Patents Assigned to Genesis
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Patent number: 9924038Abstract: In a contact center, a system for processing communication events has an interaction server for managing events waiting to be routed, a routing server for routing the events, a rules engine, and a gateway server executing rules invocation logic and interacting with the rules engine. The interaction server tracks incoming events, initiates and sends a routing request to the routing server, including a special routing object, for each event that requires conformance to business rules, the routing server, executing the routing object, sends an execution request to the gateway server, which upon receipt of the request prepares a business object model (BOM), being a set of facts upon which the rules engine executes rules appropriate to the facts, resulting in routing direction for the routing server to route the event.Type: GrantFiled: January 3, 2017Date of Patent: March 20, 2018Assignee: Genesys Telecommunications Laboratories, Inc.Inventors: Nikolay Anisimov, Yevgeniy Petrovykh, Mark Scott
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Patent number: 9913672Abstract: An embodiment of the invention provides for a system, such as a cervical plate fusion system, that has mechanisms for preventing bone anchors (e.g., screws, pins, and the like) from backing out of the plate. The system prevents both counter-rotation of the screw and axial backing out of the screw. Other embodiments are described herein.Type: GrantFiled: May 28, 2015Date of Patent: March 13, 2018Assignee: Genesys SpineInventors: Joshua Kaufmann, Scott Bryant, Greg Calbert, Brian Bergeron, Landon Gilkey, John Stokes, Matthew Geck
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Patent number: 9913722Abstract: The present invention provides for a variety of fracture fixation options should a fracture occur after total hip arthroplasty or total knee arthroplasty, and provides associated methods and apparatus for application of provided fixation. The ability to pre-engineer fracture fixation contingent solutions into femoral or tibial components provides for a distinct clinical advantage in the planning and execution for periprosthetic fracture fixation. Said methods and apparatus include targeting devices which allow for intimate association of fixed angle locking screws in pre-drilled holes in an existing prosthetic, femoral nail, or other components including additional fixation components. Use of pre-engineered fracture fixation contingent solutions into femoral or tibial components provides for a distinct clinical advantage in the planning and execution for periprosthetic fracture fixation.Type: GrantFiled: December 8, 2016Date of Patent: March 13, 2018Assignee: Genesis Medical Devices LLCInventors: Daniel Nick Segina, James A. Proctor, Jr., James Arthur Proctor, III
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Publication number: 20180053742Abstract: A method of mass transferring electronic devices includes following steps. A wafer is provided. The wafer includes a substrate and a plurality of electronic devices. The electronic devices are arranged in a matrix on a surface of the substrate. The wafer is attached to a temporary fixing film. The wafer is cut so that the wafer is divided into a plurality of blocks. Each of the blocks includes at least a part of the electronic devices and a sub-substrate. The temporary fixing film is stretched so that the blocks on the temporary fixing film are separated from each other as the temporary fixing film is stretched. At least a part of the blocks is selected as a predetermined bonding portion, and each of the blocks in the predetermined bonding portion is transferred to a carrying substrate in sequence, so that the electronic devices in the predetermined bonding portion arc bonded to the carrying substrate. The sub-substrates of the blocks are removed.Type: ApplicationFiled: August 18, 2017Publication date: February 22, 2018Applicant: Genesis Photonics Inc.Inventors: Shao-Ying Ting, Yan-Ting Lan, Jing-En Huang, Yi-Ru Huang
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Publication number: 20180047869Abstract: A nitride semiconductor structure and a semiconductor light emitting device are revealed. The semiconductor light emitting device includes a substrate disposed with a first type doped semiconductor layer and a second type doped semiconductor layer. A light emitting layer is disposed between the first type doped semiconductor layer and the second type doped semiconductor layer. The second type doped semiconductor layer is doped with a second type dopant at a concentration larger than 5×1019 cm ?3 while a thickness of the second type doped semiconductor layer is smaller than 30 nm. Thereby the semiconductor light emitting device provides a better light emitting efficiency.Type: ApplicationFiled: October 2, 2017Publication date: February 15, 2018Applicant: Genesis Photonics Inc.Inventors: Yen-Lin Lai, Jyun-De Wu, Yu-Chu Li
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Patent number: 9889371Abstract: The invention generally pertains to a system and method for determining if a player has placed a bet in a bet spot on a gaming table, such as, for example, a main bet spot or a progressive or proposition bet spot. By way of example, the tabletop of a gaming table has a plurality of player positions having one or more bet spots positioned in proximity to each player position on the top surface. The tabletop has a light sensor associated with each bet spot and positioned beneath the gaming table layout to detect light intensity through the layout. A plurality of light emitting diodes (LEDs) are associated with each light sensor. The plurality of LEDs are located beneath the gaming table layout so as to illuminate through the material of the gaming table layout.Type: GrantFiled: November 16, 2016Date of Patent: February 13, 2018Assignee: Genesis Gaming Solutions, Inc.Inventors: Randy L. Knust, Eric Schoppe
