Patents Assigned to Foxconn Technology Co., Ltd.
  • Publication number: 20140347849
    Abstract: A light-emitting diode lamp comprises a frame defining a pair of slots therein, a light bar fixed on the frame at one side thereof by pushing the light bar into the slots, a driving module mounted on the frame at the other side thereof, and a lamp cover fixed on the frame and covering the light bar. The light bar is inserted into the slots of the frame to be mounted in the light-emitting diode lamp. The driving module electrically connects with the light bar. The slots are defined in two walls of the frame wherein the two walls extend away from each other along a radiating direction of the light bar.
    Type: Application
    Filed: March 14, 2014
    Publication date: November 27, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: WEN XU, MIN-CHI ZENG
  • Publication number: 20140340907
    Abstract: An LED lamp includes a housing and multiple LED units received in the housing. Each LED unit includes a heat sink, multiple LEDs mounted below the heat sink and a cover overlaying the heat sink. The heat sink includes a base and multiple fins extending upwardly from the base. The cover includes a supporting plate defining multiple openings corresponding to the fins, and multiple shading tabs connected to the supporting plate. Each shading tab covers one opening and forms an airflow passage communicating the opening with an outside environment atmosphere.
    Type: Application
    Filed: August 21, 2013
    Publication date: November 20, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: GUANG YU, QIAN XIANG
  • Patent number: 8885346
    Abstract: An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: November 11, 2014
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Shih-Yao Li, Jui-Wen Hung, Ching-Bai Hwang
  • Publication number: 20140313668
    Abstract: An exemplary protective device is for protecting an electronic component mounted on a printed circuit board. The protective device includes a protective board covering the electronic component, and a hard carbon film coated on an outer periphery of the protective board. The protective board is made of anti-EMI materials.
    Type: Application
    Filed: April 29, 2013
    Publication date: October 23, 2014
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: WEI-HANG HSU, JUI-WEN HUNG
  • Patent number: 8854817
    Abstract: An exemplary electronic device includes an electronic component, a heat dissipation device, a fixing member and a casing contained the electronic component, the heat dissipation device and the fixing member therein. The heat dissipation device thermally contacts the electronic component. The fixing member includes a main body and an engaging portion extending from the main body. The engaging portion fixes the heat dissipation device to the fixing member. Fasteners extend through the casing and engage the main body of the fixing member to secure the fixing member on the casing.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: October 7, 2014
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Shih-Yao Li, Jui-Wen Hung, Wei-Jen Huang
  • Patent number: 8845315
    Abstract: An exemplary injection molding apparatus includes a first mold defining a passage therein, a second mold engaging with the first mold, working fluid received in the passage of the first mold, and a thermal conductive member engaged in the first mold and thermally interconnecting the first mold and the working fluid. The first mold and the second mold cooperatively define a molding chamber therebetween adapted to receive injected molten material therein. The thermal conductive member transfers heat from the first and second molds to the working fluid when the first and second molds are hotter than the working fluid, and transfers heat from the working fluid to the first and second molds when the working fluid is hotter than the first and second molds.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: September 30, 2014
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Nien-Tien Cheng, Ming-Hsiu Chung
  • Publication number: 20140261896
    Abstract: A method for conversion treating a surface of a magnesium alloy workpiece includes the following steps: providing a magnesium alloy workpiece, degreasing the magnesium alloy workpiece, acid pickling the magnesium alloy workpiece in a first acid pickling treatment step, surface conditioning the magnesium alloy workpiece in a first surface conditioning treatment step, acid pickling the magnesium alloy workpiece in a second acid pickling treatment step, surface conditioning the magnesium alloy workpiece in a second surface conditioning treatment step, pre-phosphating the magnesium alloy workpiece in a pre-phosphating treatment step, and phosphating the magnesium alloy workpiece in a phosphating treatment step to form a phosphating film on the surface of the magnesium alloy workpiece.
