Abstract: The present disclosure is drawn to, among other things, a storage device. The storage device may include a magnetic tunnel junction (MTJ)-based storage array and a communication interface. The MTJ-based storage array may be configured to be damaged by a shorting voltage based on detection of a tamper event.

Abstract: The present disclosure is drawn to, among other things, a method of managing a magnetoresistive memory (MRAM) device. In some aspects, the method includes receiving a configuration bit from a write mode configuration register. In response to determining the configuration bit is a first value, the MRAM device is operated in a NOR emulation mode. In response to determining the configuration bit is a second value, the MRAM device is operated in a persistent memory mode.

Abstract: A magnetoresistive stack may include a first electrically conductive material, a fixed region having a fixed magnetic state, a free region configured to have a first magnetic state and a second magnetic state, a dielectric layer disposed between the fixed region and the free region, a spacer region, and a cap layer disposed between the spacer region and the free region. The free region may include a layer of ferromagnetic material, an insertion layer, an iPMA layer, and/or a low saturation magnetization layer.

Abstract: A magnetically free region of magnetoresistive device includes at least a first ferromagnetic region and a second ferromagnetic region separated by a non-magnetic insertion region. At least one of the first ferromagnetic region and the second ferromagnetic region may include at least a layer including boron and a non-boron magnetic material positioned proximate a boron-free ferromagnetic layer.

Abstract: A scan chain circuitry for a memory device includes a first non-volatile storage bit (nvbit) configured to receive a shared control signal, a second nvbit configured to receive the shared control signal, a first flip-flop connected to the first nvbit, and a second flip-flop connected to the second nvbit and the first flip-flop. The first flip-flop enables loading a first data in (din) to the first nvbit based on a clock signal, and the second flip-flop enables loading a second din to the second nvbit based on the clock signal.

Abstract: A method of fabricating a magnetoresistive bit from a magnetoresistive stack includes (a) etching through at least a portion of a thickness of the surface region to create a first set of exposed areas in the form of multiple strips extending in a first direction, and (b) etching through at least a portion of a thickness of the surface region to create a second set of exposed areas in the form of multiple strips extending in a second direction. The first set of exposed areas and the second set of exposed areas may have multiple areas that overlap. The method may also include, (c) after the etching in (a) and (b), etching through at least a portion of the thickness of the magnetoresistive stack through the first set and second set of exposed areas.

Abstract: A method for programming a configuration bit including magnetic tunnel junctions (MTJs), including during a first phase: applying a first voltage to a first leg of MTJs and a third leg of MTJs to program or inhibit the MTJs of the first leg and the third leg, and applying a second voltage to a second leg of MTJs and a fourth leg of MTJs to program or inhibit the MTJs of the second leg and the fourth leg. During a second phase: applying the second voltage to the first leg of MTJs and the third leg of MTJs to program or inhibit the MTJs of the first leg and the third leg, and applying the first voltage to the second leg of MTJs and the fourth leg of MTJs to program or inhibit the MTJs of the second leg and the fourth leg.

Abstract: Systems and techniques include identifying a network layer for performing a memory operation, identifying a subset of a plurality of configuration bit clusters of a non-volatile distributed memory that are mapped to the identified network layer using a cluster mapping, in response to identifying the subset of the plurality of configuration bit clusters, activating the subset of the plurality of configuration bit clusters, loading network component data from the subset of the plurality of configuration bit clusters into a local buffer, and applying the network component data to the network layer for performing the memory operation.

Abstract: 1. The present disclosure is drawn to, among other things, a method for accessing memory using dual standby modes, the method including receiving a first standby mode indication selecting a first standby mode from a first standby mode or a second standby mode, configuring a read bias system to provide a read bias voltage and a write bias system to provide approximately no voltage, or any voltage outside the necessary range for write operation, based on the first standby mode, receiving a second standby mode indication selecting the second standby mode, and configuring the read bias system to provide at least the read bias voltage and the write bias system to provide a write bias voltage based on the second standby mode, the read bias voltage being lower than the write bias voltage.

Abstract: The present disclosure is drawn to, among other things, a method of managing a magnetoresistive memory (MRAM) device. In some aspects, the method includes receiving a configuration bit from a write mode configuration register. In response to determining the configuration bit is a first value, the MRAM device is operated in a NOR emulation mode. In response to determining the configuration bit is a second value, the MRAM device is operated in a persistent memory mode.

Abstract: A method of fabricating a magnetoresistive bit from a magnetoresistive stack includes etching through a first portion of the magnetoresistive stack using a first etch process to form one or more sidewalls. At least a portion of the sidewalls includes redeposited material after the etching. The method also includes modifying at least a portion of the redeposited material on the sidewalls, and etching through a second portion of the magnetoresistive stack after the modifying step. The magnetoresistive stack may include a first magnetic region, an intermediate region disposed over the first magnetic region, and a second magnetic region disposed over the intermediate region.

