Abstract: The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P?, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

Abstract: The present invention provides a process for preparing polyimides. The process includes cyclizing a polyimide precursor composition in a vacuum-like environment by using infrared radiation to give polyimide. The process can effectively reduce the cyclization temperature and time, thereby reducing energy and process costs.

Abstract: The present disclosure relates to a solvent-containing dry film and a method for applying a dry film on a substrate. The dry film includes a carrier and a resin layer. The resin layer contains a resin composition and a solvent and the solvent is present in a total amount of at least 5 wt % based on the total weight of the resin layer. The dry film of the present invention can be applied onto a substrate without the use of a prior art vacuum lamination apparatus. The application process is simple and is more cost-efficient than the prior art techniques.

Abstract: The present disclosure pertains to an electromagnetic-wave shielding film and a preparation method thereof. The electromagnetic-wave shielding film includes a first metal layer, an insulating layer, and a second metal layer. The first metal layer has two opposite surfaces. The insulating layer is disposed on one of the surfaces of the first metal layer. The second metal layer is disposed on the other surface of the first metal layer and contains nano metal particles and an binder. The electromagnetic-wave shielding film can be used in a printed circuit board, and shows a satisfactory electromagnetic wave shielding effect.

Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.

Abstract: The invention provides a thermally-polymerizable composition. The thermally-polymerizable composition includes a (meth)acrylate oligomer having one or more functional groups, a thermal initiator, and a plasticizer. The invention also provides a combined solution formed by the thermally-polymerizable composition via a solvent-free thermal polymerization reaction. The combined solution can be used for adhesion, coating, or packaging.

Abstract: A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.

Abstract: The present invention provides a process for preparing polyimides. The process includes cyclizing a polyimide precursor composition in a vacuum-like environment by using infrared radiation to give polyimide. The process can effectively reduce the cyclization temperature and time, thereby reducing energy and process costs.

Abstract: The present invention provides a silicon-carbon composite which contains a body having a core-shell structure and a polymer modification layer. The core of the body contains a silicon-containing particle. The shell of the body is a carbon encapsulation layer. The polymer modification layer is located on the external surface of the shell of the body and encapsulates the body. The polymer modification layer comprises a polymer selected from the group consisting of polyester, polyfluorocarbon, polyvinyl alcohol, polyacrylic acid, cellulose and a combination thereof.

Abstract: The present disclosure provides a photocurable coating composition, including: (a) a (meth)acrylate monomer or oligomer with at least four functional groups; (b) a difunctional (meth)acrylate monomer, (c) a monofunctional (meth)acrylate monomer, and (d) an initiator. The difunctional (meth)acrylate monomer is present in an amount of 30 to 70 wt % based on the total weight of the photocurable coating composition. The present disclosure also provides an optical film having a microstructure layer made from the photocurable coating composition. The optical film can be as a light guide film in a back light module of a display.

Abstract: The invention pertains to a conductive material formulation comprising: (a) a conductive polymer material; and (b) an insulation material, wherein the conductive polymer material is derived from a conductive polymer and a polyanion and has a weight average molecular weight ranging from 3,000 to 30,000; and wherein the (b) insulation material is present in an amount of 0.01 part to 200 parts by weight based on 100 parts by weight of the (a) conductive polymer material. The conductive material formulation according to the invention is useful for the preparation of solid capacitors.

Abstract: A process for preparing aryl ketones is disclosed. The process includes photo-oxidizing a compound of formula (V), (VI), (VII) or (VIII): in the presence of an oxidative system comprising at least one bromide compound to form aryl ketones. X1, X2, R1, R2, R3, L1, L2, L3, L4, t, n, m and p have the meanings as described in the specification and claims.

Abstract: A polymerizable composition is provided, including an infrared absorber, a polymerization initiator, a polymerizable compound, and a polymer binder, wherein the polymer binder is a particulate random copolymer, and the polymer binder has structural units derived from a polymerizable polyalkylene oxide-based monomer and a polymerizable nitrogen-free non-polyalkylene oxide-based monomer. The polymerizable composition may be used in the production of imageable elements or printing plates.

Abstract: The present invention is related to a core-shell particle and preparation and use thereof. The core of the core-shell particle includes a vinyl polymer. The shell of the core-shell particle includes a hydrophobic silane bonded to a surface of the core via a silane coupling agent. The core-shell particles are applied in a matting material as a matting agent.

Abstract: An electrolyte composition including a heterocyclic compound, an electrolyte salt and a solvent is provided. The heterocyclic compound includes, in the heterocyclic ring: (a) at least two nitrogen atoms each of which is bonded to a —Si(R1)3 group; and (b) at least one carbonyl group (C?O) or thiocarbonyl group (C?S) wherein R1 is a C1-3 alkyl group or an aryl group. The electrolyte composition of the present disclosure is suitable for an electrochemical device. Electrochemical devices, in particular batteries, using the electrolyte composition of else present disclosure are capable of efficiently inhibiting the moisture and acidity therein, thereby stabilizing the electrolyte salt therein, and preventing the electrolyte salt from being further decomposed and from producing hydrogen fluoride.

Abstract: A polyimide (PI) having two —COOH capping groups at each end is provided. A coating composition is further provided, which contains the PI and a hardening agent having 2 to 6 functional groups capable of reacting with —COOH. A PI coating layer and PI film formed by the coating composition of the present invention possess excellent chemical resistance and coefficient of thermal expansion (CTE), which makes them applicable in fabrication of protective materials for active/passive devices, optical materials, touch panels, copper foil substrates, soft flexible electronic materials or integrated circuit elements, or film substrate for glass film touch panels.

Abstract: The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.

Abstract: The present disclosure relates to a polyimide precursor composition comprising an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.

Abstract: The present invention provides a hydrophilic film for an ex vivo membrane, which includes: a substrate; and a hydrophilic coating located on at least one surface of the substrate and formed by a hydrophilic composition, in which the hydrophilic composition includes: (a) a reactive adhesive; (b) a surfactant having reactivity; and (c) optionally a polyol.

Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are those as defined in the specification. The present invention also provides a polyimide precursor composition or a photosensitive polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.