Abstract: The present application relates to an organic electronic device, said electronic device comprising a multi-layer electrode as well as an organic semiconducting layer, as well as to a method for producing such organic electronic device.

Abstract: A technique comprising: depositing a first layer comprising a precursor to a cross-linked polymer on a substrate comprising at least a semiconductor material that provides one or more semiconductor channels for one or more transistors, wherein said first layer provides at least part of a gate dielectric for said one or more transistors; and exposing the first layer to an argon plasma to produce the cross-linked polymer from the precursor.

Abstract: A technique comprising: providing an assembly temporarily adhered on opposite sides to respective carriers by respective adhesive elements, the assembly including at least one plastic support sheet; heating the assembly while mechanically compressing the assembly between the carriers, wherein the strength of adhesion of one of said adhesive elements to the respective carrier and/or to the assembly is partially reduced during said heating of the assembly under mechanical compression; and wherein the strength of adhesion of the said adhesive element to the carrier and/or to the assembly is further reducible by further heating the said adhesive element after partially or completely relaxing the pressure at which the assembly is mechanically compressed between the two carriers.

Abstract: The present invention relates to a ring closure reaction useful in synthesizing fused aromatic or heteroaromatic ring systems, which may, for example, be used as organic semiconductor materials.

Abstract: A technique comprising: providing an assembly temporarily adhered on opposite sides to respective carriers by respective adhesive elements, the assembly including at least one plastic support sheet; heating the assembly while mechanically compressing the assembly between the carriers, wherein the strength of adhesion of one of said adhesive elements to the respective carrier and/or to the assembly is partially reduced during said heating of the assembly under mechanical compression; and wherein the strength of adhesion of the said adhesive element to the carrier and/or to the assembly is further reducible by further heating the said adhesive element after partially or completely relaxing the pressure at which the assembly is mechanically compressed between the two carriers.

Abstract: An array component for a display device, comprising: an array of active light-emitting elements in a matrix, wherein at least some of the active light-emitting elements at a periphery of the array of active light-emitting elements have a light-emitting area that is (i) smaller than other active light-emitting elements more remote from said periphery, and (ii) different to other active light-emitting elements at said periphery of the array; wherein said active light-emitting elements are arranged in rows, and wherein (i) one or more of said active light-emitting elements in a row and at a periphery of the array have centroids aligned in a direction substantially parallel to the direction of the rows with (ii) other active light-emitting elements also in said row and more remote from said periphery.

Abstract: A method of forming a curved optical modulator component for use with a backlight, wherein the optical modulator component comprises at least a control component including a support film supporting a stack of layers defining an array of pixel electrodes independently addressable via conductors outside the array of pixel electrodes; and wherein the method comprises: preparing at least said control component in a substantially planar configuration; forcibly flexing the control component into a stressed configuration about a curved surface of a first curved component and bonding the control component in the stressed configuration to the curved component on one side of the control component; and bonding a second curved component to at least the control component on an opposite side of the control component.

Abstract: A method of forming a backlit curved display device, comprising: preparing at least one resiliently flexible plastics film component in a substantially planar configuration, which plastics film component forms at least part of an optical modulator component; flexing the plastics film component into a stressed configuration about a curved surface of a backlight component and bonding at least the plastics film component in the stressed configuration to the curved surface of the backlight component.

Abstract: A method of forming a stack of layers defining one or more electronic devices, the method comprising: depositing a first thickness of curable, dielectric or dielectric precursor material over an area of a workpiece; thereafter exposing the workpiece to curing conditions at least over said area of said workpiece; and without any intermediate patterning operation, thereafter depositing a second thickness of said curable material over said area of said workpiece; and thereafter again exposing the workpiece to curing conditions at least over said area of said workpiece.

Abstract: A technique comprising: preparing a self-supporting plastics film component comprising a plastics support film supporting at least a stack of layers defining an array of pixel electrodes and electrical circuitry for independently addressing each pixel electrode via conductors outside the array of pixel electrodes; thereafter attaching a carrier to the plastics film component; mounting the plastics film component via the carrier on a support unit surface defining a plurality of openings connected to a vacuum pump; and processing the plastics film component mounted on the support unit surface while operating the vacuum pump; and thereafter releasing the carrier from the plastics film component.

