Abstract: A piezoelectric resonator element includes: a resonating arm extending in a first direction and cantilever-supported; a base portion cantilever-supporting the resonating arm; and an excitation electrode allowing the resonating arm to perform flexural vibration in a second direction that is orthogonal to the first direction. In the piezoelectric resonator element, the resonating arm includes an adjusting part adjusting rigidity with respect to a bend in a third direction that is orthogonal to the first and second directions.

Abstract: A piezoelectric resonator includes a resonator substrate, a base substrate supporting the resonator substrate, a lid substrate covering a surface of the resonator substrate, the surface being on an opposite side of a surface facing the base substrate, a first excitation electrode formed on the surface of the resonator substrate facing the lid substrate, a second excitation electrode formed on the surface of the resonator substrate facing the base substrate, and a third electrode provided on the surface of the resonator substrate facing the base substrate, the third electrode being electrically connected to the first excitation electrode through a concave portion which is formed on a side surface of the resonator substrate.

Abstract: A piezoelectric device includes: a package including a first recessed part provided on a first surface of the package, a second recessed part provided on a second surface of the package, and a penetrating part passing partially from the first recessed part through the second recessed part; a piezoelectric element housed in the first recessed part; a lid disposed on the upper side of the first recessed part; an IC chip disposed and fixed in the second recessed part of the package so as to block a part of the penetrating part; and a sealing part provided to the second recessed part. The IC chip and the sealing part close up the penetrating part and the lid seals the first recessed part air-tightly. A piezoelectric device is provided. The piezoelectric device realizes thickness reduction thereof without undergoing warpage and breakage of an IC chip or a package thereof.

Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin.

Abstract: A laminated wave plate that corresponds to a plurality of wavelengths including at least two wavelengths of ?A and ?B, and includes a first wave plate disposed on an incident side and a second wave plate disposed on an emitting side, the first wave plate and the second wave plate being laminated in such a manner that their optical axes are intersected each other, includes the following equations from (1) to (5): ?A1=360°+360°×2NA ??(1); ?A2=180°+360°×NA ??(2); ?B1=360°×2NB ??(3); ?B2=360°×NB ??(4); and NB=(?nB/?nA)×(?A/?B)×(0.

Abstract: A surface acoustic wave filter (cascaded dual mode SAW filter) includes three IDT electrodes disposed adjacent to each other along the propagation direction of a surface wave on a piezoelectric substrate and two primary-tertiary longitudinally-coupled dual mode SAW filters cascaded and constructed by arranging grating reflectors on both sides of three IDT electrodes. At least a pair of electrode fingers are thinned out from the IDT electrodes disposed outside, and floating electrodes are then disposed.

Abstract: [Problem to be Solved] A piezoelectric device is provided in which, when the piezoelectric device is miniaturized, drive level characteristics are favorable, stress does not remain in a bonding portion of a housing body, and a factor causing deterioration of characteristics does not remain. [Solution] A piezoelectric device includes a base substrate 54, a resonator element 55 with a frame, and a lid 56 layered over and fixed to the resonator element with a frame, in which the base substrate, the resonator element with a frame, and the lid are all formed from a same material. The resonator element 55 with a frame includes a resonator element main body 32 and a frame section 53. Each bonding surface bonding the base substrate, the resonator element with a frame, and the lid is bonded by surface activation bonding and hermetically sealed. An electrode for driving of the resonator element main body 32 is routed to the frame section as an extraction electrode.

Abstract: A temperature-sensor circuit includes: a transistor having an emitter that is grounded, a collector, and a base; a first resistor having a first end and a second end, the first end being coupled with the collector; and a second resistor having a third end and a fourth end, the third end being coupled with the second end of the first resistor. A junction joining the first resistor and the second resistor is coupled with the base.

Abstract: A piezoelectric device includes: a lower substrate; an upper substrate; an intermediate substrate sandwiched between the lower substrate and the upper substrate, the intermediate substrate including: a piezoelectric vibrating portion; a frame surrounding a periphery of the piezoelectric vibrating portion; a connecting portion coupling the piezoelectric vibrating portion and the frame; a first exciting electrode disposed on an upper surface of the piezoelectric vibrating portion; a second exciting electrode disposed on a lower surface of the piezoelectric vibrating portion; a first wiring line electrically coupled to the first exciting electrode; and a second wiring line electrically coupled to the second exciting electrode; and an inside surface coupling an upper surface and a lower surface of the frame and having a slanted surface having an interior angle with respect to one of the upper surface and the lower surface, the angle being 90 degrees or more.

Abstract: A piezoelectric oscillator includes: a package including a first recessed portion formed on a first surface, a second recessed portion formed on a second surface with at least a part of a side surface being open, and a conductor wired from at least one of an inside surface of the first recessed portion and an inside surface of the second recessed portion to an outside surface; a piezoelectric element accommodated in the first recessed portion; a lid being in contact with the first surface and air-tightly sealing the first recessed portion; a circuit element accommodated in the second recessed portion and connected with the conductor; a resin portion formed in the second recessed portion to cover the circuit element; and an electrical check terminal connected with the conductor of the package.

