Patents Assigned to Foxconn Technology Co., Ltd.
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Patent number: 12684735Abstract: A heat dissipation mechanism comprises a carrier assembly, a heat dissipation assembly, and a buckle assembly, the carrier assembly comprises a base configured for assembling an electronic component with a heat-conductive adhesive sheet attached; the heat dissipation assembly comprises a top plate and a crimping unit, the top plate defines a penetration hole, the crimping unit comprises an extruded sheet, the extruded sheet is located on the side of the heat-conductive adhesive sheet away from the electronic component, the side of the extruded sheet away from the heat-conductive adhesive sheet has a protrusion provided thereon; the buckle assembly comprises a cover plate and a cladding unit, the cladding unit comprises a resist member, the side of the resist member which facing the extruded sheet has a stop portion provided thereon. An electronic device is also provided, which comprising the provided heat dissipation mechanism, an electronic component, and a case.Type: GrantFiled: May 22, 2024Date of Patent: July 14, 2026Assignees: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, Foxconn Technology Co., Ltd.Inventors: Meng Fu, Jin-Rong Xie
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Patent number: 12658510Abstract: A housing structure includes a substrate, a first adhesive layer, and a silica gel layer. The substrate includes a first portion, and the first portion includes polybutylene terephthalate and glass fibers, the glass fibers and the polybutylene terephthalate are in a ratio between 40% and 50% by weight. The first adhesive layer is formed on the first portion. The first adhesive layer includes polysiloxane in a range of 2% to 5% by weight, acrylic resin in a range of 3% to 5% by weight, isopropanol in a range of 20% to 30% by weight, cyclohexane in a range of 20% to 30% by weight, and toluene in a range of 20% to 30% by weight. The silica gel layer is formed on the first adhesive layer, and the first adhesive layer bonds the silica gel layer to the first portion.Type: GrantFiled: March 9, 2023Date of Patent: June 16, 2026Assignees: FUYU PRECISION COMPONENT(KUNSHAN)CO., LTD., Foxconn Technology Co., Ltd.Inventors: Hung-Chun Ma, Fuh-Feng Tang, Ching-Sheng Sun, Hai-Peng Yan
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Patent number: 12631191Abstract: A fan includes a housing, an impeller, and a bearing. The housing includes a bottom plate and a shaft sleeve with an internal space. The impeller includes a wheel hub, a shaft rod, and a thrust plate. The bearing is arranged in the internal space, the shaft rod is rotatably connected to the shaft sleeve through the bearing. The fan is proved with a first axial dynamic pressure oil circuit, a second axial dynamic pressure oil circuit, a radial dynamic pressure oil circuit, a first oil circuit to a fourth oil circuit. The first oil circuit to the fourth oil circuit are successively connected to form a liquid circuit, the impeller can be in a completely suspended state under a combined action of a first axial dynamic pressure, a second axial dynamic pressure, and a radial dynamic pressure. An electronic device is also provided.Type: GrantFiled: January 15, 2025Date of Patent: May 19, 2026Assignees: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, Foxconn Technology Co., Ltd.Inventors: Jing-Shu Chen, Yong-Kang Zhang, Yung-Ping Lin
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Patent number: 12628315Abstract: An elastic member can connect a first component to a second component. The elastic member includes at least one curved portion, at least one inserting portion, at least one connecting portion, and at least one abutting portion. The curved portion can be clamped in a first slot of the first component. The inserting portion can be clamped in a second slot of the second component. The connecting portion connects the curved portion to the inserting portion. The abutting portion connects the inserting portion and can abut against a surface of the second component. The abutting portion can deform toward the connecting portion. The present disclosure further provides a heat dissipating structure and a terminal device.Type: GrantFiled: January 31, 2024Date of Patent: May 12, 2026Assignees: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, Foxconn Technology Co., Ltd.Inventors: Meng Fu, Sheng-Hua Qin
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Patent number: 12352285Abstract: An impeller for heat dissipation fan includes a hub and blades, the blades are arranged around the hub. An inlet side and an outlet side, in an axial direction of the impeller, the inlet side is defined at an end of the impeller, the outlet side is defined at another end of the impeller. Each of the blades comprises a windward surface and a leeward surface opposite to the windward surface, the side of the blade back from the hub is an outer edge, and the side of the blade corresponding to the inlet side is a front edge, a first connection region is connected between the outer edge and the front edge, and the first connection region is arc-shaped where the windward surface connected to the leeward surface.Type: GrantFiled: December 14, 2023Date of Patent: July 8, 2025Assignees: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, Foxconn Technology Co., Ltd.Inventors: Xiao-Guang Ma, Zheng Luo, Yung-Ping Lin, Peng-Fei Mai