Abstract: There is provided a method of patterning a stack of layers defining one or more electronic device elements, comprising: creating a first thickness profile in an uppermost portion of the stack of layers by laser ablation; and etching the stack of layers to translate the first thickness profile into a second thickness profile at a lower level; wherein the etching reduces the thickness of said uppermost portion of the stack and one or more lower layers of the stack under said uppermost portion.

Abstract: A device comprising: a stack of layers supported on a support film and defining an array of pixel electrodes and electrical circuitry via which each pixel electrode is independently addressable via conductors outside of the array of pixel electrodes; and transmissive conductors supported on said support film at a first conductor level below said stack of layers in the regions of said pixel electrodes; wherein said conductors are light-transmissive and are connected within the first conductor level to a conductor outside the array of pixel electrodes; wherein said transmissive conductors exhibit a substantially higher transmittance for some wavelengths in the visible spectrum than for other wavelengths in the visible spectrum.

Abstract: An optoelectronic device comprising a unit, which unit comprises: a plurality of resiliently flexible sheet components bonded together, the resiliently flexible sheet components comprising: (i) a first sheet component comprising at least a stack of layers defining an array of pixel electrodes and electrical circuitry for independently addressing each pixel electrodes via addressing conductors outside the array of pixel electrodes; and (ii) a second sheet component bonded to a top surface of the first sheet component; wherein the device further comprises one or more driver chips bonded to the first sheet component in a location underlying the second component and for electrical contact between said addressing conductors and terminals of said one or more driver chips; and wherein the thickness of material in the unit in the region of the one or more driver chips is substantially the same as the thickness of material in the unit in the region of the array.

Abstract: A method, comprising: forming a patterned layer of matrix material and/or one or more patterned layers of colour filter material in situ over a support film; forming in situ over said support film a stack of layers defining electrical circuitry via which each of an array of pixel electrodes is independently addressable; wherein forming said stack of layers comprises forming in situ over said patterned layer of matrix material and/or one or more patterned layers of colour filter material at least: a patterned conductor layer defining an array of source conductors and an array of drain conductors; a layer of semiconductor channel material defining semiconductor channels between the source and drain conductors; and another patterned conductor layer defining an array of gate conductors providing gate electrodes in said channel regions.

Abstract: An imager is provided. The imager has an imaging platen which presents an imaging surface against which an object to be imaged can be placed. The imaging platen has a photodetector layer and a light guiding layer operable to guide light towards the object. The imager includes a light source operable to emit light into the light guiding layer. The light source is located at an edge of the light guiding layer, to guide light into the light guiding layer of the imaging platen.

Abstract: An electronic or optoelectronic device including a semiconductor layer, wherein the semiconductor layer comprises at least a semiconductive organic material, water species, and at least one additive in an amount of at least 0.1% by weight relative to the semiconductive organic material, which additive at least partly negates a charge carrier trapping effect caused by the water species on the semiconductive organic material.

Abstract: A method for forming electrical connections between electrical conductors is provided. The method includes depositing an anisotropic conductive bonding material (AC bonding material) on a first plurality of electrical conductors, sandwiching the AC bonding material between the first plurality of electrical conductors and a second plurality of electrical conductors, providing first and second cushions formed of a thermally resistive and elastic material, and applying heat and pressure to the second cushion to form the AC bond between the first and second plurality of conductors.

Abstract: A technique comprising: producing an unencapsulated stack of layers (10) defining one or more electronic devices including an organic semiconductor element; and then subjecting the unencapsulated stack of layers to a water removal treatment in a vacuum oven (12) in the presence of an external water adsorbent (14); wherein the water removal treatment comprises heating the unencapsulated stack of layers in the vacuum oven for a time period longer than a control time period at which a spike in oven pressure attributable to the release of water from the stack of layers would occur with heating under the same treatment conditions but without the water absorbing material.

Abstract: A pixelated optical sensor device, comprising: a stack of layers supported on a substrate and defining an array of pixel electrodes and circuitry for independently addressing each pixel electrode; an organic photoactive layer in electrical contact with the array of pixel electrodes; and one or more counter electrodes in electrical contact with the array of pixel electrodes via the organic photoactive layer; wherein the pixel electrodes are formed from a noble metal material, and the one or more counter electrodes comprise a poly(3,4-ethylenedioxythiophene) polystyrene sulfonate material.

Abstract: A technique comprising: securing a device substrate (8) to a carrier (1) using one or more adhesive elements (6); forming electronic elements (10) on the device substrate with the device substrate thus secured to the carrier; and thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier.