Abstract: The present invention provides a means capable of polishing an object to be polished at a high polishing removal rate and further improving a surface quality of a surface of the object to be polished. The present invention is a polishing composition used for polishing an object to be polished, containing an alumina abrasive and a dispersion medium, in which the alumina abrasive contain only an ?-alumina A having an ? conversion rate of 80% or more and an ?-alumina B having an ? conversion rate of less than 80% as crystalline alumina, and an average particle size of the ?-alumina A is smaller than an average particle size of the ?-alumina B.
Abstract: The present invention provides a method for producing a polishing composition which can polish an object to be polished at a high polishing speed and with fewer scratches (defects). The present invention is a method for producing a polishing composition, the method including: preparing silica in which an intensity of a peak of a silica four-membered ring structure and an intensity of a peak derived from a silica random network structure when analyzed by Raman spectroscopy satisfy a predetermined requirement; and mixing the silica with a dispersing medium.
Abstract: The present invention provides a composition for surface treatment that sufficiently removes the defect present on the surface of a polished object to be polished. The composition for surface treatment that includes a silicone-based compound having an HLB of more than 7 and water and is used to treat a polished object to be polished.
Abstract: To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.
Abstract: A surface treatment composition according to the present invention is a surface treatment composition having a pH of lower than 7 and used for treating the surface of a polished object to be polished having a layer containing tungsten, and the surface treatment composition contains a tungsten etching inhibitor and water, wherein the tungsten etching inhibitor is a compound containing a monocyclic or fused polycyclic aromatic hydrocarbon ring having two or more substituents, and the substituents contain at least a nitrogen-containing group and an anionic group.
Abstract: The present invention provides a solution for preventing the settling of an abrasive while maintaining the polishing performance. In addition, the present invention provides a solution for improving the redispersibility of an abrasive while maintaining the polishing performance. The present invention relates to a polishing composition for use in polishing a semiconductor substrate, the polishing composition containing an abrasive, a layered compound, and a dispersion medium.
Abstract: Provided herein are methods and compositions for chemical mechanical polishing (CMP) of metals. The present methods and compositions involve the use of a corrosion inhibitor having the general formula CmH2m+1—(OCH2CH2)n-L-R in the CMP slurry composition, where m is an integer between 6 and 11, inclusive of end points, and n is an integer greater than or equal to 6, L is a bond, —O—, —S—, —R1—, —S—R1—, or —O—R1—, where R1 is a C1-4 alkylene; and R is an anionic group. The present methods and compositions can be used to achieve a high metal removal rate, while effectively inhibiting metal corrosion during CMP, and are particularly useful for CMP of cobalt (Co).
Abstract: A surface treatment composition according to the present invention is used for treating a surface of a polished object to be polished which is obtained after polishing with a polishing composition including ceria, using the surface treatment composition including a (co)polymer having a monomer-derived structural unit having a carboxyl group or a salt group thereof, a residue removing accelerator composed of a specific compound having a hydroxyl group, and a dispersing medium, wherein pH is less than 7.
Abstract: The titanium phosphate powder of the present invention includes plate-shaped crystalline particles of titanium phosphate, an average thickness of the plate-shaped crystalline particles is 0.01 ?m or more and less than 0.10 ?m, and an aspect ratio, which is a value obtained by dividing an average primary particle diameter of the plate-shaped crystalline particles by the average thickness, is 5 or more. In the method for producing a titanium phosphate powder of the present invention, a raw material containing titanium and phosphorus is caused to react by a hydrothermal synthesis method, and when the titanium phosphate powder including plate-shaped crystalline particles of titanium phosphate is produced, a mixture of titanium sulfate and phosphoric acid is used as the raw material.
Abstract: Provided is a method for producing a silica sol. A gel-like material cannot be generated and highly associated silica particles can be obtained. A method for producing a silica sol, comprising a step of making a reaction liquid by mixing liquid (A) comprising an alkaline catalyst, water, a first organic solvent and silica particles for association with liquid (B) comprising at least one of tetramethoxysilane and a condensate thereof and a second organic solvent, wherein during the mixing, an addition rate of the liquid (B) is 8.5×10?4 to 5.6×10?3 mol/min in terms of silicon atoms with respect to 1 mol of the water contained in the liquid (A).
