Abstract: A system for converting light from a first range of wavelengths to a second range of wavelengths includes a semiconductor die and a phosphor embedded epoxy contacting a first end of the semiconductor die. A frame contacts the phosphor embedded epoxy. The first and second ranges of wavelengths include blue/ultraviolet light and visible light, respectively.

Abstract: A lamp (10) includes an optics module (12) and an electronics module (14, 60, 70). The optics module (10) includes a plurality of LEDs (76) arranged on a printed circuit board (18) and having a plurality of input leads, and a heat sink (22) having a conduit (40) for the input leads. The plurality of LEDs (16) thermally communicate with the heat sink (22). The electronics module (14, 60, 70) is adapted to power the plurality of LEDs (16) through the input leads. The electronics module (14, 60, 70) has a first end (52) adapted to rigidly connect with the heat sink (22), and a selected electrical connector (50, 62, 72) arranged on a second end for receiving electrical power. The electronics module (14, 60, 70) further houses circuitry (80) arranged therewithin for adapting the received electrical power (82) to drive the LEDs (16).

Abstract: A light-emitting element (24) is disclosed. A light emitting diode (LED) includes a sapphire substrate (26) having front and back sides (33, 35), and a plurality of semiconductor layers (28, 30, 32) deposited on the front side (33) of the sapphire substrate (26). The semiconductor layers (28, 30, 32) define a light-emitting structure that emits light responsive to an electrical input. A metallization stack (40) includes an adhesion layer (34) deposited on the back side (35) of the sapphire substrate (26), and a solderable layer (38) connected to the adhesion layer (34) such that the solderable layer (38) is secured to the sapphire substrate (26) by the adhesion layer (34). A support structure (42) is provided on which the LED is disposed. A solder bond (44) is arranged between the LED and the support structure (42). The solder bond (44) secures the LED to the support structure (42).

Abstract: Light emitting diodes are provided with electrode and pad structures which redirect light which otherwise would be blocked by the pad. The LED may be formed as a die with first and second contact surfaces. A pad is in contact with the first contact surface. A reflector is disposed beneath the first pad, and the reflector includes walls that are oblique with respect to the first contact surface.

Abstract: A light source including a specific LED and phosphor combination capable of emitting white light for direct illumination. In one embodiment, the light source includes an LED chip emitting in the 380-420 nm range radiationally coupled to a phosphor blend first phosphor selected from the group consisting of (Sr,Ba,Ca,Mg)5(PO4)3Cl:Eu2+ (SECA) and BaMg2Al16O27:Eu2+ with a second phosphor having the formula (Tb1-x-yAxREy)3DzO12 (TAG), where A is a member selected from the group consisting of Y, La, Gd, and Sm; RE is a member selected from the group consisting of Ce, Pr, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb, and Lu; D is a member selected from the group consisting of Al, Ga, and In; x is in the range from 0 to about 0.5, y is in the range from about 0 to about 0.2, and z is in the range from about 4 to about 5. The light source thus produced will provide a high quality white light.

Abstract: LED lamp circuitry that emulates an incandescent lamp's behavior upon remote verification of the LED lamp. The LED lamp circuitry presents an input power switch circuit, a fuse blow-out circuit and a cold filament detection circuit permitting the use of LED lamps in applications, such as railway signal light applications, where there is a need for remote monitoring of the lamps, while keeping the advantageous features of lower power consumption and longer life.

Abstract: A light emitting diode signal with reduced susceptibility to the “sun phantom” effect. A single printed circuit board populated with both the power supply circuitry and the light emitting diodes is located at an increased distance from the front cover which is angled to direct extraneous light away from the viewers position. A snap together housing reduces overall cost and assembly time. Light from the light emitting diodes distributed across the single printed circuit board to project an overlapping light pattern is collimated by a multiple collimating zone optical element which creates a uniform display aspect without discernable individual points of light.

