Abstract: A surface acoustic wave device includes a base portion that surrounds a surface acoustic wave element and is made of a resin, and a cap portion that is adhered onto the base portion so that a cavity sealing the surface acoustic wave element is formed, and is made of a resin. At least one of an adhering face of the base portion and an adhering face of the cap portion adhering the base portion and the cap portion is subjected to a grain finish or a dull finish. A convex portion is provided inside of the adhering face that is of one of the base portion and the cap portion adhered to the other.

Abstract: A ladder filter includes a series resonator having a first film laminate in which an upper electrode and a lower electrode face each other across a piezoelectric film, and a first film provided on the first film laminate, and a parallel resonator having a second film laminate having a structure similar to that of the first film laminate, a second film provided on the second film laminate, and another first film identical to the first film.

Abstract: A surface acoustic wave device includes a surface acoustic wave (SAW) chip, a base that is made of resin and surround the SAW chip, and a cap that is made of resin and is bonded, by a seal member, to the base so as to define a cavity in which the SAW chip is sealed with the cap and the base, the cavity communicating with an outside of the surface acoustic wave device through a through hole formed in the seal member.

Abstract: An oscillator includes a first oscillating portion that outputs a first oscillation signal having a first oscillation frequency through a first intermediate node to an output terminal, a mounting portion that includes an insulating layer and that mounts the first oscillating portion, a first line provided in the insulating layer and coupled between the first intermediate node and ground, a second line provided in the insulating layer and coupled between the first intermediate node and a power supply terminal, and a third line provided in the insulating layer and coupled between the first intermediate node and the output terminal.

Abstract: An acoustic wave device includes a piezoelectric substrate, a resonator having comb electrodes that are provided above the piezoelectric substrate and excite an acoustic wave, and a capacitor that is provided above the piezoelectric substrate and is connected in series or parallel with the resonator, the capacitor including electrodes that horizontally face each other above the piezoelectric substrate. The electrodes of the capacitor are further from the piezoelectric substrate than the comb electrodes of the resonator.

Abstract: A duplexer includes two surface acoustic wave (SAW) filters having different center frequencies; a phase matching circuit that matches phases of the two SAW filters; a package in which the SAW filters and the phase matching circuit are housed, the package being composed of multiple layers; and a line pattern provided between at least one of the SAW filters and at least one of a transmit terminal and a receive terminal of the duplexer. The line pattern runs on at least two of the multiple layers within a range defined by peripheral ground patterns provided in the package.

Abstract: There is provided a resonant circuit includes a resonator, an inductor connected in parallel with the resonator, and a capacitor connected in parallel with the resonator. There are also provided a filter and an antenna duplexer having the above-described resonant circuit.

Abstract: An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip.

Abstract: An acoustic wave device includes: a piezoelectric substrate on which an acoustic wave element and an electrode pad connected to the acoustic wave element are formed; a first resin part having a first opening located above a function area in which an acoustic wave is excited by the acoustic wave element and a second opening located above the electrode pad; a second resin part that covers the first opening and has a third opening located above the second opening; and a metal layer formed on the electrode pad in the second opening, the first opening and the second opening being inversely tapered.

Abstract: An acoustic wave device includes: a piezoelectric substrate; at least five IDTs (InterDigital Transducers) arranged on the substrate in directions of SAW (Surface Acoustic Wave) propagation; and two balanced terminals connected to two first IDTs that are two out of the at least five IDTs and are 180 degrees out of phase. One of a pair of comb electrodes of one of the two first IDTs is connected to one of the two balanced terminals, and one of a pair of comb electrodes of the other one of the two first IDTs being connected to the other one of the two balanced terminals. The other comb electrodes of the two first IDTs are connected in series, and one of a pair of comb electrodes that form an IDT that is included in the at least five IDTs and is not connected to the two first IDTs is grounded.

