Patents Assigned to Epcos AG
  • Electronic circuit for a microphone and method of operating a microphone
    Patent number: 10085088
    Abstract: An electronic circuit for a microphone comprises a first terminal and a second terminal, wherein the electronic circuit is selectively operable in a first mode and a second mode. In the first mode, the first terminal is configured for microphone output and in the second mode, the second terminal is configured for microphone output. Furthermore, a method of operating a microphone is provided.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: September 25, 2018
    Assignee: EPCOS AG
    Inventors: Gino Rocca, Pirmin Hermann Otto Rombach
  • Inductive component, and device, and method for winding a wire for an inductive component
    Patent number: 10079093
    Abstract: An inductive component, a device, and a method for winding a wire for an inductive component are disclosed. In an embodiment a device includes an advancing arrangement configured to advance a wire and a shaping arrangement and a pitch-producing arrangement configured to bend the wire, wherein the shaping arrangement and the pitch-producing arrangement are arranged in such a way that the wire, as it is advanced by the advancing arrangement, is introduced into the shaping arrangement and the pitch-producing arrangement, and wherein the shaping arrangement and the pitch-producing arrangement are formed in such a way that the wire, as it is advanced, is bent in a coiled manner in the shaping arrangement and the pitch-producing arrangement.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: September 18, 2018
    Assignee: EPCOS AG
    Inventors: Karsten Frey, Jürgen Frey, Wolfgang Porisch
  • Multilayer component comprising an external contact and method for producing a multilayer component comprising an external contact
    Patent number: 10074794
    Abstract: A multilayer component includes a main body and an external contact. The external contact has a connection element and a contact layer. The contact layer electrically conductively connects the main body to the connection element. A connection between the main body and the connection element is produced by sintering of the contact layer.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: September 11, 2018
    Assignee: EPCOS AG
    Inventors: Martin Galler, Marion Ottlinger
  • NTC component and method for the production thereof
    Patent number: 10074466
    Abstract: An NTC component comprising a first electrode (1) and a second electrode (2) is specified. The NTC component further comprises an NTC element (3) disposed between the first electrode (1) and the second electrode (2), wherein the NTC element (3) comprises a ceramic having the general composition AB2O4, and where A and B each comprise one or more of the materials Mn, Ni, Co and Cu, and B additionally comprises one or more of the materials Fe, Y, Pr, Al, In, Ga and Sb.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: September 11, 2018
    Assignee: EPCOS AG
    Inventor: Manfred Schweinzger
  • Active filter device and circuit arrangement comprising an active filter device
    Patent number: 10069480
    Abstract: An active filter device and a circuit arrangement comprising an active filter device are disclosed. In an embodiment the active filter device includes sensor terminals for applying a sensor signal depending on a sensed noise signal, an output terminal for providing a correction signal that is suitable for reducing the noise signal, a signal source adapted for generating a correction signal and a high-pass filter coupled between the sensor terminals and the signal source, wherein the correction signal is generated with a dependence on a high-pass filtered sensor signal.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: September 4, 2018
    Assignee: EPCOS AG
    Inventor: Andrew Tucker
  • Dielectric Composition, Dielectric Element, Electronic Component and Laminated Electronic Component
    Publication number: 20180222801
    Abstract: A dielectric composition, a dielectric element, an electronic component and a laminated electronic component are disclosed. In an embodiment the dielectric composition includes particles having a perovskite crystal structure including at least Bi, Na, Sr and Ti, wherein the dielectric composition includes at least one selected from among La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Yb, Ba, Ca, Mg and Zn, wherein the content of the at least one selected from among La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Yb, Ba, Ca, Mg and Zn is between 0.5 molar parts and 11.1 molar parts, taking the Ti content of the dielectric composition as 100 molar parts, wherein 0.17???2.83, where ? is the molar ratio of Bi with respect to Sr in the dielectric composition.
    Type: Application
    Filed: June 16, 2016
    Publication date: August 9, 2018
    Applicant: EPCOS AG
    Inventors: Masakazu Hirose, Goushi Tauchi, Tomoya Imura, Tomohiro Terada
  • Dielectric Composition, Dielectric Element, Electronic Component and Multi-Layer Electronic Component
    Publication number: 20180211780
    Abstract: A dielectric composition, a dielectric element, an electronic component and a multi-layer electronic component are disclosed. In an embodiment the dielectric composition includes a perovskite crystal structure containing at least Bi, Na, Sr and Ti, wherein the dielectric composition includes at least one selected from among La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Yb, Ba, Ca, Mg and Zn, wherein the dielectric composition includes specific particles having a core-shell structure that has at least one core portion including SrTiO3 and wherein ? is set to 0.20???0.70, where ? is the ratio of the number of specific particles with respect to the total number of particles contained in the dielectric composition.
