Abstract: A pressure sensor includes: a housing; a pressure input orifice opened at a pipe sleeve of the housing; a diaphragm sealing the pressure input orifice, the diaphragm having a first surface serving as a pressure receiving surface; a pressure sensitive unit using a direction of detecting a force as a detecting axis. A first end of the pressure sensitive unit is connected to a central area of a second surface of the diaphragm. A second end of the pressure sensitive unit is connected to the housing. The detecting axis is approximately orthogonal to the pressure receiving surface. A circumference of a portion where the central area and the first end of the pressure sensitive unit are in contact with each other is located inside a circumference of the central area. A thickness of the central area is larger than a thickness of an area surrounding the central area.

Abstract: A pressure sensor includes a housing, a pressure input orifice opened on a pipe sleeve formed on the housing, a diaphragm that seals the pressure input orifice and has one face as a pressure receiving face, a force transmitting unit connected to a central area of the other face of the diaphragm in the housing, and a pressure sensitive element whose detection direction of a force is a detection axis. A displacement direction and the detection axis of the force transmitting unit are roughly orthogonal to the pressure receiving face. One end and the other end of the pressure sensitive element are respectively fixed to the housing and the force transmitting unit with an adhesive therebetween, and the adhesive is an inorganic adhesive.

Abstract: A diaphragm for a pressure sensor includes: a central section serving as a diaphragm body, the central section including: an external surface deformed upon receipt of an external pressure; and an internal surface transmitting a force to a pressure sensitive element inside a housing of the pressure sensor; a peripheral section that is an exterior of the central section and welded to an outer circumference of a pressure input orifice that is provided to the housing; and a step wall provided between the central section and the peripheral section. The central section and the peripheral section are integrally and concentrically provided. The diaphragm seals the pressure input orifice.

Abstract: An AT cut quartz crystal resonator element includes a quartz crystal element piece having an exciting part formed from an AT cut quartz crystal plate in a rectangular shape having an X-axis direction of a quartz crystal set to a long side, and an exciting electrode formed on each of front and back main surfaces of the exciting part, in which each side surface in the longitudinal direction of the exciting part is composed of two faces, an m-face of a quartz crystal and a crystal face other than the m-face.

Abstract: A piezoelectric resonator for an oscillator contained in an upper concave portion of an insulating case that has a metal lid with which the upper concave portion is air-tightly closed comprises a GND electrode being conductively coupled to an earth pattern of the piezoelectric resonator and provided on an outer bottom face of the insulating case, a piezoelectric connecting electrode being conductively coupled to an excite electrode of the piezoelectric resonator and provided on the outer bottom face of the insulating case, and an adjustment electrode being conductively coupled to the metal lid and provided on the outer bottom face of the insulating case in such a way that a regulator circuit in an IC part conductively contacts with the adjustment electrode if the IC part including the oscillation circuit is attached to the outer bottom face of the insulating case, wherein the metal lid serves as an adjustment terminal.

Abstract: An AT cut quartz crystal resonator element includes a quartz crystal element piece having an exciting part formed from an AT cut quartz crystal plate in a rectangular shape having an X-axis direction of a quartz crystal set to a long side, and an exciting electrode formed on each of front and back main surfaces of the exciting part, in which each side surface in the longitudinal direction of the exciting part is composed of two faces, an m-face of a quartz crystal and a crystal face other than the m-face.

Abstract: A surface-mount SAW device configured to prevent sealing resin layer coated all over the top surface of a piezoelectric substrate from becoming charged even if the piezoelectric substrate forming the SAW device is made of a pyroelectric material. The SAW device is composed of a mounting substrate; a SAW chip provided with a piezoelectric substrate, an IDT electrode formed on one surface of said piezoelectric substrate, and connection pads connected via conductor bumps to conductor traces; a flip chip mounted to the mounting substrate; and a sealing resin layer coated all over the outer surface of the SAW chip flip-chip mounted on the mounting substrate and extended down to the top surface of the mounting substrate to define an airtight space between the IDT electrode and the mounting substrate; and wherein the electrical conductivity of the piezoelectric substrate is increased to suppress charging of the sealing resin layer.

Abstract: A hermetically sealed structure in which a base substrate 31 and a lid 33 are hermetically sealed, the base substrate serving as a part of a containing body for uniformly forming or bonding an electronic part, the lid being a lid body to be hermetically bonded to the base substrate, is structured as follows: the lid is made from a material, through which light passes; as a metal layer 25 of at least a sealing portion of the lid a platable layer 22 for performing plating and a bonding layer 24 made from gold, the bonding layer being formed closer to the front side than the platable layer are formed; and the lid is structured so as to be bonded to the base substrate 31 by an Au—Ge alloy.

Abstract: An acceleration sensing device includes: an outer frame; a first drive arm having both ends supported by sides of the outer frame through respective base parts, the sides opposing each other; a second drive arm extending from one of the base parts of at least one of the sides toward the other side; and a sensing arm that is disposed midway between the first drive arm and the second drive arm and extends form the one base part of the one side toward the other side, the sensing arm having an electrode in order to extract electric charge generated in the sensing arm. In the device, the first drive arm and the second drive arm have excitation electrodes for a flexural vibration and form a tuning fork type resonator, and center positions in thicknesses of sections that are located in the base parts and on an extension line of the first drive arm differ from a center position in a thickness of the first drive arm.

Abstract: A probe contacting electrode that is formed on a surface of a package of an electronic device and to which a probe of a probe device is contacted, including a lower layer part and an upper layer part made of a softer conductive material than a conductive material that forms the lower layer part.

