Abstract: An acoustic wave filter includes: a first acoustic wave filter having a first group of multimode filters connected, a first unbalanced input node and two first balanced output nodes, a first multimode filter among the first group of multimode filters being connected to the two first balanced output nodes; and a second acoustic wave filter having a second group of multimode filters, a second unbalanced input node and two second balanced output nodes, a second multimode filter among the second group of multimode filters having an aperture length different from that of the first multimode filter and a connection with the two second balanced output nodes, the first and second multimode filters having different pass bands. One of the two first balanced output nodes and one of the two second balanced output nodes are unified, and the other first balanced output node and the other second balanced output node are unified.

Abstract: A filter includes multiple piezoelectric thin-film resonators each having a substrate, a lower electrode formed on the substrate, a piezoelectric film formed on the lower electrode, and an upper electrode provided on the piezoelectric film so that the upper electrode and the lower electrode face each other across the piezoelectric film. The multiple piezoelectric thin-film resonators include a first resonator in which at least a part of an outer curved portion of the piezoelectric film of the first resonator is located further out than an outer curved portion of a region in which the upper electrode and the lower electrode face each other across the piezoelectric film.

Abstract: A method is provided for making packaged micro-devices each including a micro movable element, a first packaging member formed with a recess, and a second packaging member formed with another recess. The micro movable element has a movable part. In accordance with the method, a device wafer is prepared for forming a plurality of micromovable elements. A first packaging wafer, formed with a plurality of recesses corresponding in position to the movable parts of the respective movable elements, is bonded to one surface of the device wafer. A second packaging wafer, formed with a plurality of recesses, is bonded to the other surface of the device wafer. The resulting laminate assembly is cut into separate products.

Abstract: An acoustic wave device includes an acoustic wave element formed on a piezoelectric substrate, and a terminal that makes an electric connection with an outside of the acoustic wave device. The terminal has a protrusion electrode having a side surface coated with a coating film having a non-coating portion.

Abstract: The present invention is an oscillator including: first transistors outputting oscillation signals of different oscillation frequencies to collectors; a common node to which outputs of emitters of the first transistors are connected and input; a feedback circuit feeding an output of the common node to bases of the first transistors; and isolation circuits that are respectively provided between the emitters of the first transistors and the common node and cut off high frequency components from the common node.

Abstract: The present invention is an oscillator including: a first resonance circuit including a first variable capacitance diode having a cathode connected to a control terminal, a first capacitor and a first inductor connected between an anode of the first variable capacitance diode and ground; a second resonance circuit including a second variable capacitance diode having a cathode connected to the control terminal, a second capacitor and a second inductor connected between an anode of the second variable capacitance diode and ground; and an oscillation circuit coupled to the first and second resonance circuits and outputting an oscillation output.

Abstract: A surface acoustic wave device includes a package having a cavity, a SAW chip housed in the cavity, a resin sealing the cavity, and a metal thin film provided on the resin.

Abstract: An electronic component module, including: a circuit board having: an insulating layer; a plurality of conductive layers formed on respective surfaces of the insulating layer; a ground plane comprising one of the conductive layers and covering the greater part of the surface; and wiring formed on another of the surfaces and comprising the conductive layer; and an electronic component mounted on the circuit board and connected by the wiring, wherein a plurality of slits, formed by removing the conductive layer, are provided in the ground plane.

Abstract: A surface acoustic wave apparatus has a configuration by which the spurious of the higher-order transverse modes is suppressed and a SAW excitation intensity distribution is not changed in the propagation direction. The surface acoustic wave apparatus has at least one interdigital transducer, which is disposed such that a plurality of comb-shape electrodes respectively connected to common electrodes are interleaved, wherein a region with the plurality of interleaved comb-shape electrodes has a first overlapping region with a overlapping length constant over a whole area along a propagation direction of a surface acoustic wave and a second overlapping region formed on at least one side of the first overlapping region with a overlapping length weighted in the propagation direction of the surface acoustic wave, and wherein an overlapping-length weighting envelope curve in the second overlapping region has at least two changing points in the propagation direction of the surface acoustic wave.

Abstract: A surface acoustic wave device is enable to prevent electrode erosion, without any specific environmental process. The surface acoustic wave device includes a piezoelectric substrate, an electrode for the formation of surface acoustic wave, being formed on the piezoelectric substrate, on the piezoelectric substrate, a frame-shaped layer surrounding the electrode for the formation of surface acoustic wave, and a lid body formed on the frame-shaped layer by bonding, so as to form a hollow portion between the lid body and the electrode for the formation of surface acoustic wave. The frame-shaped layer and the lid body include photosensitive resin, and the lid body includes a through hole, and the through hole is sealed with a halogen-free thermosetting resin.

Abstract: A micro-switching device includes a base substrate and a cantilever fixed to the base substrate via a spacer or anchor portion. The cantilever has an inner surface facing the substrate and an outer surface opposite to the inner surface. A conductive strip is formed on the outer surface of the cantilever. The switching device also includes a pair of stationary electrodes fixed to the base substrate. Each of the electrodes includes a downward contacting part spaced from the conductive strip on the cantilever. As the cantilever bends upward, the conductive strip is brought into contact with the contacting parts of the respective stationary electrodes.