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Patent number: 9892425Abstract: A system for serving electronic advertisements over a data packet network has a node connected to the data packet network, data storage accessible to the node for holding advertisements for service and associated data, and a software instance running on the node for selecting and causing placement of advertisements including selected associated data. The system is characterized in that the advertisements are selected and served base on some real time information accessible to the software instance and wherein the associated data may be individually or collectively embedded into or deployed with the advertisements based at least in part on evaluation of the information accessed.Type: GrantFiled: August 3, 2006Date of Patent: February 13, 2018Assignees: Genesys Telecommunications Laboratories, Inc., Alcatel LucentInventors: Frederic Laruelle, Ralf Pfeiffer, Rick Phung, David Van Everen
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Publication number: 20180040594Abstract: A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.Type: ApplicationFiled: October 16, 2017Publication date: February 8, 2018Applicant: Genesis Photonics Inc.Inventors: Hao-Chung Lee, Yu-Feng Lin
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Publication number: 20180022026Abstract: A three-dimensional printing system including at least one positioning mechanism, and at least one end effector movably connected to the at least one positioning mechanism. The at least one end effector includes at least one mixing head configured to dispense a material, and at least one subtractive tool configured to subtract at least a portion of the material such that a desired design is achieved.Type: ApplicationFiled: July 21, 2017Publication date: January 25, 2018Applicant: Genesis Dimensions, LLCInventors: James Eric Compton, Casey Roberts, Ben Steinhaurer, Kaleb Steinhauer, Daniel Holman
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Publication number: 20180019232Abstract: A light emitting component includes an epitaxial structure, an adhesive layer, a first reflective layer, a second reflective layer, a block layer, a first electrode and a second electrode. The epitaxial structure includes a substrate, a first semiconductor layer, a light emitting layer and a second semiconductor layer. The adhesive layer is disposed on the second semiconductor layer of the epitaxial structure. The first reflective layer is disposed on the adhesive layer. The second reflective layer is disposed on the first reflective layer and extended onto the adhesive layer. A projection area of the second reflective layer is larger than a projection area of the first reflective layer. The block layer is disposed on the second reflective layer. The first electrode is electrically connected to the first semiconductor layer. The second electrode is electrically connected to the second semiconductor layer.Type: ApplicationFiled: September 25, 2017Publication date: January 18, 2018Applicant: Genesis Photonics Inc.Inventors: Yi-Ru Huang, Tung-Lin Chuang, Chih-Ming Shen, Sheng-Tsung Hsu, Kuan-Chieh Huang, Jing-En Huang
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Publication number: 20180006000Abstract: A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.Type: ApplicationFiled: August 28, 2017Publication date: January 4, 2018Applicant: Genesis Photonics Inc.Inventors: Cheng-Yen Chen, Yun-Li Li, Po-Jen Su
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Publication number: 20180002666Abstract: Systems and methods herein are directed towards the separation of biologic material to obtain a target cell volume and/or cell concentration for harvesting. The target volume and/or concentration of cells may be obtained through a single cycle via three chambers, or by repeated cycles through one or more chambers to dilute the digestive enzymes used in the process and concentrate the harvestable cell volume to a predetermined target.Type: ApplicationFiled: September 18, 2017Publication date: January 4, 2018Applicant: Tissue Genesis, LLCInventors: Rolf WOLTERS, Anthony YANG, Josh NELSON, Stuart K. WILLIAMS
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Patent number: 9859462Abstract: A semiconductor structure includes a silicon substrate, an aluminum nitride layer and a plurality of grading stress buffer layers. The aluminum nitride layer is disposed on the silicon substrate. The grading stress buffer layers are disposed on the aluminum nitride layer. Each grading stress buffer layer includes a grading layer and a transition layer stacked up sequentially. A chemical formula of the grading layer is Al1-xGaxN, wherein the x value is increased from one side near the silicon substrate to a side away from the silicon substrate, and 0?x?1. A chemical formula of the transition layer is the same as the chemical formula of a side surface of the grading layer away from the silicon substrate. The chemical formula of the transition layer of the grading stress buffer layer furthest from the silicon substrate is GaN.Type: GrantFiled: November 13, 2015Date of Patent: January 2, 2018Assignee: Genesis Photonics Inc.Inventors: Chi-Feng Huang, Sheng-Han Tu
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Patent number: 9859459Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.Type: GrantFiled: December 3, 2015Date of Patent: January 2, 2018Assignee: Genesis Photonics Inc.Inventors: Shao-Ying Ting, Kuan-Chieh Huang, Jing-En Huang, Yi-Ru Huang, Sie-Jhan Wu, Long-Lin Ke