Abstract: A lamp (10) includes an optics module (12) and an electronics module (14, 60, 70). The optics module (10) includes a plurality of LEDs (76) arranged on a printed circuit board (18) and having a plurality of input leads, and a heat sink (22) having a conduit (40) for the input leads. The plurality of LEDs (16) thermally communicate with the heat sink (22). The electronics module (14, 60, 70) is adapted to power the plurality of LEDs (16) through the input leads. The electronics module (14, 60, 70) has a first end (52) adapted to rigidly connect with the heat sink (22), and a selected electrical connector (50, 62, 72) arranged on a second end for receiving electrical power. The electronics module (14, 60, 70) further houses circuitry (80) arranged therewithin for adapting the received electrical power (82) to drive the LEDs (16).

Abstract: An LED signal with an LED light pipe collector and intelligent light degradation sensor. The light pipe collector captures LED light normally lost in a generally horizontal direction and redirects it into a generally vertical direction through use of total internal reflection. The light degradation sensor monitors LED signal light output. When light output degrades to a preset level, an electrical circuit triggers a disabling short circuit to deactivate the LED signal.

Abstract: A light source (10) includes a light emitting semiconductor device (12). A support substrate (14) has a generally planar reflective surface (28) that supports the semiconductor device (12). The light emitting semiconductor device heat sinks via the support substrate. A curved reflector (16) has a concave parabolic reflective surface. The light emitting semiconductor device (12) is arranged between the support substrate (14) and the curved reflector (16). The support substrate (14) and the curved reflector (16) together define a light aperture (18) through which light produced by the light emitting semiconductor device (12) passes.

Abstract: A showerhead (802, 804) or faucet (12, 602, 702) includes a water outlet (16, 606, 706, 802) for emitting a water flow (22, 610, 710) and a handle (18, 20, 604, 704, 830) for controlling the water flow (22, 610, 770). At least one LED (42, 242, 342, 442, 542, 544, 546, 624, 658, 730, 810) is arranged on or in the showerhead (802, 804) or faucet (12, 602, 702) and viewable by an associated user thereof. A light-transmissive encapsulant (630, 660, 732) seals the at least one LED (42, 242, 342, 442, 542, 544, 546, 624, 658, 730, 810) and transmits light produced by the at least one LED (42, 242, 342, 442, 542, 544, 546, 624, 658, 730, 810) to the associated user. A controller (550) produces a controller output for controlling the LED light emission responsive to at least one of a water flow rate, a water flow temperature, an ambient light level, and a position of the handle (18, 20, 604, 704, 830).

Abstract: An LED package (10) includes LED die (12) mounted onto lead frame (14) and electrically connected thereto whereby LED die (12) is electrically energized through leads (16, 18). An encapsulant (20), preferably an epoxy resin, encapsulates and preferably hermetically seals LED die (12). Encapsulant (20) includes depression (24) defined by preselected curved surfaces (28), at least a portion of which are coated by reflective coating (26). Encapsulant (20) preferably also includes sides (22) with preselected curvature. In operation, LED die (12) emits light (32) directed approximately along LED die surface normal (36). Light rays (32) reflect from reflective surface (26) and reflected rays (38) are subsequently refracted by refracting surface (22) so that refracted rays (40) exit the capsule. The reflecting surface (26) and refracting surface (22) cooperate to convert LED die light distribution (32) into light distribution (40) which appears to emanate from an approximate point source (42).

Abstract: A light emitting diode (LED) signal with an LED light output monitoring sensor. If the LED light output drops below a pre-set level, an output signal of the sensor via a comparator and deactivation circuit, deactivates one or more LEDs creating a visible fault display aspect, thereby visually indicating signal failure but allowing a continued use of the signal prior to replacement.

Abstract: An LED light engine includes an electrical conductor, a flexible, electrically insulating covering surrounding the electrical conductor, and an LED. The electrical conductor includes a plurality of conductive elements. A connector is mechanically secured to the flexible insulating covering and electrically contacts the electrical conductor. In one embodiment, the LED electrically contacts the electrical conductor and is mechanically secured to the insulating covering. Alternatively, the LED electrically contacts the electrical conductor and is mechanically secured to the insulating covering via the connector.