Abstract: A piezoelectric resonator includes a resonator substrate, a base substrate supporting the resonator substrate, a lid substrate covering a surface of the resonator substrate, the surface being on an opposite side of a surface facing the base substrate, a first excitation electrode formed on the surface of the resonator substrate facing the lid substrate, a second excitation electrode formed on the surface of the resonator substrate facing the base substrate, and a third electrode provided on the surface of the resonator substrate facing the base substrate, the third electrode being electrically connected to the first excitation electrode through a concave portion which is formed on a side surface of the resonator substrate.

Abstract: A piezoelectric device includes a piezoelectric element package having a piezoelectric element accommodated therein and a connection terminal formed on a side surface and a bottom surface thereof, a circuit element coupled to the connection terminal on the bottom surface of the piezoelectric element package, an insulating resin portion being in an essentially rectangular parallelepiped shape and covering the circuit element, an external electrode formed on a bottom surface of the resin portion, and a connection electrode formed on the side surface of the piezoelectric element package and a side surface of the resin portion and coupling the connection terminal formed on the side surface of the piezoelectric element package and the external electrode on the resin portion.

Abstract: A polarization conversion element includes: a plurality of light transmitting substrates sequentially bonded at a plurality of inclined planes thereof that form an angle of approximately 45° with respect to a light incident face and a light emitting face being approximately parallel to the light incident face; a retardation plate providing a phase difference to incident polarized light; a polarization separation film separating incident light into two types of polarized light; and an air layer. In the element, the polarization separation film and the air layer are alternately formed along the plurality of inclined planes.

Abstract: [Problem] In a SAW device using a quartz crystal substrate, prevent the deterioration of Q factor due to the difference in the peak frequency between the radiation conductance of an IDT and the reflection coefficient of a reflector. [Means to Solve the Problem] A surface acoustic wave (SAW) device includes a piezoelectric substrate made of a quartz crystal flat plate where a cut angle of a rotated Y-cut quartz substrate is set in ?64.0°<?<?49.3° with a crystalline Z axis and a propagation direction of the surface acoustic wave is set at 90°±5° with a crystalline X axis, an interdigital transducer (IDT) formed on the piezoelectric substrate and reflectors disposed at both sides of the IDT, wherein an exciting wave is SH wave, an electrode film thickness “H/?” normalized by a wavelength of the IDT is 0.05?H/??0.07 where “?” is a wavelength of the exciting SAW, and a ratio of an electrode pitch between the IDT and the reflector “Lt/Lr” is set to satisfy the following formula: 31.50×(H/?)2?4.435×(H/?)+1.

Abstract: A piezoelectric oscillator includes: a piezoelectric resonator element having a piezoelectric substrate and an excitation electrode formed on a surface of the piezoelectric substrate; a semiconductor circuit element provided with an oscillation circuit for oscillating the piezoelectric resonator element and having a first insulating film formed on a principal surface; a package for airtightly housing the semiconductor circuit element and the piezoelectric resonator element; and a protruding section having at least of a thin film circuit component formed on the first insulating film and connected to the oscillation circuit; and a second insulating film formed on the first insulating film and covering the thin film circuit component.

Abstract: A real time clock for outputting data indicating a time of day includes: an event detection circuit for detecting that an event detection signal has been inputted from outside; a timing circuit for generating the time-of-day data according to a signal outputted from an oscillator circuit; a memory; and a control circuit for, if the event detection circuit detects input of the event detection signal, recording event data in the memory, the event data including additional data indicating an operating state of the real time clock and the time-of-day data generated by the timing circuit.

Abstract: A vibration gyro made of a single crystal piezoelectric material includes: a base; a plurality of resonating arms extending from the base; an excitation electrode formed on a surface of at least one of the plurality of resonating arms so as to vibrate at least the one of the plurality of resonating arms; and a piezoelectric element detecting a vibration component due to a Coriolis force acting perpendicularly to a vibrating direction of the plurality of resonating arms being vibrated by the excitation electrode, the piezoelectric element being mounted on a surface of at least one of the plurality of resonating arms and the base.

Abstract: An electronic module, comprises: a circuit board; a piezoelectric device having a lid, the piezoelectric device being mounted on the circuit board; and an electronic component mounted on the circuit board. The electronic component includes an adjustment terminal for at least one of adjusting and inspecting an electrical characteristic thereof. The lid is electrically conducted to the adjustment terminal.

Abstract: A surface acoustic wave element includes a piezoelectric substrate, an IDT composed of a pair of first and second comb-like electrodes, formed around a center of the piezoelectric substrate, and formed on a surface of the surface acoustic wave element, and a pair of first and second terminals electrically connected to the IDT, formed at central and peripheral areas of the piezoelectric substrate, respectively, in which a package is bonded with an adhesive to a surface of the surface acoustic wave element, opposite to the surface formed with the IDT.

Abstract: A piezoelectric resonator includes a piezoelectric resonator element having a base portion and a resonating arm extending from the base portion, a package including a bottom to which the piezoelectric resonator element is fixed and a frame wall that surrounds the bottom and having an opening above the bottom, and a lid for closing the opening of the package. In this piezoelectric resonator, the lid includes a main body having a through-hole formed therein, a flange formed to surround a periphery of the main body and to be thinner than the main body, and an optically transparent member located in the through-hole. The flange has a joining portion with an upper end surface of the frame wall, and the main body projects in a direction from the flange to the bottom in a thickness direction. Also, the through-hole is at a position displaced in a first direction approaching a first end of the main body from a center of the main body.