    Type: Application
    Filed: March 10, 2014
    Publication date: September 18, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: HAO-WEI CHEN, WU-BIN LI, YONG-HUI GAO, KUN QIAN
  • Patent number: 8804336
    Abstract: A heat dissipating apparatus includes a centrifugal fan, a heat sink and a heat pipe. The centrifugal fan includes a frame and an air outlet defined on the frame. The heat sink is arranged adjacent to the air outlet of the centrifugal fan. The heat pipe includes an evaporation section and a condensation section extending from the evaporation section. The condensation section is connected to the heat sink. The evaporation section is for absorbing heat from a first and second heat generating component. The frame includes an elastic plate abutting to the evaporation section of the heat pipe and applying a force to the evaporation section of the heat pipe. An electronic device equipped with the heat dissipating apparatus is also provided.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: August 12, 2014
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Chih-Peng Lee
  • Patent number: 8800639
    Abstract: An exemplary heat dissipation apparatus includes a number of fins and a heat pipe. Each fin defines a through hole therein. A collar extends from each fin at an edge of the through hole. The collar inclines toward a center of the through hole. An inner diameter of the collar gradually decreases along a direction away form the fin. A diameter of the heat pipe is larger than a minimum inner diameter of the collar when the collar in a natural state. When the heat pipe extends through the through hole of the fin, the collar is pushed by the heat pipe to expand outwardly, so that the heat pipe intimately contacts an inner face of the collar.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: August 12, 2014
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Xing-Hua He
  • Patent number: 8801222
    Abstract: An exemplary LED lamp includes a heat sink, and an LED module mounted on the heat sink. The heat sink includes a base, a receiving tube extending upwardly from a first face of the base, and a plurality of fins extending outwardly from an outer circumference of the receiving tube. The LED module is mounted a second face of the base. A plurality of through tunnels are defined in the base. The through tunnels extend through the base from the first face to the second face of the base. Each through tunnel communicates with an air passage between two neighboring fins.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: August 12, 2014
    Assignees: Champ Tech Optical (Foshan) Corporation, Foxconn Technology Co., Ltd.
    Inventors: Shih-Hsun Wung, Wen Xu, Peng Huang
  • Publication number: 20140169966
    Abstract: A magnet case for a rotor includes a hollow cylindrical supporting body for accommodating two magnetic bands, an annular flange extending outwardly from a top end of the supporting body, and a positioning plate extending inwardly from a bottom end of the supporting body. The annular flange of the magnet case has two spaced notches defined in an outer periphery thereof, and the two spaced notches are configured to reduce vibration of a cooling fan associated with the rotor during operation of the cooling fan. A rotor incorporating the magnet case is also provided.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 19, 2014
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: MING-HSIU CHUNG, YU-CHING LIN
  • Publication number: 20140166244
    Abstract: An exemplary flat heat pipe includes a hollow tube and a wick structure lining an inner surface of the tube. The tube includes an evaporator section, an adiabatic section and a condenser section defined in turn along a longitudinal direction thereof. The wick structure includes a first wick portion located in the evaporator section, a second wick portion located in the condenser section, and a third wick portion extending longitudinally from the evaporator section, through the adiabatic section to the condenser section and communicating with the first wick portion and the second wick portion. A capillary force of the first wick portion is larger than that of the third wick portion, and a pore density of the first wick portion is less than that of the third wick portion.
    Type: Application
    Filed: March 25, 2013
    Publication date: June 19, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: SHENG-LIANG DAI, JIA-HONG WU
  • Publication number: 20140166246
    Abstract: A method for manufacturing a heat pipe includes following steps: providing a tube; providing a rod; inserting the rod in the circular tube, a receiving portion is formed between an inner face of the tube and the upper portion of the rod; providing an amount of metal powder and filling the metal powder into the receiving portion; sintering the metal powder at a high temperature to form a first wick structure adhered on the inner face of the tube and then drawing the rod out of the tube; injecting a working medium into the tube and sealing the tube to form the heat pipe.
    Type: Application
    Filed: December 12, 2013
    Publication date: June 19, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: SHENG-LIANG DAI, JIA-HONG WU
  • Publication number: 20140166245
    Abstract: A flat heat spreader includes a hollow casing defining a vapor chamber therein, a working liquid contained in the vapor chamber, a first wick structure formed on an inner face of the casing, and a second wick structure formed on the inner face of the casing. The inner face of the casing includes a bottom face and a top face opposite to the bottom face. A porosity of the first wick structure is less than that of the second wick structure. A method for manufacturing the flat heat spreader is also provided.