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Patent number: 12267036Abstract: A method for controlling fans arranged in different working areas comprises: presetting a plurality of fan operation frequencies, receiving a fan operation request and adjusting a frequency of a pulse width modulation (PWM) controller to a first objective frequency based on the fan operation request, and sending the first objective frequency to the fans arranged in different working areas, to drive a first fan arranged in a first objective working area to run. Each of the plurality of fan operation frequencies corresponds to different working areas, the first objective frequency is one of the plurality of fan operation frequencies, and the first objective working area is one of the plurality of working areas corresponding to the first objective frequency. A system for controlling fans and an electronic device are also disclosed.Type: GrantFiled: August 18, 2023Date of Patent: April 1, 2025Assignees: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, Foxconn Technology Co., Ltd.Inventors: Kuan-Ming Wang, Yung-Ping Lin, Po-Tsun Kuo
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Patent number: 12076771Abstract: A method for manufacturing a metal shell for casing of electronic product comprises stamping, squeezing and milling a sheet metal at a first area and a second area to form hinge side walls. The sheet metal on the periphery is stamped, squeezed, and milled to form side walls. Insert molding is performed at inner surface of the sheet metal to form an internal molded plastic part and a fine machining of the sheet metal is carried out. The metal shell is integrally formed from a single solid sheet, the manufacturing process is simple and economical as CNC processes are reduced.Type: GrantFiled: May 10, 2022Date of Patent: September 3, 2024Assignees: FUYU PRECISION COMPONENT(KUNSHAN)CO., LTD., Foxconn Technology Co., Ltd.Inventors: Ching-Sheng Sun, Fuh-Feng Tang, Ming-Hui Lin, Yong Yang, Ning Zhang, Hung-Chun Ma
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Patent number: 10124405Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold including a male die and a female die; positioning an outer frame in a cavity of the female die, the outer frame including a plurality of latching portions protruding from an inner surface inwardly and a plurality of latching grooves, each latching portion including at least one receiving groove; assembling the male die to the female die; casting pressured molten metal-alloy into the cavity to form an inner structural member embedded in the outer frame, the inner structural member including a plurality of engaging portions respectively embedded in the plurality of receiving grooves, and a plurality of matching portions respectively embedded in the plurality of latching grooves; dissembling the male die from the female die; and removing the outer frame and the inner structural member from the female die.Type: GrantFiled: May 23, 2016Date of Patent: November 13, 2018Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Cai-Hua Wang, Yue-Jian Li, Chen-Shen Lin, Wen-Hsiung Chang, Chun-Jung Chang
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Patent number: 10040120Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold, including a male die and a female die engaging with the male die, the male die defining a pouring gate therein, and the female die defining a cavity therein corresponding to the pouring gate; positioning a metallic outer case in the cavity of the female die as an insert; assembling the male die to the female die to cover the cavity, thereby communicating the pouring gate with the cavity; casting pressured molten metal-alloy into the cavity via the pouring gate to form an inner structural member embedded in an inner side of the outer case; dissembling the male die from the female die to expose the cavity, and removing the outer case and the inner structural member from the female die.Type: GrantFiled: March 29, 2016Date of Patent: August 7, 2018Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Cai-Hua Wang, Yue-Jian Li, Chen-Shen Lin, Wen-Hsiung Chang, Chun-Jung Chang
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Patent number: 9842791Abstract: An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.Type: GrantFiled: August 12, 2016Date of Patent: December 12, 2017Assignees: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.Inventors: Yi-Chang Liu, Jui-Wen Hung, Jian-Zhong Lu
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Patent number: 9748161Abstract: A heat dissipation device includes a base, a fin assembly mounted on a top surface of the base, and a heat absorber arranged at a bottom surface of the base. The bottom surface of the base defines a recess corresponding to the heat absorber. The heat absorber is embedded in the recess. A fixing plate is positioned at the bottom surface of the base to cover the recess and define a sealed/airtight cavity between the fixing plate and the base. A top end of the heat absorber is received in the sealed/airtight cavity. A top end of the heat absorber extends through the fixing plate to expose out of the sealed/airtight cavity. A flexible sheet is totally received in the sealed/airtight cavity to buffer a stress generated by assembling the heat dissipation device with external elements.Type: GrantFiled: April 28, 2015Date of Patent: August 29, 2017Assignee: Foxconn Technology Co., Ltd.Inventor: Wei-Hang Hsu
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Patent number: 9717162Abstract: An electronic device includes an electronic component and a heat dissipating casing configured to dissipate heat from the electronic component. The casing includes top and bottom sides of the heat dissipating casing forming a sealed chamber, and a pore structure formed within the sealed chamber. The sealed chamber is configured to receive a working medium and the pore structure is configured to absorb at least a portion of the working medium, whereby the heat generated from the electronic component is dissipated by a phase change of the working medium.Type: GrantFiled: January 12, 2015Date of Patent: July 25, 2017Assignees: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.Inventors: Jia-Hong Wu, Sheng-Liang Dai