Abstract: A surface acoustic wave device having a surface acoustic wave filter having a comb-shaped electrode pattern formed on a piezoelectric element, electrode terminals for inputting and outputting of the surface acoustic wave filter are connected with corresponding electrode patterns of a package through bumps, wherein the comb-shaped electrode pattern has a pair of reflective electrodes, and an input comb-shaped electrode and an output comb-shaped electrode disposed between the pair of reflective electrodes; and an electrode terminal of either the input comb-shaped electrode or an output comb-shaped electrode is disposed such that the electrode terminal is positioned on the side opposite to the side of the other electrode terminal sandwiching a grounded electrode using a routing pattern.

Abstract: An electronic device includes a substrate, two ellipse spiral coils that are provided on the substrate, are spaced from each other in a longitudinal direction thereof, and are electrically connected to each other, two wires that are electrically connected to outermost circumference of the two coils respectively and extract the two coils to outside, and a connection portion that electrically connects each end of innermost circumference of the two coils. A ratio of inner diameter against outer diameter of the two coils in a long axis direction and in a short axis direction thereof is respectively 0.5 to 0.8.

Abstract: An electronic device includes a substrate, a first coil that has a spiral shape and is provided on the substrate, a second coil that has a spiral shape, is provided above the first coil, and is spaced from the first coil, a first connection portion that electrically couples the first coil and the second coil, a wire that is provided on the substrate and connects one of the first coil and the second coil to outside, and a second connection portion that is mechanically connected to an outer side face of outermost circumference of the second coil and is mechanically connected on the substrate where one of the wire and the first coil is not provided.

Abstract: A solid electrolytic capacitor element includes an anode foil, a solid electrolytic layer, a cathode foil, and a connection portion. The anode foil is composed of valve metal and has at least one through hole passing therethrough in thickness direction thereof. The solid electrolytic layer is made of conductive polymer and is provided on a surface of the anode foil. The cathode foil is provided on a surface of the solid electrolytic layer. The connection portion is provided in the through hole and electrically connects a first solid electrolytic layer and a second solid electrolytic layer, the first solid electrolytic layer being a region of the solid electrolytic layer on one face of the anode foil, the second solid electrolytic layer being another region of the solid electrolytic layer on the other face of the anode foil.

Abstract: A duplexer includes: first and second filters including film bulk acoustic resonators (FBARs) arranged in a ladder form; first and second integrated-passive devices (IPDs) provided between a common terminal and the first and second filters; and a substrate on which the first and second filters and the first and second IPDs are mounted. The substrate includes conductive patterns that realize inductances connected between the first and second filters and ground. The first and second IPDs includes inductors connected to the first and second filters.

Abstract: A resonator includes a piezoelectric thin-film provided on a main surface of a substrate, a first electrode film provided on a first surface of the piezoelectric thin-film, a second electrode film provided on a second surface of the piezoelectric thin-film, a frequency adjustment film provided on one of the first and second electrode films, the frequency adjustment film comprising a film laminate including a first adjustment film provided on said one of the first and second electrode films, and a second adjustment film provided on the first adjustment film. The first adjustment film is used for ?f adjustment, and the second adjustment film is used for correcting frequency deviations generated in the filter manufacturing process. Thus, it is possible to accurately control the center frequency of the filter in which the multiple resonators are connected.

Abstract: A piezoelectric thin-film resonator includes a lower electrode formed on a substrate to define a rounded dome-shaped cavity between the lower electrode and the substrate, a piezoelectric film provided on the lower electrode, and an upper electrode provided on the piezoelectric film. A membrane region is an overlapping region of the lower electrode and the upper electrode interposing the piezoelectric film and a projected area of the cavity onto the substrate includes the membrane region.

Abstract: A surface acoustic wave apparatus has a configuration by which the spurious of the higher-order transverse modes is suppressed and a SAW excitation intensity distribution is not changed in the propagation direction. The surface acoustic wave apparatus has at least one interdigital transducer; a region with the plurality of interleaved comb-shaped electrodes is formed with two regions which are a first overlapping region and a second overlapping region with overlapping-lengths weighted along a propagation direction of a surface acoustic wave; the first overlapping region and the second overlapping region are in contact or overlapped in a direction vertical to the propagation direction of the surface acoustic wave; and in either the first or the second overlapping region, an overlapping-length weighting envelope curve has at least two or more changing points in the propagation direction of the surface acoustic wave.

Abstract: A duplexer that includes: a transmission filter and a reception filter that are connected to a common terminal; and a reactance circuit that is connected to at least one of the transmission filter and the reception filter. The reactance circuit includes an insulating substrate, lumped-constant inductors, and at least one capacitor. The lumped-constant inductors and the capacitor are formed directly on the surface of the insulating substrate.