Abstract: The invention pertains to a conductive material formulation comprising: (a) a conductive polymer material; and (b) an insulation material, wherein the conductive polymer material is derived from a conductive polymer and a polyanion and has a weight average molecular weight ranging from 3,000 to 30,000; and wherein the (b) insulation material is present in an amount of 0.01 part to 200 parts by weight based on 100 parts by weight of the (a) conductive polymer material. The conductive material formulation according to the invention is useful for the preparation of solid capacitors.

Abstract: The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P?, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.

Abstract: The invention pertains to a conductive material formulation comprising: (a) a conductive polymer material; and (b) an insulation material, wherein the conductive polymer material is derived from a conductive polymer and a polyanion and has a weight average molecular weight ranging from 3,000 to 30,000; and wherein the (b) insulation material is present in an amount of 0.01 part to 200 parts by weight based on 100 parts by weight of the (a) conductive polymer material. The conductive material formulation according to the invention is useful for the preparation of solid capacitors.

Abstract: The present invention provides an optical material composition, including: (a) an acrylate-based material; (b) an anti-yellowing agent, selected from the group consisting of an inorganic phosphorus-containing acid, a phosphate and a combination thereof; and (c) an initiator. After being cured, the composition of the present invention has good transmittance, anti-yellowing performance and high-temperature resistance.

Abstract: The present invention provides an electrolyte material formulation including: (a) a monomer of formula (I) (b) a monomer of formula (II) ?and (c) a polymerizable compound, wherein A, X, B1, B2, R1 to R3, q and w are defined as those recited in the specification, and the monomer (b) is in an amount of about 1 part by weight to about 800 parts by weight and the polymerizable compound (c) is in an amount of about 1 part by weight to about 10000 parts by weight based on 100 parts by weight of the monomer (a). The present invention further provides an electrolytic material composition obtained by the polymerization of the aforementioned electrolytic material formulation. The electrolytic material composition can be applied to a solid electrolyte capacitor.

Abstract: The invention provides a thermally-polymerizable composition. The thermally-polymerizable composition includes a (meth)acrylate oligomer having one or more functional groups, a thermal initiator, and a plasticizer. The invention also provides a combined solution formed by the thermally-polymerizable composition via a solvent-free thermal polymerization reaction. The combined solution can be used for adhesion, coating, or packaging.

Abstract: A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.

Abstract: A laminated structure for use as a thy film photoresist, which includes a supporting layer, a photosensitive resin layer and a protective layer. The protective layer is a polyester film that has a maximum surface roughness between 1,500 nm and 2,500 nm, and a sheet resistance between 1×108?/? and 1×1012?/?. The laminated structure is particularly applicable to the manufacture of a photosensitive device and a circuit of a printed circuit board or a lead frame.

Abstract: The present invention provides an organic-inorganic composite resin, which is derived from: (A) an inorganic portion comprising (a1) one or more siloxane monomers of formula (R1)nSi(OR2)4-n, wherein R1, R2 and n are as defined in the specification; (a2) an acidic catalyst, (a3) silica, and (a4) a siloxane oligomer; and (B) an organic portion comprising (b1) one ore more acrylic monomers; wherein the weight ratio of the inorganic portion to the organic portion ranges from 2:8 to 8:2. The present invention also provides a coating composition comprising the aforementioned organic-inorganic composite resin and a hardener. The present invention further provides a reinforced substrate coated with the aforementioned coating composition.

Abstract: An electrolyte composition and a battery is provided. The electrolyte composition includes graphene. The electrolyte composition of the present invention is suitable for a battery and can improve the life cycle of the battery. The application process of the electrolyte composition of the present invention is simple and more cost-efficient as compared to conventional techniques which add carbon material(s) to a battery. The present invention is effective in improving battery performance.

Abstract: An electrolyte material formulation including: (a) a monomer of formula (I) (b) a monomer of formula (II) ?and (c) a polymerizable compound, wherein A, X, B1, B2, R1 to R3, q and w are defined as those recited in the specification, and the monomer (b) is in an amount of about 1 part by weight to about 800 parts by weight and the polymerizable compound (c) is in an amount of about 1 part by weight to about 10000 parts by weight based on 100 parts by weight of the monomer (a). Also, an electrolytic material composition obtained by the polymerization of the aforementioned electrolytic material formulation. The electrolytic material composition can be applied to a solid electrolyte capacitor.

Abstract: The present invention provides a conductive coating composition, which contains: a conductive organic polymer, a non-conductive organic compound, a solvent and optionally a curing agent; where the content of the conductive organic polymer is about 10% to about 50%, based on the total weight of the solids content in the composition. The present invention also provides a conductive film, which is formed by drying the conductive coating composition. The conductive film has a surface resistivity lower than 1000 ?/sq and a total light transmittance greater than 80%. The conductive coating composition of the present invention can be used as an electromagnetic interference shielding material or an electrode material, and can be applied to various electronic products.

Abstract: The present invention provides a base generator having the structure of formula (1): wherein R1, R2, R3, R4, R5, and Y{circle around (?)} are defined as in the specification. The base generator of the present invention can be used for imidization of a polyimide precursor, promoting crosslinking of epoxy monomers, or crosslinking of polyurethane or polyurea.

Abstract: The invention pertains to a conductive polymer composite comprising: (a) a conductive polymer and (b) a polyanion, wherein the conductive polymer comprises polymerized units derived from a monomer of formula (I): wherein: A is a C1-C4 alkylene group substituted with (R)p; X is O or S; R is H, an unsubstituted or substituted C1-C20 alkyl or alkoxy, or an unsubstituted or substituted C6-C20 aryl; and p is 0, 1, or 2, and the conductive polymer has a weight average molecular weight ranging from 3,000 to 30,000. A process for preparing the conductive polymer composite is also provided.

Abstract: A process for preparing aryl ketones is disclosed. The process includes photo-oxidizing a compound of formula (V), (VI), (VII) or (VIII): in the presence of an oxidative system comprising at least one bromide compound to form aryl ketones. X1, X2, R1, R2, R3, L1, L2, L3, L4, t, n, m and p have the meanings as described in the specification and claims.

Abstract: A modified phosphorus-containing unsaturated polyester being represented by Formula I is provided: wherein each A? is independently a residue of a diol or polyol, each B? is independently a residue of a saturated or unsaturated anhydride or acid, G1 and G2 are independently H or a residue of an isocyanate acrylate-based compound or isocyanate silicon-containing compound, with the proviso that G1 and G2 are not both H; and wherein a is an integer from 1 to 30, b is an integer from 1 to 30, and the modified phosphorus-containing unsaturated polyester has an OH value ranging from 50 to 200.

Abstract: The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.

Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.

Abstract: The present disclosure relates to a polyimide precursor composition including an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. The polyimide made from the polyimide precursor composition of the present disclosure provides adhesion upon hot pressing such that a quasi double-sided two-layer metal clad laminate with an appropriate peeling strength or a double-sided two-layer metal clad laminate with a high peeling strength can be provided.