Abstract: A bi-directional communication system communicates between a control station, which receives and outputs control signals, and one or more display cabinets. LEDs illuminate objects disposed about the cabinets. Addressable nodes interactively communicate with the control station and selectively operate the LEDs, each node being coupled to the control station and to associated LEDs.

Abstract: The present invention relates to a light emitting diode (LED) light engine. The LED light engine includes at least one LED, the at least one LED having at least one first electrical terminal and at least one second electrical terminal. The LED light engine further includes an electrical cable having a first conductor and a second conductor, the at least one LED being secured to the first conductor by a first insulation displacement connector (IDC) and to the second conductor by a second IDC. The first IDC includes at least one socket for receiving the at least one first electrical terminal and a piercing portion for displacing the insulating portion and electrically contacting the first conductor of the electrical cable. The second IDC includes at least one socket for receiving the second terminal of the at least one LED and a piercing portion for displacing the insulating portion and contacting the second conductor of the electrical cable.

Abstract: A connector electrically connects corresponding conductors of at least first and second cables. The connector comprises a connecting portion into which the conductors of the first and second cables are inserted opposing one another to electrically connect corresponding conductors of each cable. A positive terminal and a negative terminal terminate and electrically connect corresponding conductors of each cable.

Abstract: An electronic device having enhanced heat dissipation capabilities includes an electronic device, a heat sink, a channel, a piezoelectric element, and a blade. The heat sink is in thermal communication with the electronic device. The channel includes an inlet, an outlet and a constriction disposed along the channel between the inlet and the outlet. The heat sink defines at least a portion of the channel. The blade includes a free end and an attached end. The blade is disposed in the channel and connected to the piezoelectric element. The piezoelectric element is activated to move the blade side to side in the channel to create air vortices. The constriction in the channel and the blade cooperate with one another such that a vortex that is generated as the blade moves toward a first side of the channel is compressed against the first side of the channel and expelled towards the outlet of the channel.

Abstract: A booster optic is provided in an LED light assembly that includes a primary reflective surface to redirect light towards a desired location to form an illuminance pattern that when combined with a first illuminance pattern, which is formed by only the primary reflector, provides a combined illuminance pattern having a more uniform illuminance characteristic as compared to not having the booster optic.

Abstract: The inventive dummy load is mounted on the input power cables of a traffic signal while managing the heat load generated by either a resistive and/or capacitive load. Using the inventive dummy load, there is no thermal path back to the light emitting diode (LED) board. The inventive dummy load may be easly installed, removed, or replaced. The dummy load can be retrofit to adapt to a new controller, either by adding to or replacing the dummy load after initial installation or by removing part or all of the dummy load. There is no need to breach the sealed lamp to adjust the dummy load. Thus, field-adjustments can be made. Further, the number of parts required to manufacture lamps for a variety of retrofit applications are reduced, which in turn reduces the cost and complexity of the lamp.

Abstract: A string light engine includes a flexible power cord, a heat sink, an IDC terminal, a PCB, and an LED. The flexible power cord includes an electrical wire and an insulating material for the wire. The heat sink attaches to the power cord. The IDC terminal is inserted through the insulating material and electrically communicates with the wire. The PCB is at least partially received in the heat sink. The PCB includes a first surface having circuitry and a second surface opposite the first surface. The circuitry is in electrical communication with the IDC terminal. The second surface is abutted against a surface of the heat sink so that heat is transferred from the LED into the heat sink. The LED mounts to the first surface of the PCB and is in electrical communication with the circuitry.

Abstract: A system is employed to provide a substantially constant intensity light source via functional circuitry, the functional circuitry comprises a switching power supply. At least one signal is part of a matrix of LEDs connected in series and parallel and configured for redundancy. A monitoring circuit comprises a current sense circuit, wherein the current sense circuit includes an amplifier and at least one resistor in series with the amplifier. The current sense circuit includes a power converter circuit that senses a current of a flyback diode, recovers a dc component of a waveform via a low pass filter, and provides feedback control of the at least one signal.

Abstract: Disclosed are phosphor compositions doped with both Ce3+ and Eu2+ and light emitting devices including a semiconductor light source and the above phosphor. Also disclosed are phosphor blends of the above phosphors and one ore more additional phosphors and white light emitting devices incorporating the same. The preferred blends are used to make light sources with CRI values greater than 90 at any CCT from about 2500 to 8000 K.

Abstract: A string light engine includes a plurality of LEDs, a plurality of IDC connectors, and an insulated flexible conductor. Each IDC connector is in electrical communication with at least one of the plurality of LEDs and is operatively mechanically connected to at least one of the plurality of LEDs. The IDC connectors attach to the conductor.

