Abstract: An electronic component has a main body. The main body includes a porous material having surface pores at a surface of the main body. A passivation liquid is arranged in the surface pores. A method of forming an electronic component is also disclosed as is a method of passivating a body.

Abstract: A method for producing a ceramic multilayer element is disclosed. In an embodiment the method includes forming a plurality of multilayer segments in a green state, wherein each multilayer segment is formed by pressing together a plurality of ceramic layers in the green state and pressing together the multilayer segments in the green state to form a multilayer element that is in the green state. The method further includes sintering the multilayer element that is in the green state to form a ceramic multilayer element that includes the ceramic layers and electrode layers arranged one on top of another, wherein at least one or more of a temperature at which the multilayer segments are pressed together, a pressing force applied during the pressing of the multilayer segments, and/or a duration of the pressing of the multilayer segments are adjusted.

Abstract: A package for a tunable filter is disclosed. In an embodiment, the tunable filter includes a substrate having a first interconnection plane and a semiconductor device assembled on the substrate in a first component plane, the semiconductor device electrically connected to the first interconnection plane and containing tunable passive components. The filter further includes a control unit arranged in the first component plane, a dielectric layer arranged above the first component plane, a second component plane arranged on the dielectric layer and discrete passive devices arranged in the second component plane and interconnected with the semiconductor device, wherein the tunable passive components are tunable by the control unit.

Abstract: A filter component includes a housing body. A first and at least one second busbar each have a first end section, and a second end section, between which in each case a center section is arranged. The end sections of the busbars each have connections for connecting electrical conductors to the filter component. The first and second end section and the center section of the first busbar are arranged in a first plane and the first and second end section and the center section of the at least one second busbar are arranged in a second plane, which is different from the first plane.

Abstract: An electronic component is disclosed. In an embodiment, the electronic component includes a plurality of functional layers arranged one on top of the other forming a stack, first inner electrodes, and second inner electrodes, each of the first and second inner electrodes arranged between two adjacent functional layers. The electronic component further includes a first outer contact electrically connected to the first inner electrodes and a second outer contact electrically connected to the second inner electrodes, wherein the functional layers are selected such that the first and second outer contacts are electrically conductively connected to one another via the functional layers both in a basic state and in a hot state of the electronic component, wherein a temperature of the hot state is higher than a temperature of the basic state, and wherein the electronic component is an NTC component.

Abstract: A duplexer and a quadplexer are disclosed. In an embodiment, the duplexer includes an antenna terminal and two sub-paths including a transmit path and a receive path, the two sub-paths being connected to the antenna terminal, wherein the transmit path includes serially interconnected series resonators and, in parallel therewith, n parallel paths connected to ground, wherein each parallel path includes one parallel resonator or a cascade of serially interconnected parallel resonators, wherein n is an integral number with 0<n<8, wherein at least one of the n parallel resonators is connected to ground in series with an inductance in the transmit path, and wherein a parallel resonator is connected directly to ground in a first parallel path that is nearest to the antenna terminal and no inductance is arranged in the first parallel path.

Abstract: For a reactance filter constructed from serial and parallel resonators, in order to improve the linearity, it is proposed to connect a capacitor in series or in parallel either with a parallel resonator or a cascade of parallel resonators or with a series resonator or a cascade of series resonators.

Abstract: A circuit assembly is used for controlling a piezoelectric transformer having an input capacitance in a first circuit branch. The circuit assembly also includes a second circuit branch for compensating for the input capacitance, preferably by means of a capacitive element, and a differential amplifier having two inputs. The first input is coupled to the first circuit branch and the second input is coupled to the second circuit branch.

Abstract: A sensor is disclosed. In an embodiment, the sensor includes a fixed structure, a movable structure movable relative to the fixed structure, a magnet configured to generate a magnetic field and a first magnetically sensitive element configured to determine the magnetic field at a position of the first magnetically sensitive element. The magnet is fastened to the fixed structure and the first magnetically sensitive element is fastened to the movable structure. Alternatively, the magnet is fastened to the movable structure and the first magnetically sensitive element is fastened to the fixed structure.

Abstract: A multi-layer capacitor has dielectric layers and electrode layers arranged therebetween. The multi-layer capacitor has a number of segments that are connected to one another. At least one relief region is provided between the segments. The invention furthermore provides a method for producing such a multi-layer capacitor.

