Patents Assigned to Epcos AG
  • Bias network
    Patent number: 9385681
    Abstract: An HF-line includes parallel branches with bias terminals, to which a direct voltage source is respectively connected via a first inductor and a second inductor. The inductors are inductively coupled to one another.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: July 5, 2016
    Assignee: EPCOS AG
    Inventors: Paul Coutinho, Peter Babel
  • MEMS microphone with reduced parasitic capacitance
    Patent number: 9382109
    Abstract: A MEMS microphone has reduced parasitic capacitance. The microphone includes a trench electrically separating an acoustically active section of a backplate from an acoustically inactive section of the backplate.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: July 5, 2016
    Assignee: EPCOS AG
    Inventors: Leif Steen Johansen, Jan Tue Ravnkilde, Pirmin Hermann Otto Rombach, Kurt Rasmussen
  • Component and method for producing a component
    Patent number: 9382110
    Abstract: A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: July 5, 2016
    Assignee: EPCOS AG
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl
  • Method for producing a plurality of electronic devices
    Patent number: 9386734
    Abstract: An electronic device comprises a substrate (120), at least one electronic component (171, 172, 173) arranged on the substrate, and an encapsulation (140) covering the at least one electronic component (171, 172, 173). An electromagnetic protective layer (130) covers a surface (143) of the encapsulation (140) that faces away from the substrate (120), and the side faces (121, 141; 122, 142) directed transversely with respect to the surface (143). In particular, a thermal and/or electrical coupling (134, 162, 163, 164, 165, 166) couples the electromagnetic protective layer (130) thermally and/or electrically to a region (168) of the electronic device (111, 112) that is enclosed by the encapsulation. For production purposes, the device is singulated from a panel and the electromagnetic protective layer (130) is subsequently applied.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: July 5, 2016
    Assignee: EPCOS AG
    Inventors: Claus Reitlinger, Gerhard Zeller
  • Piezoelectric component
    Patent number: 9379308
    Abstract: A piezoelectric component comprises a parallelepipedal basic body made of piezoelectric material which has an input region and an output region at opposite longitudinal ends of the basic body. Furthermore, the piezoelectric component comprises first and second primary electrodes which are arranged inside the input region and first and second secondary electrodes which are arranged inside the output region. The primary electrodes are at a greater interval from longitudinal lateral faces of the basic body in a subregion which faces the output region than in the subregion which is remote from the output region. Likewise, the secondary electrodes are at a greater interval from the longitudinal lateral faces of the basic body in a subregion which faces the input region than in a subregion which is remote from the input region.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: June 28, 2016
    Assignee: EPCOS AG
    Inventors: Igor Kartashev, Peter Kraxner, Markus Puff
  • Ceramic multilayer capacitor
    Patent number: 9378892
    Abstract: A ceramic multilayer capacitor includes a first capacitor unit, which comprises a first material, and a second capacitor units, which comprises a second material. The first and the second capacitor unit are electrically connected in parallel. At low applied voltages, the first material has a high dielectric value and, at high applied voltages the second material has a high dielectric value.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: June 28, 2016
    Assignee: EPCOS AG
    Inventors: Guenter Engel, Christian Hoffmann, Andrea Testino
  • Sensing device for detecting a physical quantity and method for producing said sensor
    Patent number: 9370887
    Abstract: A sensing device for detecting a physical quantity includes a molded part and a sensor element in the molded part. The sensor element includes an enclosure that is formed from the molded part and an injection-molding compound. A connection element may be connected to the sensor element. An interface may be between the sensor element and the connection element.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: June 21, 2016
    Assignee: EPCOS AG
    Inventors: Gerald Kloiber, Heinz Strallhofer
  • Device, module and circuit assembly for wireless communications, and configured for interference suppression via use of first and second phase shifters, a band stop filter and/or a diversity duplexer circuit
    Patent number: 9374123
    Abstract: The present invention relates to a circuit assembly which comprises an antenna path (A1), which can be connected to a first antenna (ANT1), a transmission path (TX1), a reception path (RX1), a duplexer (DPX1), operating with acoustic waves, which connects the transmission and reception paths (TX1, RX1) in each case to the antenna path (A1), and means for suppressing an interference signal.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: June 21, 2016
    Assignee: EPCOS AG
    Inventor: Edgar Schmidhammer
  • MEMS device comprising an under bump metallization
    Patent number: 9369066
    Abstract: The present invention concerns a MEMS device comprising an under bump metallization (4)—UBM—to contact the device via flip-chip bonding with a substrate. The UBM (4) is placed on the surface of the MEMS device and close to the corners of the surface. Further, the shape of the UBM (4) is adapted to the shape of the corners.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: June 14, 2016
    Assignee: EPCOS AG
    Inventors: Leif Steen Johansen, Jan Tue Ravnkilde
  • Sensor device and method for manufacture
    Patent number: 9370109
    Abstract: A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: June 14, 2016
    Assignee: EPCOS AG
    Inventors: Gerald Kloiber, Heinz Strallhofer, Norbert Freiberger
  • Micro-acoustic filter having compensated cross-talk and method for compensation
    Patent number: 9362884
    Abstract: The invention relates to a micro-acoustic filter having a first and a second converter, in which the electromagnetic and capacitive cross-talk between the first and second converters is compensated for by providing additional coupling capacitors and additional current loops. Additional coupling capacitors and current loops are arranged in such a manner that they can counteract the sign of the natural coupling specified by the design and thus completely compensate for said coupling.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: June 7, 2016
    Assignee: EPCOS AG
    Inventors: Guillermo Moreno Granado, Jürgen Kiwitt, Maximilian Pitschi, Tilo Gärtner
  • Heating device and method for manufacturing the heating device
    Patent number: 9363851
    Abstract: A heating device is provided, comprising a shaped body, which has at least two regions comprising different compositions of a ceramic material with a positive temperature coefficient of electrical resistance. A method for manufacturing a heating device is furthermore specified.