Abstract: A light-emitting element (24) is disclosed. A light emitting diode (LED) includes a sapphire substrate (26) having front and back sides (33, 35), and a plurality of semiconductor layers (28, 30, 32) deposited on the front side (33) of the sapphire substrate (26). The semiconductor layers (28, 30, 32) define a light-emitting structure that emits light responsive to an electrical input. A metallization stack (40) includes an adhesion layer (34) deposited on the back side (35) of the sapphire substrate (26), and a solderable layer (38) connected to the adhesion layer (34) such that the solderable layer (38) is secured to the sapphire substrate (26) by the adhesion layer (34). A support structure (42) is provided on which the LED is disposed. A solder bond (44) is arranged between the LED and the support structure (42). The solder bond (44) secures the LED to the support structure (42).

Abstract: A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).

Abstract: A LED symbol signal with LEDs arrayed to correspond to a desired symbol. A mask defines the desired symbol. A diffusion surface on the cover diffuses the display aspect, obscuring the individual LEDs. The mask is spaced a distance from the diffusing surface. The more aggressive the diffusion pattern the closer the mask is spaced to the diffusion pattern. Preferably, the ratio of the pitch of the optical elements to the width of the symbol at the diffusion surface is less than 1:2, preferably less than 1:4, more preferably less than 1:6 and most preferably approximately 1:10.

Abstract: A retaining device holds a PCB to a heat sink that has channels for receiving the retaining device. The retaining device includes a body having portions configured for receipt into the channels of the heat sink and moveable tabs and protuberances protruding away from a first surface of each moveable tab. A method for holding the PCB to the heat sink is disclosed. A lighting assembly that includes the retaining device is also disclosed.

Abstract: A string light engine includes a plurality of LEDs, a plurality of IDC connectors, and an insulated flexible conductor. Each IDC connector is in electrical communication with at least one of the plurality of LEDs and is operatively mechanically connected to at least one of the plurality of LEDs. The IDC connectors attach to the conductor.

Abstract: A splice connector includes a first IDC terminal, a second IDC terminal, a body receiving the first and second IDC terminals, and a cover connected to the body such that the cover selectively slides with respect to the body in the first linear direction from first position to a second position. The body defines a first seat configured to receive an associated first cable and second seat configured to receive an associated second cable that is to be electrically connected to the associated first cable. The first and second IDC terminals each include a portion that extends into a region adjacent a respective wire seat. The cover is configured to cooperate with the body where a portion of the cover engages a portion of the body at a third position between the first position and the second position such that in the third position movement of the cover with respect to the body in a second direction, which is opposite the first, is inhibited.

Abstract: A light engine (16) includes at least one LED (12) for generating light of one of a plurality of wavelengths. The LED (12) is disposed on the magnetic core printed circuit board (14). A heatsink (26) is disposed in thermal communication with a base (24) and the LED (12) for conducting thermal energy away from the LED (12). The light engine (16) is magnetically attached to the heatsink (26) via a magnet (50) which is attached to the heatsink (26) to create that a magnetic force between the magnetic core board (14) and the heatsink (26).

Abstract: A p-type contact (30) is disclosed for flip chip bonding and electrically contacting a p-type group III-nitride layer (28) of a group III-nitride flip chip light emitting diode die (10) with a bonding pad (60). A first palladium layer (42) is disposed on the p-type group III-nitride layer (28). The first palladium layer (42) is diffused through a native oxide of the p-type group III-nitride layer (28) to make electrical contact with the p-type group III-nitride layer (28). A reflective silver layer (44) is disposed on the first palladium layer (42). A second palladium layer (46) is disposed on the silver layer (44). A bonding stack (48) including at least two layers (50, 52, 54) is disposed on the second palladium layer (46). The bonding stack (48) is adapted for flip chip bonding the p-type layer (28) to the bonding pad (60).

Abstract: A heat dissipating lamp is provided. The lamp includes a reflector, a lens cover, a support structure interposed between the reflector and the lens cover, and an LED mounted to the support structure. The lens cover includes a portion adjacent a peripheral edge of the reflector. The support structure includes a bridge.

Abstract: In a method for fabricating a flip-chip light emitting diode device, a submount wafer is populated with a plurality of the light emitting diode dies. Each device die is flip-chip bonded to the submount. Subsequent to the flip-chip bonding, a growth substrate is removed. The entire submount is immersed in the etchant solution, exposed to the light for a prespecified period of time, removed from the solution, dried and diced into a plurality of LEDs. The LEDs are immediately packaged without any further processing.