Abstract: A light emitting diode (LED) device (A) and processes for its manufacture are provided. The LED device (A) includes a light emitting chip or die (10) and an encapsulant (22) surrounding the same. The encapsulant (22) is substantially spherical in shape, and the die (10) is preferably located at a substantial center of the encapsulant (22). An electrically conductive path extends from the chip or die (10) to a periphery of the encapsulant (22) such that the chip/die (10) can be selectively energized to produce light by applying electricity to the electrically conductive path at the periphery of the encapsulant (22). Preferably, the encapsulant (22) is chosen to have an index of refraction as close as possible to the higher of an index of refraction of the die's semiconductor material and an index of refraction of the die's substrate (12).

Abstract: LED lamp circuitry that emulates an incandescent lamp's behaviour upon remote verification of the LED lamp. The LED lamp circuitry presents an input power switch circuit, a fuse blow-out circuit and a cold filament detection circuit permitting the use of LED lamps in applications, such as railway signal light applications, where there is a need for remote monitoring of the lamps, while keeping the advantageous features of lower power consumption and longer life.

Abstract: A decorative lamp (10, 100) is disclosed for producing a diffuse or scattered lighting. A container (12, 102, 116) includes a light transmissive portion (18). A light source (20, 104, 118, 120, 150) includes a housing (32, 122, 152) arranged inside the light transmissive container (12, 102). The housing (32, 122, 152) includes a battery compartment (52, 130, 162) electrically and mechanically adapted to receive at least one associated battery. At least one LED (36,38, 126, 128, 158) is disposed on a first side (34) of the housing (32, 122, 150) and cooperates with the container (12, 102) to emit diffuse or scattered light from the light transmissive portion (18). A fastening means (62, 134) is arranged on a second side (60) of the housing (32, 122). The fastening means (62, 134) is provided to fasten the housing (32, 122, 150) to an inner side (76) of the container (12, 102) wherein the at least one LED (36, 38, 126, 128, 158) illuminates the interior of the container (12, 102).

Abstract: A reflector for use with light emitting devices. Multiple reflective surfaces redirect light emission components of the light emitting device, for example a light emitting diode, into a desired direction. The different light emission components including a total internal reflection light emission component. Paired light emitting devices share common reflector surfaces creating an oval light pattern. Holes in the reflector accommodate electrical components and enhance heat dissipation. A deflector pattern on non-reflector surfaces minimizes sun phantom effect when the reflector is used, for example, in a traffic signal.

Abstract: A lighting assembly for improving the performance of undercabinet and stream-lined lighting includes a LED module onto which is mounted a plurality of light emitting diodes (LEDs). The LEDs serve as the light source for generating a light pattern. An optical assembly focuses and disperses the LED output to a desired light contour. The lighting assembly further includes a mounting base for attaching the LED module to an associated surface, such as the underside of a cabinet. A battery source is optionally enclosed in the module for providing primary or secondary power to the lighting assembly. In a preferred embodiment, the battery source is a rechargeable battery that can be recharged by means of an AC adapter that connects to the lighting assembly.

Abstract: A modular mounting assembly (10) for connecting a plurality of LED's in a selectable electrical and spatial arrangement includes a plurality of substrates (12) each having at least one LED (14a, 14b) fixedly arranged thereon, and a plurality of connectors (16) arranged thereon that are in operative communication with the at least one LED (14a, 14b) fixedly arranged thereon. The plurality of substrates (12) are arranged in a selected spatial arrangement having selected pairs of connectors (16) in operative communication with each other to effectuate electrical connection therebetween, whereby an electrical arrangement of the plurality of LED's is effectuated. A plurality of interconnecting elements (50A, 50D, 50S, 50P) electrically and structurally interconnect selected spatially adjacent substrates (12) in cooperation with the selected pairs of connectors.