    Type: Application
    Filed: June 16, 2016
    Publication date: July 26, 2018
    Applicant: EPCOS AG
    Inventors: Masakazu Hirose, Goushi Tauchi, Tomoya Imura, Tomohiro Terada
  • Temperature sensor system and method for producing a temperature sensor system
    Patent number: 10024725
    Abstract: The invention relates to a temperature sensor system comprising a first ceramic housing part comprising a sleeve-shaped lower part with a first lower end having a first opening, and a second upper end having a second opening, and an upper part connected to the second upper end. The temperature sensor system further comprises a temperature probe element which is at least partially arranged in the lower part and which has a ceramic sensor element housing, a sensor element arranged in the sensor element housing, and electrical supply lines. The sensor element housing is at least partially arranged in the first opening. The ceramic sensor element housing has a higher thermal conductivity than the first ceramic housing part. Also disclosed is a method for producing a temperature sensor system.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: July 17, 2018
    Assignee: EPCOS AG
    Inventors: Jan Ihle, Oliver Bard, Gerald Kloiber
  • Device, arrangement, and method for measuring a current intensity in a primary conductor through which current flows
    Patent number: 10018656
    Abstract: A device, an arrangement, and a method for measuring a current intensity in a primary conductor through which current flows are disclosed. In an embodiment, an apparatus includes a magnetic field-generating element configured to generate a reference magnetic field; and a magnetic field angle-sensitive element configured to measure an orientation of a total magnetic field, the total magnetic field is produced by overlapping of the primary magnetic field and the reference magnetic field in space, wherein the primary magnetic field and the reference magnetic field are not parallel to one another at a location of the magnetic field angle-sensitive element, and wherein the current intensity of the current flowing through the primary conductor is determinable from the orientation of the total magnetic field in space.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: July 10, 2018
    Assignee: EPCOS AG
    Inventors: Bernhard Ostrick, Carsten Dehoff
  • Component carrier and component carrier arrangement
    Patent number: 10021776
    Abstract: A component carrier includes a multi-layer carrier body having a substrate containing a structured functional. The substrate extends both laterally and also at least partially above and below the functional region. Alternatively, or in addition, the substrate extends both laterally and also completely above and/or below the functional region. Alternatively, or in addition, the substrate or a further region is arranged in or extends into the functional region.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: July 10, 2018
    Assignee: EPCOS AG
    Inventors: Thomas Feichtinger, Axel Pecina
  • Light-emitting diode device
    Patent number: 10014459
    Abstract: A light-emitting diode device is specified, comprising at least one carrier and a light-emitting diode arranged thereon. The carrier comprises a plurality of polymer layers arranged one above another. At least one polymer layer has a cutout, in which an electrical component is embedded.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: July 3, 2018
    Assignee: EPCOS AG
    Inventors: Thomas Feichtinger, Oliver Dernovsek
  • Carrier for an LED
    Patent number: 9978912
    Abstract: A carrier for an LED is disclosed. In an embodiment, the carrier includes a main body, wherein the carrier has an upper side on which a first contact area for attaching an LED is arranged, and wherein a protective device for protecting the LED from electrostatic discharges is integrated in the main body.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: May 22, 2018
    Assignee: EPCOS AG
    Inventor: Thomas Feichtinger
  • Electronic component
    Patent number: 9972426
    Abstract: An electronic component is disclosed. In an embodiment, the electronic component includes a plurality of functional layers arranged one on top of the other forming a stack, first inner electrodes, and second inner electrodes, each of the first and second inner electrodes arranged between two adjacent functional layers. The electronic component further includes a first outer contact electrically connected to the first inner electrodes and a second outer contact electrically connected to the second inner electrodes, wherein the functional layers are selected such that the first and second outer contacts are electrically conductively connected to one another via the functional layers both in a basic state and in a hot state of the electronic component, wherein a temperature of the hot state is higher than a temperature of the basic state, and wherein the electronic component is an NTC component.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: May 15, 2018
    Assignee: EPCOS AG
    Inventors: Franz Rinner, Christoph Auer, Manfred Schweinzger
  • Temperature probe and method for producing a temperature probe
    Patent number: 9958335