Abstract: Polishing compositions are disclosed which contribute to improvement of level difference performance (in particular, erosion). The polishing composition used for polishing an object to be polished includes abrasive grains and a dispersing medium, wherein the abrasive grains have an average primary particle size of 40 nm or less, and the number of coarse particles having a particle size of 0.2 to 1,600 ?m in the abrasive grains is 20,000 or less per 1 cm3 of the polishing composition.
Abstract: Provided is thermal spray slurry capable of forming a dense coating by thermal spraying while suppressing cracks. Thermal spray slurry includes: thermal spray particles having an average particle diameter of 1 ?m or more and 10 ?m or less and a dispersion medium in which the thermal spray particles are dispersed, and has a filling rate of 84 mass % or less, the filling rate being calculated by the following expression, filling rate (mass %)=B/A×100, where A denotes the mass of cake of the thermal spray particles obtained by precipitating the thermal spray particles out of the thermal spray slurry by centrifugation, and B denotes the mass of a dry matter obtained by removing the dispersion medium from the cake.
Abstract: Provided are a sliding instrument having a low frictional resistance to the snow surface, the ice surface, or the water surface and having excellent sliding performance and a method for manufacturing the sliding instrument. A sliding instrument to slide on snow, ice, or water includes a sliding surface (1) to come into contact with the snow surface, the ice surface, or the water surface, and the sliding surface (1) has a surface roughness Ra of 1.0 ?m or less. A method for manufacturing the sliding instrument includes polishing a sliding surface (1) using a polishing composition slurry containing abrasives to make the sliding surface (1) have a surface roughness Ra of 1.0 ?m or less.
Abstract: A method for manufacturing a silica sol according to an embodiment of the present invention includes: a step of preparing a silica sol reaction liquid by hydrolyzing and polycondensing an alkoxysilane or a condensate thereof using an alkali catalyst in a solvent; and at least one of a step of concentrating the silica sol reaction liquid by an ultrasonic atomization separation method and a step of replacing the silica sol reaction liquid with water by the ultrasonic atomization separation method.
March 13, 2020
October 1, 2020
Masaaki ITO, Jun SHINODA, Keiji ASHITAKA
Abstract: An object of the present invention is to provide a new polishing composition that contributes to improving the quality of a device. There is provided a polishing composition containing: an abrasive grain having an organic acid immobilized on a surface thereof; a first water-soluble polymer having a sulfonic acid group or a group having a salt thereof, or a carboxyl group or a group having a salt thereof; a second water-soluble polymer different from the first water-soluble polymer; a nonionic surfactant; and an aqueous carrier, wherein the polishing composition is used for polishing an object to be polished.
Abstract: The object of the present invention is to provide a novel polishing composition capable of polishing two or more kinds of objects to be polished at a similar speed and at a high speed. A polishing composition used for polishing an object to be polished, the polishing composition including: abrasive grains; an organic compound; and a liquid carrier, in which the number of silanol groups per unit surface area of the abrasive grains is more than 0/nm2 and equal to or less than 2.5/nm2, and the organic compound has a phosphonic acid group or a salt group thereof.
Abstract: Provided is a polishing composition which can sufficiently remove defects remaining on the surface of a polished object and which can make the polishing speeds of the respective materials substantially equal to each other when polishing the object to be polished containing a plurality of materials. A polishing composition used for polishing an object to be polished containing a material having a silicon-silicon bond, a material having a silicon-nitrogen bond, and a material having a silicon-oxygen bond, the polishing composition including: organic acid surface-immobilized silica particles; a wetting agent; and a polishing speed inhibitor for the material having a silicon-silicon bond, wherein the polishing composition has a pH of less than 7.
Abstract: A polishing composition according to the present invention contains: silica particles; a polishing speed adjusting agent for an object to be polished containing a silicon material having silicon-silicon bonding; and a biocide. The biocide includes a carbon atom, a hydrogen atom, and an oxygen atom.
Abstract: The composition for surface treatment according to the present invention includes a carboxylic acid compound having two or more nitrogen atoms, an ionic dispersing agent, and water, has a pH of less than 6, and is used for treating a surface of a polished object having a tungsten-containing layer.