Abstract: A filter circuit providing improved attenuation, a filter having improved attenuation and a duplexer with improved isolation are provided. The filter circuit has a first and a second coupling conductor segment which couple an input port to a ground port or the filter's output port. The filter circuit can be realized in the filter. The duplexer can comprise the filter, especially as its transmission filter.

Abstract: A piezoelectric component has at least one piezoelectric ceramic layer and at least one electrode adjacent the piezoelectric ceramic layer. The piezoelectric ceramic layer has a piezoelectric ceramic material of the general formula Pb1-x-y-[(2a-b)/2]-p/2V[(2a-b)/2-p/2]?CupBaxSry[(TizZr1-z)1-a-bWaREb]O3, where 0?x?0.035, 0?y?0.025, 0.42?z?0.5, 0.0045?a?0.009, 0.009?b?0.011, 2a>b, p?2a?b, RE is a rare earth metal, and V? is a Pb vacancy.

Abstract: A contacting device (100) for connecting an electrical conductor (11) comprises a connection contact (101) for fixing the electrical conductor (11) to the contacting device (100), wherein the connection contact (101) has a retainer (110). The retainer (110) has an accommodating region (112) for accommodating the electrical conductor (11). The accommodating region (112) tapers between an inlet opening (E112) and a base surface (B112) of the accommodating region (112) in such a way that a cross section (A11) of the electrical conductor (11) is deformed when the electrical conductor (11) is inserted into the accommodating region (112), whereby the electrical conductor is retained on the connection contact (101) in the clamping seat. The electrical conductor (11) can thus be fixed to the connection contact (101) without bending of the retainer (110).

Abstract: A duplexer having good insulation, small geometric dimensions and good decoupling of the transmit signal path from an antenna which may have poor matching is specified. To that end, the duplexer comprises two transmit filters, a receive filter and two 90° hybrids.

Abstract: The present disclosure relates to an amplifier circuit (2) for a capacitive transducer (1), comprising a preamplifier (8) adapted to receive a transducer signal through an input node (9) and to provide an amplified signal at an output node (10), and a transconductance amplifier (11) comprising a first input (12) and an output (14), wherein the first input (12) of the transconductance amplifier (11) is connected to the output node (10), and the output (14) of the transconductance amplifier (11) is connected to the input node (9).

Abstract: For producing a structured coating, or for carefully lifting off a coating over a sensitive region, it is proposed that a release film be applied and structured under the coating in the region which is not to be coated. In a release step, the release film is reduced in the adhesion in the region which is not to be coated and is subsequently lifted off together with the coating applied over it.

Abstract: An electroacoustic component is disclosed. In an embodiment, the electroacoustic component includes a piezoelectric substrate comprising a rare earth metal and calcium oxoborates (RE-COB) and component structures arranged on the substrate, the component structures being suitable for converting between RF signals and acoustic waves, wherein the waves are capable of propagation in a direction x??, and wherein the direction x?? is determined by Euler angles (?, ?, ?), the Euler angles being selected from angle ranges (20 . . . 90, 95 . . . 160, 15 . . . 55), (20 . . . 85, 95 . . . 160, 95 . . . 125) and (15 . . . 25, 85 . . . 100, 0 . . . 175).

Abstract: What is specified is an electronic component (100) comprising a functional body (1) provided with a reflection structure (2) wherein the reflection structure (2) is arranged and designed to reflect radiation that impinges on the electronic component (100) from outside away from the functional body (1) and wherein the electronic component (100) is radiation-passive.

Abstract: A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.

Abstract: A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure also includes a first metallization plane and a second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.

Abstract: A new front-end module is disclosed. In an embodiment the front-end module is configured to operate carrier aggregation modes using a cascade of switches and an intelligent set of bands. The module can be assembled by sub-modules.

Abstract: The present invention concerns a front end circuit (1) which comprising a first tunable duplexer (5) comprising a first tunable RX bandpass filter (9) and a first tunable TX bandpass filter (10), wherein the first tunable duplexer (5) is configured to support a first FDD mode in a first FDD frequency band and a first TDD mode in a first TDD frequency band. Furthermore, the present invention concerns a method of operating the front end circuit.

Abstract: A double backplate microphone having a good signal-to-noise ratio and being produceable at reduced manufacturing costs is provided. A microphone comprises a first backplate BP1, a second backplate BP2 and a membrane M. The microphone further comprises an amplifier AMP with a single-ended input port. The first backplate BP1 is electrically connected to the single-ended input port.

Abstract: A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.

Abstract: An antenna and RF front-end arrangement include at least one LTE or WCDMA Tx&Rx antenna, one MIMO Rx or diversity antenna adapted for low band LTE or WCDMA and one MIMO Rx or diversity antenna adapted for high band LTE or WCDMA. At least one of the MIMO Rx or diversity antennas is adapted for transmitting and receiving WLAN and/or BlueTooth signals. Therefore, a dedicated WLAN antenna is not required and the number of antennas can be reduced.

Abstract: An electric device is disclosed. In an embodiment, the device includes an electric element having an element terminal and a conductive spring being deflected, the spring being electrically coupled to the element terminal by a fusible joint. The device further includes a switch including a first monitor terminal and a second monitor terminal, the switch having a state that is changeable between a first connection state, where the first monitor terminal and the second monitor terminal are electrically coupled, and a second connection state, where the first monitor terminal and the second monitor terminal are electrically decoupled, and wherein the electrical device is configured such that when the joint fuses, the spring relaxes, thereby decoupling the spring and the element terminal and changing the state of the switch.

Abstract: An electroacoustic transducer has a piezoelectric layer, which is structured in such a way that, in the case of an alternating electric field applied in one spatial direction, an oscillation mode with oscillations in three spatial directions is excited.

Abstract: A beading tool (1) for the beading of a workpiece (10) is provided, the beading tool (1) having a contact area (2), which is designed to interact with the workpiece (10), the contact area (2) having a multiplicity of local elevations (4) that are delimited from one another. Also provided is a housing part (10) for an electrochemical cell (100), which defines a cavity and has at least one indentation (6), a multiplicity of local depressions (5) being formed in the indentation (6).

Abstract: A method for producing an electrical contact is disclosed. In an embodiment the method includes providing a piezoelectric component that includes an electromechanical transducer having two first electrodes and a second electrode arranged between the two first electrodes and spaced from the two first electrodes by a piezoelectric material, the transducer further including a first main side, a second main side opposite from the first main side and a first longitudinal side, and forming a contiguous metallization layer onto a first partial region of the first main side and onto a second partial region along the first longitudinal side, so that the second partial region along the first longitudinal side is at a distance from a side edge facing the second main side and the metallization layer in the second partial region of the first longitudinal side contacts the two first electrodes in an electrically conducting manner.

Abstract: A component comprising a carrier, a chip component and a MEMS component is proposed, wherein the mechanically sensitive MEMS component is mounted below a half-shell on the carrier. The component is encapsulated with a molding compound in a transfer molding process.