Abstract: An oscillator includes: oscillation units (11 through 1n) outputting oscillation signals of different frequencies; a transmission line (15) to which outputs of the oscillation units (11, 12) are connected, the transmission line having a characteristic impedance corresponding to an output impedance of an output terminal (Tout); and a low-pass filter 818) connected between the transmission line (15) and the output terminal.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) formed on the piezoelectric substrate, an interconnection electrode that is provided on the piezoelectric substrate and is connected to the IDT, the IDT being made of a metal identical to that of the IDT, an inorganic insulation layer that is provided on the piezoelectric substrate so that at least the interconnection electrode is exposed, an insulative resin layer that is located on an interface between the inorganic insulation layer and a portion of the interconnection electrode exposed from the inorganic insulation layer and is formed so as to cover a side surface of the interconnection electrode, and a metal layer that is provided on the interconnection electrode and the insulative resin layer.

Abstract: An electronic device includes a substrate, a coil that has a spiral shape and is provided on the substrate, and a conductive pattern that is provided inside of the coil, has optical reflectivity higher than that of a surface of the coil, and is divided into pieces.

Abstract: An acoustic wave filter includes a piezoelectric substrate, an IDT (interdigital transducer) formed on the piezoelectric substrate, and reflectors located at both sides of the IDT and composed of electrode fingers, at least one of the electrode fingers of at least one of the reflectors including at least one gap within a propagation path of an acoustic wave.

Abstract: An acoustic wave device includes an acoustic wave element formed on a substrate, a first seal portion provided on the substrate so as to form a cavity above the acoustic wave element, and a second seal portion provided on the first seal portion, the first seal portion having a step so that the first seal portion has a width on a first side and another width on a second side arranged so that the first side is closer than the second side to the substrate, and the width on the first side is greater than the another width on the second side.

Abstract: A method of fabricating an electronic device includes selectively forming a glass layer on a ceramic substrate by printing, baking the glass layer, and forming a capacitor on the glass layer, the capacitor including metal electrodes and a dielectric layer interposed between the metal electrodes.

Abstract: An electronic device includes an insulative substrate, a spiral inductor formed by an interconnection layer provided on a first surface of the insulative layer, a first chip that is mounted on a second surface of the insulative layer opposite to the first surface and is electrically connected to a passive circuit including the spiral inductor, the first chip having an electrically conductive substrate, and a first protrusion that is provided on one of the first and second surface of the insulative substrate and protrudes therefrom, the first protrusion being electrically connected to one of the passive circuit and the first chip to an external circuit.

Abstract: An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.

Abstract: A duplexer includes: a transmission filter and a reception filter that have different band center frequencies from each other; a phase matching circuit that performs phase matching on the transmission filter and the reception filter; and a laminated package that includes a first layer on which the transmission filter, the reception filter, and the phase matching circuit are mounted. In this duplexer, the first layer includes a first ground line pattern that is connected to a ground of the transmission filter, a second ground line pattern that is connected to a ground of the reception filter, a third ground line pattern that is connected to a ground of the phase matching circuit, and signal line patterns. The laminated package also includes a second layer that is located below the first layer. The second layer includes a partition ground line pattern that is located between the signal line patterns, a signal foot pad for external connection, and a ground foot pad.

Abstract: A piezoelectric thin-film resonator includes: a lower electrode that is formed on a substrate; a piezoelectric film that is formed on the lower electrode; and an upper electrode that is formed on the piezoelectric film. In the piezoelectric thin-film resonator, the upper electrode has a greater film thickness than the lower electrode.

Abstract: A duplexer includes an antenna terminal, a first filter connected to the antenna terminal, and a second filter connected to the antenna terminal. At least one of the first filter and the second filter is a ladder type filter in which a parallel resonator and multiple series resonators are included, one or more first inductors are respectively connected in parallel with one or more series resonators out of the multiple series resonators, and one of the one or more first inductors is connected in parallel with one of the multiple series resonators that is arranged closest to the antenna terminal.

Abstract: An acoustic wave device includes a piezoelectric substrate, comb electrodes formed above the piezoelectric substrate, and a first dielectric film provided so as to cover the comb electrodes, the first dielectric film having empty spaces associated with fingers of the comb electrodes.

Abstract: A piezoelectric thin-film resonator includes a substrate, a lower electrode provided on the substrate, a piezoelectric film provided on the lower electrode, and an upper electrode provided on the piezoelectric film so as to have a portion that overlaps the lower electrode across the piezoelectric film. At least a part of an outer end of the piezoelectric film is further in than an outer end of an opposing region in which the upper and lower electrodes overlap each other across the piezoelectric film.

Abstract: An acoustic wave device includes a piezoelectric substrate, a first dielectric film provided on the piezoelectric substrate, electrodes that are provided on the first dielectric film and excite an acoustic wave, and a second dielectric film that is provided so as to cover the electrodes and is thicker than the electrodes.

Abstract: An acoustic wave device includes a substrate; an acoustic wave element provided on the substrate; a terminal that is provided on the substrate and is electrically coupled to the acoustic wave element; a first insulating layer that is provided on the substrate and has a first opening at a region thereof overlapped with at least a part of the terminal; a second insulating layer that has an second opening at a region thereof overlapped with at least a part of the first opening and is provided on the first insulating layer and the acoustic wave element so that a cavity is formed above the acoustic wave element; a third insulating layer that has a third opening including the region where the first opening and the second opening are overlapped with each other, and is provided on the second insulating layer; a metal post that is electrically coupled to the terminal and is provided in the first opening, the second opening and the third opening; and a solder ball provided on the metal post.

Abstract: A method of manufacturing an electronic device includes forming a photosensitive SOG oxide layer on a multi-layer ceramics substrate having a penetrating electrode, forming an opening by subjecting the photosensitive SOG oxide layer to an exposure treatment and developing treatment so that an upper face of the penetrating electrode is exposed, and forming a passive element on the photosensitive SOG oxide layer, the passive element being connected to the penetrating electrode through the opening.

Abstract: An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that is provided on the insulating film so as to cover the opening, and is electrically connected to the penetration electrode; and a second connecting terminal that is provided on a region of the insulating film other than the opening region.

Abstract: A balanced filter includes: a filter that has at least one unbalanced signal terminal; a balun that is a lumped parameter balun that inputs or outputs signals with different phases generated based on a signal input or output from the unbalanced signal terminal of the filter, the balun being formed with an integrated passive device; and a mounting unit in which the filter and the balun are flip-chip mounted.

Abstract: An acoustic wave device includes a substrate, an acoustic wave element, an electrode pad, a resin portion and a metal post. The acoustic wave element is provided on the substrate. The electrode pad is provided on the substrate, is electrically coupled to the acoustic wave element, and has an Au layer and an adhesive layer formed on the Au layer and having an opening. The resin portion is provided on the substrate so as to cover the acoustic wave element and the electrode pad, and has a through-hole formed to expose a surface of the electrode pad. The metal post is provided in the through-hole and contacts with the Au layer through the opening of the adhesive layer. The adhesive layer is provided between the Au layer and the resin portion.

Abstract: An electronic device includes: an insulating substrate; at least one capacitor and an inductor that are formed directly on the insulating substrate; a line that connects the capacitor and the inductor from the above; and an external connecting pad unit that is made of the same conductor as the line and is disposed on the insulating substrate.