Abstract: A surface acoustic wave device includes a piezoelectric substrate; comb electrodes provided on a first surface of the piezoelectric substrate; and an insulating film provided on at least one of the first surface of the piezoelectric substrate and a second surface thereof opposite to the first surface, the insulating film having a thickness greater than that of the piezoelectric substrate and having a linear expansion coefficient smaller than that of the piezoelectric substrate in a direction of propagation of a surface acoustic wave.

Abstract: An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.

Abstract: An acoustic wave device includes a piezoelectric substrate, a first dielectric film formed on the piezoelectric substrate, and electrodes that are provided on the first dielectric film and excite an acoustic wave, the electrodes including electrode fingers. At least a part of the first dielectric film is cut out between adjacent electrode fingers among the electrode fingers.

Abstract: A duplexer includes a substrate including an insulation layer, an upper interconnection layer provided on an upper surface of the insulation layer, a lower interconnection layer provided on a lower surface of the insulation layer, and an inner interconnection layer provided in the insulation layer, the inner interconnection layer including an inner ground pad, at least one acoustic wave filter chip mounted on an upper surface of the substrate, signal pads provided on the upper interconnection layer and connected to signal electrodes of the at least one acoustic wave filter chip, and an upper ground pad that is provided in the upper interconnection layer so as to be located between the signal pads and is connected to a ground electrode of the at least one acoustic wave filter, wherein D1>D2 and D1>T1 where D1 is a minimum distance between the signal pads and the upper ground pad, D2 is a minimum distance between the signal pads and the inner ground pad, and T1 is a thickness of the insulation layer betwe

Abstract: A surface acoustic wave device includes a piezoelectric substrate, a surface acoustic wave element composed of electrodes provided on the piezoelectric substrate and the piezoelectric substrate, a first seal resin portion provided on the piezoelectric substrate and having a cavity on the surface acoustic wave element, and an inorganic insulation film provided in contact with a surface of the piezoelectric substrate to surround the surface acoustic wave element.

Abstract: A duplexer includes: a first filter that is connected to a common terminal and a first terminal, and includes a first series-arm resonator; a second filter that is connected to the common terminal and a second terminal; a first inductor that is connected in parallel to the first series-arm resonator; a mounting unit that has the first filter and the second filter mounted thereon; a first inductor line that is provided on the mounting unit, and connects the first inductor and the first series-arm resonator; and a first terminal line that is provided on the mounting unit, and connects the first filter and the first terminal. In this duplexer, the directions of currents flowing through the first inductor line and the first terminal line cross each other.

Abstract: A filter includes: a first acoustic wave filter having acoustic wave filters cascaded, an input stage of the acoustic wave filters including a first multimode filter; a second acoustic wave filter having acoustic wave filters cascaded, an input stage of these acoustic wave filters including a second multimode filter having an aperture length different from that of the first multimode filter, the second acoustic wave filter receiving an unbalanced in signal applied to the first acoustic wave filter, and having a pass band that does not overlap with that of the first acoustic wave filter.

Abstract: There is provided a method for manufacturing an electronic device including: printing a conductive pattern on a first surface of a first green sheet having a multilayer structure, the conductive pattern being electrically connected to an internal interconnection formed in the first green sheet; superposing a second green sheet on the first surface of the first green sheet, the second green sheet having an opening located in an area corresponding to the conductive pattern; pressurizing the first green sheet and the second green sheet superposed thereon in directions in which the second green sheet is superposed on the first green sheet; burning the first green sheet and the second green sheet superimposed thereon to thus form a multilayer ceramic substrate; and mounting an electronic element on a second surface of the multilayer ceramic substrate opposite to the first surface, the electronic element being electrically connected to the internal interconnection.

Abstract: A balance filter includes two acoustic wave filters connected between a single unbalanced terminal and two balanced terminals, and a ground terminal connected to the two acoustic wave filters via a first interconnection portion and a second interconnection portion. The first interconnection portion is connected to the two acoustic wave filters, and the second interconnection portion is connected to the first interconnection portion in a region that is located between the two acoustic wave filters and extends in a direction orthogonal to a direction in which the two acoustic wave filters are aligned.

Abstract: An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.