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Patent number: 9689625Abstract: A method for manufacturing a heat pipe includes following steps: providing a tube; providing a rod; inserting the rod in the circular tube, a receiving portion is formed between an inner face of the tube and the upper portion of the rod; providing an amount of metal powder and filling the metal powder into the receiving portion; sintering the metal powder at a high temperature to form a first wick structure adhered on the inner face of the tube and then drawing the rod out of the tube; injecting a working medium into the tube and sealing the tube to form the heat pipe.Type: GrantFiled: December 12, 2013Date of Patent: June 27, 2017Assignees: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.Inventors: Sheng-Liang Dai, Jia-Hong Wu
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Patent number: 9657741Abstract: A magnet case for a rotor includes a hollow cylindrical supporting body for accommodating two magnetic bands, an annular flange extending outwardly from a top end of the supporting body, and a positioning plate extending inwardly from a bottom end of the supporting body. The annular flange of the magnet case has two spaced notches defined in an outer periphery thereof, and the two spaced notches are configured to reduce vibration of a cooling fan associated with the rotor during operation of the cooling fan. A rotor incorporating the magnet case is also provided.Type: GrantFiled: December 10, 2013Date of Patent: May 23, 2017Assignee: Foxconn Technology Co., Ltd.Inventors: Ming-Hsiu Chung, Yu-Ching Lin
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Patent number: 9624935Abstract: An exemplary cooling fan includes a base, a central tube formed at the base, a stator, and a rotor being rotatable relative to the stator. The central tube is made of polyoxymethylene. The central tube includes a bottom plate mounted on the base and a peripheral sidewall extending upwardly from a peripheral edges of the bottom plate. The bottom plate and the sidewall cooperatively define a blind hole therebetween. The stator is mounted around the sidewall of the central tube. The rotor includes a hub and a shaft extending from the hub. The shaft includes a free end received in the blind hole and directly abutting the bottom plate.Type: GrantFiled: December 13, 2012Date of Patent: April 18, 2017Assignees: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.Inventor: Qiao-Yun Sun
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Patent number: 9581324Abstract: An LED illumination includes a heat sink, and an LED module mounted on the heat sink. The heat sink includes a base, a receiving tube extending upwardly from a first face of the base, and a plurality of fins arranged on the first face of the base and surrounding the receiving tube. The plurality of fins extends radially and outwardly beyond an outer periphery of the base in relation to the receiving tube. A band engages and encloses the plurality of fins. A plurality of air tunnels are defined between the base, the band and the plurality of fins. The LED module is mounted on a second face of the base opposite to the first face.Type: GrantFiled: February 5, 2015Date of Patent: February 28, 2017Assignees: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, Foxconn Technology Co., Ltd.Inventors: Ming-Hui Zhai, Wen Xu, Shih-Hsun Wung
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Publication number: 20170038045Abstract: A wall lamp includes a lamp body, a connector, a power box, a light emitting unit and a driving device. The light emitting unit is fixed on a bottom of the lamp body. The driving device is received in the power box and supplies power for the light emitting unit. The connector includes a first connecting part and a second connecting part. The first connecting part is fixed on a top of the lamp body. The second connecting part is fixed on a top of the power box. The first connecting part is rotationally connected to the second connecting part, thereof adjusting illumination angle of the light emitting unit and making the wall lamp in a closed state or unfolded state.Type: ApplicationFiled: September 22, 2015Publication date: February 9, 2017Applicants: FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATIONInventors: ZHONG-HE LIANG, QIAN XIANG
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Patent number: 9546667Abstract: An exemplary fan includes a hub and an impeller. The hub is made of metal, and includes a flange. The impeller is made of plastic. The impeller is formed around the hub and has the flange embedded therein. A method for manufacturing the fan is also provided.Type: GrantFiled: December 17, 2012Date of Patent: January 17, 2017Assignee: Foxconn Technology Co., Ltd.Inventor: Wen-Cheng Chen
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Patent number: 9537523Abstract: A cover configured to be attached to, and cover a portion of, a handheld electronic device. The cover includes a shell having a first side and a second side and a wireless charging receiver module connectable to the handheld electronic device. When attached to the handheld electronic device the first side of the shell faces the handheld electronic device. The wireless charging receiver module is positioned on the first side of the shell.Type: GrantFiled: October 28, 2014Date of Patent: January 3, 2017Assignees: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, Foxconn Technology Co., Ltd.Inventors: Hai-Lin Chen, Di-Qiong Zhao, Ching-Hsing Huang, Chih-Feng Hu, Yung-Ping Lin
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Patent number: D1036381Type: GrantFiled: March 30, 2023Date of Patent: July 23, 2024Assignees: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, Foxconn Technology Co., Ltd.Inventors: Yu-Ching Lin, Yung-Ping Lin, You-Zhi Lu, Xiao-Guang Ma, Li-Ping Wang, Jing-Shu Chen