Abstract: The present disclosure is drawn to, among other things, a configuration bit including at least four resistive elements and a voltage amplifier. At least two first resistive elements may be electrically connected in series via a first electrode and at least two second resistive elements may be electrically connected in series via a second electrode. The at least two first resistive elements may be electrically connected in parallel to the at least two second resistive elements via a third electrode and a fourth electrode. The first electrode and the second electrode may be electrically connected to a voltage supply. The third electrode and the fourth electrode may be electrically connected to an input of the voltage amplifier.

Abstract: Aspects of the present disclosure are directed to magnetoresistive stacks including regions having increased height-to-diameter ratios. Exemplary magnetoresistive stacks (for example, used in a magnetic tunnel junction (MTJ) magnetoresistive device) of the present disclosure include one or more multilayer synthetic antiferromagnetic structures (SAFs) or synthetic ferromagnetic structures (SyFs) in order to promote stability of the SAF or SyF, e.g., for smaller-sized MTJs.

Abstract: A memory includes a plurality of magnetoresistive devices, wherein each magnetoresistive device includes a fixed magnetic layer, a free magnetic layer, a tunnel barrier disposed between the fixed and free magnetic layers, and an insertion layer disposed below the free magnetic layer, wherein the fixed magnetic layer is formed above the free magnetic layer. The memory also includes a plurality of antiferromagnetic layers, wherein each antiferromagnetic layer is disposed above a seed layer. The memory further includes a spin-orbit-torque (SOT) channel, wherein the SOT channel is disposed between the plurality of magnetoresistive devices and the plurality of antiferromagnetic layers.

Abstract: A method of fabricating a magnetoresistive bit from a magnetoresistive stack includes (a) etching through at least a portion of a thickness of the surface region to create a first set of exposed areas in the form of multiple strips extending in a first direction, and (b) etching through at least a portion of a thickness of the surface region to create a second set of exposed areas in the form of multiple strips extending in a second direction. The first set of exposed areas and the second set of exposed areas may have multiple areas that overlap. The method may also include, (c) after the etching in (a) and (b), etching through at least a portion of the thickness of the magnetoresistive stack through the first set and second set of exposed areas.

Abstract: A scan chain circuitry for a memory device includes a first non-volatile storage bit (nvbit) configured to receive a shared control signal, a second nvbit configured to receive the shared control signal, a first flip-flop connected to the first nvbit, and a second flip-flop connected to the second nvbit and the first flip-flop. The first flip-flop enables loading a first data in (din) to the first nvbit based on a clock signal, and the second flip-flop enables loading a second din to the second nvbit based on the clock signal.

Abstract: A memory device includes a printed circuit board, a magnetoresistive random-access memory (MRAM) device coupled to the printed circuit board, a controller or control circuitry, wherein the controller or control circuitry is integrated into, embedded in, or otherwise incorporated into the MRAM device, and a field programmable gate array (FPGA) coupled to the printed circuit board and in communication with the controller or control circuitry.

Abstract: The present disclosure is drawn to, among other things, a method of managing a memory device. In some aspects, the method includes determining whether a first address for a page in a first memory region is mapped in a map table, setting a target address as a second address identified in the map table as being mapped to the first address, setting the target address as the first address, determining a number of bits that fail in each word of a plurality of first-layer error correction code (ECC) words for the target address, and adding the target address to the map table, writing-back contents from the target address to a repair address in the first memory region, and updating the map table by mapping the target address to the repair address.

Abstract: A memory device including an array circuit including a magnetic tunnel junction (MTJ) bit having a logical state and including a set of MTJs is provided. The memory device further includes a read device electrically connected to the MTJ bit and configured to read the logical state of the MTJ bit. The memory device includes a write circuit electrically connected to the MTJ bit and configured to write the logical state of the MTJ bit. The array circuit is powered off between operations on the MTJ bit by the read device and/or the write circuit.

Abstract: Three bridge circuits (101, 111, 121), each include magnetoresistive sensors coupled as a Wheatstone bridge (100) to sense a magnetic field (160) in three orthogonal directions (110, 120, 130) that are set with a single pinning material deposition and bulk wafer setting procedure. One of the three bridge circuits (121) includes a first magnetoresistive sensor (141) comprising a first sensing element (122) disposed on a pinned layer (126), the first sensing element (122) having first and second edges and first and second sides, and a first flux guide (132) disposed non-parallel to the first side of the substrate and having an end that is proximate to the first edge and on the first side of the first sensing element (122). An optional second flux guide (136) may be disposed non-parallel to the first side of the substrate and having an end that is proximate to the second edge and the second side of the first sensing element (122).