Abstract: A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.

Abstract: Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.

Abstract: The present disclosure discloses a supply chain management system that can estimate manufactured item delivery times at a facility, manufactured item costs or prices, and dynamically control supply chain performance.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.

Abstract: Embodiments of the invention include systems and methods for automatically predicting production yield for a circuit assembly according to attributes of its components and defect data mapped thereto. Embodiments receive a proposed design specification for a circuit assembly, including bill of materials (BOM) and schematic data, at a yield prediction environment. The yield prediction environment maps a set of attributes to each component in the BOM and maps a set of possible defects to each component according to its attributes. Defects may be further mapped to a manufacturing process assigned to populate each component in the circuit assembly. The defects are associated with predicted frequencies of occurrence, which can be used to roll up a yield prediction for the circuit assembly. Embodiments further allow “what-if” analysis to be performed so that different yield prediction results can be compared according to different form factor options and/or different manufacturing process options.

Abstract: A leadframe based photovoltaic assembly and method for assembling the same is disclosed. The photovoltaic assembly comprises a first and second mold compounds to effectuate the accurate placement of an optical concentrator above a photovoltaic cell. The photovoltaic assembly is able to be assembled using existing mature semiconductor packaging technologies.

Abstract: A mobile phone comprising: a user interface configured to display a menu system and to receive input; and an electronic device configured to: provide the menu system having menu levels with each menu level comprising distinct menu items, enable the user to make a preliminary selection of any distinct menu item at a first menu level, wherein the user remains at the first menu level upon making the preliminary selection, provide an audio output in response to the user making a preliminary selection of any of the distinct menu items, wherein the audio output is unique for each distinct menu item, and enable the user to make a determinative selection of any distinct menu item at a first menu level only after a preliminary selection of that distinct menu item has been made, wherein the user proceeds to a second menu level upon making the determinative selection.

Abstract: A circuit board includes a pair of differential signal lines and a pair of test point pads, one test point pad coupled to one of the signal lines and another of the test point pads coupled to another of the signal lines. The two test point pads are staggered relative to each other and the two signal lines. The circuit board includes a plurality of conductive layers and a plurality of insulating layers. The conductive layers can be etched into conductive patterns, or traces, for connecting the electronic components, which are soldered to the circuit board. The conductive layers may be selectively connected together by vias. One or more of the conductive layers may be a metal plane for providing a ground plane and/or a power plane. To minimize or eliminate the capacitance generated between the test point pad and an underlying ground plane and/or power plane, portions of the ground plane and/or the portion of the power plane directly aligned with each test point pad are removed.

Abstract: A method and apparatus that allows egress pointer smoothing data by evaluating the average fill of an elastic store. For one embodiment of the invention, by measuring the average fill, the 3 bytes of SOH and 87 bytes of data are taken together in each sample, and the relative phase of ingress and egress frames does not impact the fill depth calculation. For one such embodiment, the calculation is performed by summing the elastic store fill over a full row and increment/decrement decisions based on that average figure provide smooth rate of pointers coming out even as a section overhead moves through the frame.

Abstract: The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board. In various embodiments, the connector tools can be made by wire electrode discharge machining (WEDM) process. In the embodiments, the connector tool includes reinforced ribbed end walls, ribbed internal walls, interconnected walls and contours that reduce tool and connector damage. In other embodiments, the connector tools include guiding structures that align the connector tool to the connector before seating the connector so that the connector tool aligns to the connector pins and body to avoid damage to the connector and/or the substrate. In another embodiment, the connector tool has guiding skirts and surfaces to capture the connector in position then seat the connector. Thus, the invention reduces connector and substrate damage during manufacturing, reduces tool damage, and lowers product costs by boosting manufacturing yields.

Abstract: The invention under consideration refers to a controller for a primary-side regulated control power supply unit for the regulation of the output of the primary regulated control power supply unit. The invention also concerns a method for the operation of a control power supply unit of the generic type and a pertinent control power supply unit.

Abstract: An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.

Abstract: Systems and methods for performing pin-pull testing of a printed circuit board (PCB) are presented. The pin-pull testing generally involves the use of a standard tensile tester that is useful for performing other tests aside from pin-pull testing. In this regard, a non-specific pin may be used in conjunction with the tensile tester without the need to purchase or manufacture pins specially adapted for use with a specially designed tensile tester. Additionally, the pin-pull testing may include application of heat to the pin by way of an external heat supply such that the need of a heater integrated into the testing device to heat a pin during the testing may be eliminated. As such, a common heating element (e.g., a standard soldering iron) may be employed by applying heat to a pin directly with the external heat supply.

Abstract: An output module for providing power to a device by using power from a source includes an inlet port, an outlet port, a power conversion circuit configured to receive power from the source through the inlet port and supply converted power to the device through the outlet port, and a control circuit coupled to the power conversion circuit and configured to determine a power requirement of the device and to operate the power conversion circuit to produce converted power having a parameter based upon the power requirement. Preferably, the power requirement is a charging requirement of a battery of the device.

Abstract: Methods and systems for a complete vehicle ecosystem are provided. Specifically, systems that when taken alone, or together, provide an individual or group of individuals with an intuitive and comfortable vehicular environment. The present disclosure includes a system to recognize the drivers and/or passengers within the automobile. Based on the recognition, the vehicle may change a configuration of the automobile to match predetermined preferences for the driver and/or passenger. The configurations may also include the recognition of a unique set of gestures for the person. Further, the configuration can also include the tracking of health data related to the person.

Abstract: A technique for making an RFID tag that includes creating recesses or trenches in an insulated substrate. Conductive traces are created in the trenches so as to create an inductor coil for the RFID tag.

Abstract: An apparatus includes a processing portion and a user interface portion. The user interface portion is slidably coupled to the processing portion along a first axis. The apparatus also includes a stand that is hingedly coupled to the user interface portion. The stand rotates about a second axis orthogonal to the first axis. In some embodiments, the stand includes a U-bar. When the stand is coupled to the processing portion in an open position, the U-bar is able to receive cables therethrough. When the stand is coupled to the processing portion in a closed position, the stand is positioned within a recess, adapted to receive the stand, of the processing portion. In some embodiments, the user interface portion is removable from the processing portion.

Abstract: The present disclosure describes a microprocessor executable network controller operable to at least one of (a) isolate at least one other on board computational component in a vehicular wireless network not affected by a security breach event from a computational component affected by the security breach event and (b) isolate an on board computational component in the vehicular wireless network and affected by the security breach event from the at least one other on board computational component not affected by the security breach event.

Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

Abstract: Systems and methods electrically connect a first electronic device or electrical component, having a external electrical connector, to a circuit board of a second electronic device. A low-cost, user-installable connection system isolates mechanical stresses imposed on the external electrical connector to within the user-installable connection system, thereby preventing the mechanical stresses from reaching the circuit board in the second electronic device. If the connection becomes faulty, only the low-cost, user-installable connection system must be replaced.