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Patent number: 9831399Abstract: A light emitting component includes a light emitting unit, a molding compound and a wavelength converting layer. The light emitting unit has a forward light emitting surface. The molding compound covers the light emitting unit. The wavelength converting layer is disposed above the molding compound. The wavelength converting layer has a first surface and a second surface opposite to the first surface, wherein the first surface is located between the forward light emitting surface and the second surface, and at least one of the first and second surfaces is non-planar.Type: GrantFiled: May 30, 2016Date of Patent: November 28, 2017Assignee: Genesis Photonics Inc.Inventors: Kuan-Chieh Huang, Shao-Ying Ting, Jing-En Huang, Yi-Ru Huang
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Patent number: 9805320Abstract: An apparatus includes a processor and a memory. The memory stores instructions that when executed by the processor cause the processor to: identify a keyword from machine-readable text; identify a contact center resource based on the identified keyword; update a first group of keywords associated with the contact center resource based on the identified keyword; invoke an action based on analysis of the keyword associated with the contact center resource; monitor the action and report results in response; and update a second group of keywords according to analysis of the results.Type: GrantFiled: February 27, 2014Date of Patent: October 31, 2017Assignees: Genesys Telecommunications Laboratories, Inc., Alcatel-Lucent USA, Inc.Inventors: Ramesh V. Pattabhiraman, Andriy Vladimirovich Ryabchun, Geeta Chauhan, Josef Eric Eisner
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Patent number: 9792239Abstract: A tablet cover (100) and circuitry (400) provide for convenient connection of a tablet (105) or other personal electronic device to additional memory, functions, and features as provided by an internal device (215) and/or an external device (160). The circuitry selectively connects the tablet, the external device, and the additional memory together. The additional memory is internal to the case and is thereby protected from loss or damage due to accidental impact.Type: GrantFiled: February 3, 2015Date of Patent: October 17, 2017Assignee: Genesis Technology USA, Inc.Inventor: Earl Anthony Daughtry, Jr.
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Publication number: 20170294555Abstract: A semiconductor structure includes a first-type doped semiconductor layer, a light emitting layer, a second-type doped semiconductor layer comprising AlxInyGal-x-yN layers, at least one GaN based layer, and an ohmic contact layer. The light emitting layer is disposed on the first-type doped semiconductor layer, and the second-type doped semiconductor layer is disposed on the light emitting layer. The AlxInyGal-x-yN layers stacked on the light emitting layer, where 0<x<1, 0?y<1, and 0<x+y<1, and the GaN based layer interposed between two of the AlxInyGal-x-yN layers, and the ohmic contact layer is disposed on the AlxInyGal-x-yN layers.Type: ApplicationFiled: June 19, 2017Publication date: October 12, 2017Applicant: Genesis Photonics Inc.Inventors: Chi-Feng Huang, Ching-Liang Lin, Shen-Jie Wang, Jyun-De Wu, Yu-Chu Li, Chun-Chieh Lee
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Patent number: 9786813Abstract: A thin-film flip-chip light emitting diode (LED) having a roughened surface and a method for manufacturing the same are provided. First, a substrate having a patterned structure on a surface of the substrate is provided, and the surface is roughened. A first semiconductor layer is then formed on the surface; a light emitting structure layer is then formed on the first semiconductor layer; a second semiconductor layer is then formed on the light emitting structure layer. The first and second semiconductor layers possess opposite electrical characteristics. A first contact electrode and a second contact electrode are then formed on the first semiconductor layer and the second semiconductor layer, respectively. Finally, a sub-mount is formed on the first and second contact electrodes, and the substrate is removed to form the thin-film flip-chip LED having the roughened surface. Here, the light emitting efficiency of the thin-film flip-chip LED is improved.Type: GrantFiled: February 3, 2017Date of Patent: October 10, 2017Assignee: Genesis Photonics Inc.Inventors: Yi-Fan Li, Jing-En Huang, Sie-Jhan Wu
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Publication number: 20170288092Abstract: A nitride semiconductor structure and a semiconductor light emitting device including the same are revealed. The nitride semiconductor structure mainly includes a stress control layer disposed between a light emitting layer and a p-type carrier blocking layer. The p-type carrier blocking layer is made from AlxGa1-xN (0<x<1) while the stress control layer is made from AlxInyGa1-x-yN (0<x<1, 0<y<1, 0<x+y<1). The light emitting layer has a multiple quantum well structure formed by a plurality of well layers and barrier layers stacked alternately. There is one well layer disposed between the two barrier layers. Thereby the stress control layer not only improves crystal quality degradation caused by lattice mismatch between the p-type carrier blocking layer and the light emitting layer but also reduces effects of compressive stress on the well layer caused by material differences.Type: ApplicationFiled: June 19, 2017Publication date: October 5, 2017Applicant: Genesis Photonics Inc.Inventors: Chi-Feng Huang, Ching-Liang Lin, Shen-Jie Wang, Jyun-De Wu, Yu-Chu Li, Chun-Chieh Lee