Abstract: A semiconductor device includes a semiconductor component on a carrier body that includes a ceramic body and a thermistor sensor structure directly connected to the ceramic body. The thermistor sensor structure is integrated into the carrier body and includes a heat sink, on which the carrier body is mounted.

Abstract: An active filter device and a circuit arrangement comprising an active filter device are disclosed. In an embodiment the active filter device includes sensor terminals for applying a sensor signal depending on a sensed noise signal, an output terminal for providing a correction signal that is suitable for reducing the noise signal, a signal source adapted for generating a correction signal and a high-pass filter coupled between the sensor terminals and the signal source, wherein the correction signal is generated with a dependence on a high-pass filtered sensor signal.

Abstract: A sensor element, a sensor arrangement, and a method for manufacturing a Sensor element are disclosed. In an embodiment, a sensor element includes a ceramic main body and at least one electrode arranged at the main body, wherein the electrode has at least one layer comprising nickel.

Abstract: A duplexer is disclosed. In an embodiment, the duplexer includes a Tx filter and an Rx filter, wherein the Tx filter includes first series-interconnected basic elements, each first basic element having a first electroacoustic resonator and first impedance converters interconnected in series between the first basic elements, wherein the Rx filter comprises second series-interconnected basic elements, each second basic element having a second electroacoustic resonator and second impedance converters interconnected in series between the second basic elements, wherein the first impedance converters in the Tx filter are impedance inverters, wherein the first resonators of the first basic elements in the Tx filter are only series resonators, wherein the second impedance converters in the Rx filter are admittance inverters, and wherein the second resonators of the second basic elements in the Rx filter are only parallel resonators.

Abstract: An RF filter is disclosed. In an embodiment, the RF filter includes series-interconnected basic elements, each basic element having an electroacoustic resonator and impedance converters interconnected in series between the basic elements, wherein the impedance converters are admittance inverters, wherein the resonators of the basic elements are parallel resonators only, and wherein at least one of the resonators is tunable.

Abstract: A resonator circuit, a filter with improved tunability, and a duplexer with improved tunability are disclosed. In an embodiment, the resonator circuit includes a resonator, a Z transformer and an impedance circuit, wherein the impedance circuit has an impedance Z and includes an impedance element, wherein the Z transformer is interconnected between the resonator and the impedance circuit, and wherein the Z transformer transforms the impedance Z to a new impedance Z??Z and comprises a transformation circuit selected from: a generalized impedance converter (GIC), an negative impedance converter (NIC), a generalized impedance inverter (GII) and an negative impedance inverter (NII).

Abstract: A MEMS microphone with improved sensitivity and a method for producing such a MEMS microphone are disclosed. In an embodiment the MEMS microphone includes a carrier substrate, a capacitor having two electrodes, a substrate-side anchor and an electrode anchor, wherein the substrate-side anchor connects the substrate to the capacitor, wherein the electrode anchor connects the two electrodes of the capacitor, wherein one of the electrodes is a backplate and the other electrode is the anchored membrane, and wherein the substrate-side anchor has a bearing area on the substrate which exceeds a minimum area necessary for a mechanical stability of the MEMS microphone by not more than the minimum area.

Abstract: The present invention concerns a microelectronic package (1) comprising a microelectronic structure (2) having at least a first opening (3) and defining a first cavity (4), a capping layer (9) having at least a second opening (10) and defining a second cavity (11) which is connected to the first cavity (4), wherein the capping layer (9) is arranged over the microelectronic structure (2) such that the second opening (10) is arranged over the first opening (3), and a sealing layer (13) covering the second opening (10), thereby sealing the first cavity (4) and the second cavity (11). Moreover, the present invention concerns a method of manufacturing the microelectronic package (1).

Abstract: The invention relates to a capacitor component having a first integrated capacitor (C1) and an integrated Y capacitor, wherein the Y capacitor has a second capacitor (C2) and a third capacitor (C3), and the second and third capacitor (C2, C3) are connected in series with one another and in parallel with the first capacitor (C1). The invention further relates to a method for producing such a capacitor component.

Abstract: A ceramic multi-layer capacitor includes a main body, which has ceramic layers arranged along a layer stacking direction to form a stack, and first and second electrode layers arranged between the ceramic layers. The multi-layer capacitor also includes a first external contact-connection arranged on a first side surface of the main body and electrically conductively connected to the first electrode layers, and a second external contact-connection arranged on a second side surface (62) of the main body (2). The second side surface is situated opposite the first side surface and is electrically conductively connected to the second electrode layers.