunner
  • Voltage regulator and a method for reducing an influence of a threshold voltage variation
    Patent number: 9280169
    Abstract: A voltage regulator can provide a regulated output voltage. The voltage regulator includes a regulating module that includes a resistor and a field effect transistor that has a threshold voltage. The resistor is coupled to a gate terminal and a source terminal of the field effect transistor. The regulating module provides the output voltage. A reference module is suitable for detecting a variation of the output voltage. The reference module is coupled with the regulating module. A current sink is suitable for subtracting a compensation current from the current flowing from the regulating module to the reference module. The compensation current is dependent on a variation of the threshold voltage.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: March 8, 2016
    Assignee: EPCOS AG
    Inventors: Jeroen Bouwman, Leon C. M. van den Oever
  • Method for producing a sensor
    Patent number: 9278854
    Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: March 8, 2016
    Assignee: Epcos AG
    Inventors: Wolfgang Pahl, Anton Leidl, Jürgen Portmann, Robert Eichinger, Christian Siegel, Karl Nicolaus, Thomas Wassner, Thomas Sedlmeier
  • Circuit Arrangement
    Publication number: 20160056945
    Abstract: A circuit arrangement includes an antenna port, a first receiving port, a second receiving port, a first transmission port, and a second transmission port. A number of 90 degree hybrids are configured to transfer an input signal into two output signals that are phase shifted relative to each other. Two quadplexers each include a first duplexer and a second duplexer. The quadplexers and the 90 degree hybrids are interconnected such that a leakage signal travelling from one of the transmission ports to one of the receiving ports destructively interferes at the receiving port.
    Type: Application
    Filed: April 17, 2013
    Publication date: February 25, 2016
    Applicant: EPCOS AG
    Inventors: Juha ELLÄ, Edgar SCHMIDHAMMER
  • MEMS backplate, MEMS microphone comprising a MEMS backplate and method for manufacturing a MEMS microphone
    Patent number: 9266713
    Abstract: A MEMS backplate enables MEMS microphones with reduced parasitic capacitance. The MEMS backplate includes a central area and a perforation in the central area. A suspension area surrounds the central area at least partially. An aperture is disposed in the suspension area.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: February 23, 2016
    Assignee: EPCOS AG
    Inventors: Leif Steen Johansen, Jan Tue Ravnkilde, Pirmin Hermann Otto Rombach, Kurt Rasmussen, Dennis Mortensen
  • Microelectromechanical Systems Device Package and Method for Producing the Microelectromechanical Systems Device Package
    Publication number: 20160049918
    Abstract: A microelectromechanical systems device package includes a MEMS device mounted in flip-chip technology on a substrate. A film of non-evaporable getter material is disposed between the substrate and the MEMS device. A cover structure encapsulates the MEMS device. This invention further provides a method for manufacturing the microelectromechanical systems device package.
    Type: Application
    Filed: May 24, 2013
    Publication date: February 18, 2016
    Applicant: EPCOS AG
    Inventor: Gilles Moulard
  • Electroacoustic transducer having reduced losses due to transverse emission and improved performance due to suppression of transverse modes
    Patent number: 9257960
    Abstract: An electroacoustic transducer has reduced loss due to acoustic waves emitted in the transverse direction. For this purpose, a transducer comprises a central excitation area, inner edge areas flanking the central excitation area, outer edge areas flanking the inner edge areas, and areas of the busbar flanking the outer edge areas. The longitudinal speed of the areas can be set so that the excitation profile of a piston mode is obtained.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: February 9, 2016
    Assignee: EPCOS AG
    Inventors: Werner Ruile, Markus Mayer, Ulrike Rösler, Markus Hauser, Ingo Bleyl, Karl-Christian Wagner, Wolfgang Sauer, Michael Jakob, Thomas Ebner, Edgar Schmidhammer, Stefan Berek, Christoph Eggs
  • Module and production method
    Patent number: 9253886
    Abstract: The invention specifies a module comprising a carrier substrate (6) having an electrical wiring and a component chip mounted on the carrier substrate (6) using flip-chip technology, wherein the component chip (1) has, on its surface (2) facing the carrier substrate (6), component structures (3), a supporting frame (4) and supporting elements (5), the supporting elements (5) produce an electrical connection between the component structures (3) and the electrical wiring of the carrier substrate (6), and the height of the supporting elements and the height of the supporting frame (4) correspond. Furthermore, the invention specifies a method for producing the module.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: February 2, 2016
    Assignee: EPCOS AG
    Inventors: Kim Choong Lee, Marc Huesgen
  • Actuator and method for producing same
    Patent number: 9252351
    Abstract: The invention relates to an actuator having a sensor layer by which a temperature can be detected, and to a method for producing the same.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: February 2, 2016
    Assignee: EPCOS AG
    Inventor: Reinhard Gabl
  • Electroacoustic bandpass filter having smoothed insertion loss
    Patent number: 9247351
    Abstract: A bandpass filter operates with electroacoustically active components. The bandpass filter includes a first transducer segment having a spike in the insertion loss at a first frequency f1 and a second transducer segment having a spike in the insertion loss at a second frequency f2?f1. The frequencies f1 and f2 are chosen such that the insertion loss is smoothed.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: January 26, 2016
    Assignee: EPCOS AG
    Inventors: Andreas Detlefsen, Mohamed Nizar Mellouli
  • Heating module and vaporization apparatus having a heating module
    Patent number: 9242020
    Abstract: A heating module includes a housing with an opening, and a PTC ceramic heating element arranged in the housing having an inner face facing toward the opening, an outer face facing away from the opening and two end faces connecting the inner and outer faces, wherein the inner face is at least partially matched to the opening.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: January 26, 2016
    Assignee: EPCOS AG
    Inventors: Jan Ihle, Werner Kahr, Steffen Mehlig
  • Circuit arrangement including hybrids and duplexers between antenna, transmission and reception ports
    Patent number: 9240622
    Abstract: A circuit arrangement includes an antenna port, a transmission port, and a reception port, each of which is connected to one respective 90° hybrid that splits an input signal into two output signals that are in quadrature. The circuit arrangement also includes two duplexers which are connected in such a way that the two output signals emitted by the 90° hybrid that is connected to the transmission port constructively interfere on the antenna port, while spurious signals caused by the two output signals destructively interfere on the reception port.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: January 19, 2016
    Assignee: EPCOS AG
    Inventors: Edgar Schmidhammer, Juha Ella