    Abstract: The invention relates to a temperature probe comprising two first ceramic plates, a second ceramic plate arranged between the first ceramic plates, and two third ceramic plates. Each of the two first ceramic plates comprises an opening in each in which an NTC sensor element is arranged. An electrode is arranged between the second ceramic plate and each of the first ceramic plates. The first and the second ceramic plates are arranged between the two third ceramic plates. An electrode is arranged between each third ceramic plate and a first ceramic plate. Each electrode electrically contacts an NTC sensor element. Each NTC sensor element is enclosed by ceramic plates. The first, the second and the third ceramic plates and the NTC sensor elements are sintered to form a ceramic body. The invention further relates to a method for producing a temperature probe.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: May 1, 2018
    Assignee: EPCOS AG
    Inventors: Jan Ihle, Gerald Kloiber
  • Temperature probe and method for producing a temperature probe
    Patent number: 9958336
    Abstract: The invention relates to a temperature probe which comprises a functional ceramic probe element and a ceramic housing. The probe element is mounted in the ceramic housing so that at a face of the probe element has direct and form-fitting contact with the ceramic housing. The invention further relates to a method for producing a temperature probe.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: May 1, 2018
    Assignee: EPCOS AG
    Inventors: Jan Ihle, Gerald Kloiber
  • Electronic component for guiding a magnetic field
    Patent number: 9934900
    Abstract: An electronic component for guiding a magnetic field comprises a core (20) of a magnetizable material, which has at least two spaced-apart legs (11a, 11b) with opposing surfaces (O11a, O11b) separated from one another by a gap (S). The component comprises at least one compressible molding (20), which is arranged compressed in the gap (S), the at least one molding (20) being in contact with the respective surfaces (O11a, O11b) of the at least two spaced-apart legs (11a, 11b).
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: April 3, 2018
    Assignee: EPCOS AG
    Inventor: Martin Bichler
  • Method for fabricating a varistor device and varistor device
    Patent number: 9934892
    Abstract: A method for fabricating a varistor device is presented. In an embodiment the method includes providing a base body for the varistor device, wherein the base body comprises a ceramic material, providing a basic material for a base metal electrode region on the base body, exposing the base body with the basic material to a temperature under a protective gas atmosphere such that the base metal electrode region is formed and firmly connected to the base body and completing the varistor device.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: April 3, 2018
    Assignee: EPCOS AG
    Inventors: Dennis Sun, Jamie Jing, Qirong Li
  • Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole
    Patent number: 9908773
    Abstract: A method for packaging a microelectronic device in an hermetically sealed cavity and managing an atmosphere of the cavity with a dedicated hole, including making said cavity between a support and a cap layer such that a sacrificial material and the device are arranged in the cavity; removing the sacrificial material through at least one release hole, and hermetically sealing the release hole; making a portion of wettable material on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; making a portion of fuse material on the portion of wettable material; making the dedicated hole by etching the cap layer; and reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: March 6, 2018
    Assignees: Commissariat à l'énergie atomique et aux énergies alternatives, EPCOS AG
    Inventors: Damien Saint-Patrice, Arnoldus Den Dekker, Marcel Giesen, Florent Greco, Gudrun Henn, Jean-Louis Pornin, Bruno Reig
  • Dielectric composition, dielectric element, electronic component and laminated electronic component
    Patent number: 9911536
    Abstract: The aim of the present invention lies in providing a dielectric composition which has a relatively high dielectric constant of 800 or greater, and which has relatively low dielectric loss of 4% or less when a DC bias of at least 8 V/ym is applied, and also in providing a dielectric element employing said dielectric composition, an electronic component, and a laminated electronic component. A dielectric composition having a main component represented by (BiaNabSrcBad) (?xTi1?x)O3, characterized in that a is at least one selected from Zr and Sn; and a, b, c, d and x satisfy the following: 0.140?a<0.390, 0.140?b<0.390, 0.200?c<0.700, 0.020?d<0.240, 0.020?x<0.240 and 0.950<a+b+c+d?1.050.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: March 6, 2018
    Assignee: EPCOS AG
    Inventors: Masakazu Hirose, Tomoya Imura, Goushi Tauchi
  • Pressure sensor system
    Patent number: 9909946
    Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to ?40° C. and less than or equal to 150° C.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: March 6, 2018
    Assignee: EPCOS AG
    Inventors: Jan Ihle, Andreas Peschka, Bert Hundertmark, Benjamin Bohl, Bernhard Ostrick