    Type: Grant
    Filed: July 23, 2009
    Date of Patent: June 7, 2016
    Assignee: EPCOS AG
    Inventors: Jan Ihle, Werner Kahr
  • Stacked gas filled surge arrester
    Patent number: 9356441
    Abstract: A surge arrester comprising stacked arrester units is provided that is that is easy to assemble. For that, a surge arrester comprises stacked arrester units, a capacitor, and a resilient element, where the resilient element electrically and mechanically connects the capacitor with a node of the arrester stack.
    Type: Grant
    Filed: September 17, 2012
    Date of Patent: May 31, 2016
    Assignee: EPCOS AG
    Inventors: Peter Bobert, Frank Werner
  • Microphone arrangement
    Patent number: 9357294
    Abstract: The present invention relates to a microphone arrangement (M) which has a charge pump (LP), which produces a DC voltage, a transducer (WA), which converts acoustic signals into electrical signals and which is connected to the charge pump (LP), and a control unit (VCLFS), which controls the charge pump (LP) and which adjusts the DC voltage produced by the charge pump (LP).
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: May 31, 2016
    Assignee: Epcos AG
    Inventors: Pirmin Hermann Otto Rombach, Daifi Haoues Sassene
  • Composite material for temperature measurement, temperature sensor comprising the composite material, and method for producing the composite material and the temperature sensor
    Patent number: 9341521
    Abstract: A composite material 1 for temperature measurement is specified, as is a temperature sensor 10 formed from the composite material 1. Additionally specified are processes for producing the composite material 1 and for producing the temperature sensor 10.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: May 17, 2016
    Assignee: EPCOS AG
    Inventors: Gerald Kloiber, Heinz Strallhofer
  • Method for producing a piezoelectric multilayer component and a piezoelectric multilayer component
    Patent number: 9343652
    Abstract: A method for producing a piezoelectric multilayer component is disclosed. Piezoelectric green films and electrode material are provided, arranged alternately on top of one another and sintered. The electrode material is provided with a PbO-containing coating and/or PbO is mixed into the electrode material.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: May 17, 2016
    Assignee: EPCOS AG
    Inventors: Alexander Glazunov, Oliver Dernovsek
  • Electric ceramic component with electric shielding
    Patent number: 9338913
    Abstract: The electric ceramic component has a main part (9) made of a dielectric material, an active region (3) being disposed in said main part. At least one outer contact (1, 1?) is arranged on the main part. A feed line region (2, 2?) connects the outer contact to the active region. An electrode (4, 4?, 5, 5?, 6, 6?) is arranged in the main part so as to adjoin the feed line region and is connected to the outer contact in an electrically conductive manner but not to the active region.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: May 10, 2016
    Assignee: EPCOS AG
    Inventors: Thomas Feichtinger, Georg Krenn, Jerzy Kudlaty
  • Light-emitting diode device
    Patent number: 9337408
    Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: May 10, 2016
    Assignee: EPCOS AG
    Inventors: Thomas Feichtinger, Sebastian Brunner, Oliver Dernovsek, Klaus-Dieter Aichholzer, Georg Krenn, Axel Pecina, Christian Faistauer
  • System support for electronic components and method for production thereof
    Patent number: 9331010
    Abstract: A chip (2, 3) is arranged above a top side of a flexible support (1) and mechanically decoupled from the support. Electrical connections (8, 11) of the chip are embodied using a planar connection technique. The chip can be separated from the support by an air gap or a base layer (7) composed of a soft or compressible material.
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: May 3, 2016
    Assignee: Epcos AG
    Inventors: Wolfgang Pahl, Karl Weidner
  • Molded object, heating device and method for producing a molded object
    Patent number: 9321689
    Abstract: A mold (30), which has a first region (10) comprising an electroceramic material and a second region (20) comprising a structural ceramic material, is provided. A heating device with this mold is also specified. Furthermore, a method for producing a mold is provided.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: April 26, 2016
    Assignee: EPCOS AG
    Inventors: Jan Ihle, Werner Kahr, Bernhard Steinberger