    Type: Application
    Filed: April 17, 2013
    Publication date: June 19, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: SHENG-LIANG DAI, JIA-HONG WU
  • Publication number: 20140168995
    Abstract: A light emitting diode (LED) lamp includes a base, LED chips mounted on base, and a lens covering the LED chips and engaging with the base. The lens includes an arc-shaped engaging portion, and an extending portion extending from a radial outer side of a top surface of the engaging portion with a radial inner side of the top surface of the engaging portion exposed. The engaging portion includes an outer side surface. A groove is defined in an underside of the engaging portion and receives the LED chips therein. The extending portion includes an inner light emitting surface extending upwardly and outwardly from the top surface of the engaging portion, an outer light emitting surface extending upwardly from a top edge of the outer side surface of the engaging portion, and a top light emitting surface interconnecting the outer light emitting surface and the inner light emitting surface.
    Type: Application
    Filed: May 17, 2013
    Publication date: June 19, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: CHIN-CHUNG CHEN, SHAN-YUE WANG, RUN-TIAN LIU
  • Publication number: 20140161653
    Abstract: A cooling fan includes a stator, a base supporting the stator, and a rotor positioned to rotate with respect to the stator. The base includes a bearing housing and a central hole defined in the bearing housing. The rotor includes a hub and a shaft extending from the hub. An end of the shaft is fixed in the hub, and another end of the shaft is extending in the central hole defined in the bearing housing. The bearing housing includes a main cylindrical portion and a protruding portion bent radially inward from a top end of the main portion, and the protruding portion thus serves as a lubricant retaining portion of the bearing housing.
    Type: Application
    Filed: April 21, 2013
    Publication date: June 12, 2014
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: MING-HSIU CHUNG, YU-KAI TAI, WEN-CHENG CHEN
  • Publication number: 20140158323
    Abstract: An exemplary heat sink assembly includes a heat sink, a connecting member, and a mounting member. A mounting hole and a receiving hole are defined in the heat sink and communicating with each other. The connecting member is adapted for fixing the heat sink. The connecting member includes a connecting section and an extending section extending from the connecting section. The mounting member fixes the connecting member to the heat sink. The connecting section is received in the receiving hole of the heat sink, the extending section is protruding from the heat sink, and the mounting member extends through the mounting hole and engaging with the connecting section to fix the connecting member to the heat sink.
    Type: Application
    Filed: December 27, 2012
    Publication date: June 12, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: ZHEN TANG, JIN-HUAI ZHOU
  • Patent number: 8747719
    Abstract: A method for manufacturing an insert-molded cover for electronic devices, including manufacturing a metallic body, processing the metallic body by a chemical method and forming an oxide film on a surface of the metallic body, and molding a plastic antenna lid on the metallic body by insert molding so that the plastic antenna lid is attached on the oxide film.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: June 10, 2014
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Han-Ming Lee, Chih-Chien Hung, Hsiang-Sheng Chou, Ching-Hsien Chang
  • Patent number: 8747532
    Abstract: A filter device for filtering dust from air includes a housing, a dust collecting module, a spraying module, and an exhaust. The housing defines an air inlet near a bottom of the housing and an air outlet near a top of the housing. The dust collecting module is installed in the housing between the air inlet and the air outlet. The spraying module is placed in the housing between the dust collecting module and the air outlet. The exhaust is connected to the housing for generating air pressure difference between near the air outlet and near the air inlet, thereby drawing and introducing air containing dust from the bottom of the housing toward the top of the housing via the air inlet.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: June 10, 2014
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chun-Jung Chang, Wen-Hsiung Chang, Ping-Neng Chang, Run-Cheng Lin
  • Publication number: 20140150995
    Abstract: An exemplary heat pipe includes a hollow tube, a wick structure configured on an inner surface of the tube and a working medium formed in the tube. Two ends of the tube are sealed and the tube defining a chamber therein. The tube comprises an evaporating section and a condensing section, and the evaporating section is isolated from the condensing section. The wick structure extends from the evaporating section to the condensing section along the inner surface of the tube to form a working medium channel. A pair of through holes is defined in each of the evaporating section and the condensing section of the tube. A pair of metal pipes communicate the through holes of the evaporating section with those of the condensing section to form a pair of vapor channels. A method for manufacturing the heat pipe is also provided.
    Type: Application
    Filed: December 28, 2012
    Publication date: June 5, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: SHENG-LIANG DAI, JIA-HONG WU