Abstract: A pressure sensor includes: a housing; an attachment having a pressure input orifice communicating with an interior of the housing; a first diaphragm that seals an opening of the pressure input orifice of the attachment, an external surface of the first diaphragm being a pressure receiving surface; a force transmitting member having an end which is coupled approximately perpendicular to a main surface of the first diaphragm, the main surface being opposite from the pressure receiving surface; a swing arm which is joined to the force transmitting member and is held to a retainer at a pivoting point as a fulcrum; and a pressure sensing element having a first end coupled to the retainer and a second end coupled to the swing arm, so that a displacement direction of the force transmitting member is the same direction as a line joining the first end and the second end.

Abstract: A pressure sensor includes: a housing; an attachment portion coupled to the housing and having a pressure input orifice; a diaphragm sealing the pressure input orifice of the attachment portion and having a first surface that is a pressure receiving surface; and a pressure sensitive unit having a detecting axis in a direction in which a force is detected. In the sensor, an end of the pressure sensitive unit is connected to a central area of a second surface of the diaphragm, another end of the pressure sensitive unit is connected to the housing, and the detecting axis is approximately orthogonal to the pressure receiving surface.

Abstract: A piezoelectric device includes: a container; a piezoelectric resonator element accommodated in the container; a circuit element accommodated in the container so as not to overlap with the piezoelectric resonator element in a plan view; and a mounting stage to which the piezoelectric resonator element is fixed. The mounting stage is fixed inside the container.

Abstract: A piezoelectric device comprises: a piezoelectric resonator element having a base, a plurality of oscillating arms paralleled each other and extended from the base, a plurality of supporting arms extended from the base and in parallel with the side surface of each of the plurality of oscillating arms so as to sandwich the plurality of oscillating arms, a groove formed in at least one of a front surface and a back surface of each of the plurality of oscillating arms and an end weight layer formed in at least one of the front surface and the back surface near to an end portion of each of the plurality of oscillating arms; a package storing the piezoelectric resonator element within a containable recess and being air-tightly sealed by a lid; a bottom surface recess rimmed in the bottom surface of the containable recess; and a connecting pad formed as a protrusion in an region that is connected with the plurality of supporting arms in the bottom surface of the containable recess.

Abstract: A piezoelectric device includes an integrated circuit (IC) chip and a piezoelectric resonator element, a part of the piezoelectric resonator element being disposed so as to overlap with a part of the IC chip when viewed in plan. The IC chip includes: an inner pad disposed on an active face and in an area where is overlapped with the piezoelectric resonator when viewed in plan; an insulating layer formed on the active face; a relocation pad disposed on the insulating layer and in an area other than a part where is overlapped with the piezoelectric resonator element, the relocation pad being coupled to an end part of a first wire; and a second wire electrically coupling the inner pad and the relocation pad, the second wire having a relocation wire and a connector that penetrates the insulating layer, the relocation wire being disposed between the insulating layer and the active face.

Abstract: An object of the invention is to provide a SAW device where a device size is made smaller than that of a conventional structure, has a high Q value, and is excellent in a frequency temperature characteristic in a SAW device using a quartz substrate. Therefore, IDTs 2 including pluralities of electrode fingers mutually inserted and grating reflectors 3a and 3b positioned on both sides of the IDTs 2 are disposed on a piezoelectric substrate 1. The piezoelectric substrate 1 is a quartz flat plate where a cut angle ? of a rotation Y cut quartz substrate is set to satisfy a range of ?64.0°<?<?49.3° in a counterclockwise direction from a crystal Z-axis and a propagation direction of a surface acoustic wave is set to 90°±5° to a crystal X-axis, and a surface acoustic wave to be excited is an SH wave.

Abstract: A piezoelectric device includes: a base substrate; an electronic component provided on a first surface of the base substrate; and a piezoelectric resonator that is provided on the first surface of the base substrate without planarly overlapping with the electronic component and have a package base, a mounting surface of the package base having one of a recessed part and a cutout part. In the device, the base substrate includes a resonator-disposing section disposed in a region of the one of the recessed part and the cutout part of the piezoelectric resonator and the resonator-disposing section is a part of the base substrate in plan view and is coupled to a bottom surface of the one of the recessed part and the cutout part.

Abstract: A piezoelectric device includes a piezoelectric substrate having a connection pad, a package having an electrode pad, and a connection member to connect the electrode pad to the connection pad, the connection member being a metal member having a plurality of spherical metal particles connected to each other by sintering.

Abstract: A piezoelectric device, includes: a package; a piezoelectric resonator element housed in the package; a lid made of metal and bonded to the package by seam welding to seal the package air-tightly; a metal film for frequency adjustment that is provided to the piezoelectric resonator element; and a window part provided to the lid and enabling a light to transmit therethrough.

Abstract: A surface acoustic wave device, includes: an interdigital transducer serving as an electrode pattern to excite a Rayleigh surface acoustic wave, the interdigital transducer including a comb-tooth-shaped electrode having a plurality of electrode fingers; a piezoelectric substrate on which the interdigital transducer is formed, the piezoelectric substrate being made of a quartz substrate that is cut out at a cut angle represented by an Euler angle representation (?, ?, ?) of (0°, 95°???155°, 33°?|?|?46°); electrode finger grooves formed between the electrode fingers of the comb-tooth-shaped electrode; and electrode finger bases being quartz portions sandwiched between the electrode finger grooves and having upper surfaces on which the electrode fingers are positioned The surface acoustic wave device provides an excitation in an upper limit mode of a stop band of the surface acoustic wave.