Abstract: A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances.

Abstract: A light emitting device includes a base, a light guiding lamp cover, a light-emitting diode (LED) module and a wavelength converting structure. The light guiding lamp cover is disposed on the base and an accommodating space is defined by the light guiding lamp cover and the base together. The light guiding lamp cover has an inner surface, an outer surface and a bottom surface connecting the inner surface and the outer surface. A curvature of the inner surface is greater than a curvature of the outer surface. The LED module is disposed on the base and located inside the accommodating space. The wavelength converting structure is disposed on the LED module and located inside the accommodating space.

Abstract: A light emitting device includes a light emitting diode (LED) module and a rotatable wavelength converting structure. The LED module includes a substrate and a plurality of LED chips. The LED chips are disposed on the substrate, and each of the LED chips has a light emitting surface. The rotatable wavelength converting structure is disposed on the LED module and has a plurality of wavelength converting blocks with at least two different colors. Each of the LED chips at least corresponds to one wavelength converting block. The wavelength converting blocks are disposed on the light emitting surfaces of the LED chips. The rotatable wavelength converting structure rotates relative to the LED module so as to change the wavelength converting blocks that the LED chips correspond to.

Abstract: A connector (200), such as but not limited to a coaxial female F-connector, has an integral surge protector. The F-connector includes a connector body (220) with an extended center conductor lead (215). Attached to the F-connector and substantially surrounding the lead is an inductor, such as a toroid core (300) having windings (315) thereon. In one configuration one end (320) of the windings is attached to the center conductor lead and the other end (325) is attached to an electrical ground. In another configuration that other end is attached to a circuit ground via a capacitor, a power supply, or a biasing circuit. The inductor serves to shunt a surge to ground. A series capacitor is connected between the center conductor lead and an input/output port on an electronic circuit, passes the desired signal, and further helps to prevent a surge from reaching the device.

Abstract: A multiple quantum well structure including a plurality of well-barrier pairs arranged along a direction is provided. Each of the well-barrier pairs includes a barrier layer and a well layer adjacent to the barrier layer. The barrier layers and the well layers of the well-barrier pairs are disposed alternately. A ratio of a thickness of the well layer in the direction to a thickness of the barrier layer in the direction in each well-barrier pair is a well-barrier thickness ratio, and the well-barrier thickness ratios of a part of the well-barrier pairs gradually increase along the direction.

Abstract: A wavelength converting structure suitable for covering a carrier carrying at least one light-emitting diode (LED) chip is provided. The wavelength converting structure includes a base film and a fluorescent layer. The base film has a first bending portion and a first flat portion connected to the first bending portion. The first flat portion is disposed on the carrier, and an accommodating space is defined by the first bending portion and the carrier. The LED chip is disposed in the accommodating space. The fluorescent layer is disposed on the base film and has a second bending portion and a second flat portion connected to the second bending portion. The second bending portion is conformal to the first bending portion, and the second flat portion is conformal to the first flat portion.

Abstract: A light emitting diode (LED) structure including a substrate, a polymer layer, and an epitaxy layer is provided. The polymer layer is disposed on the substrate, wherein the polymer layer has a chemical formula of: wherein M represents sodium, zinc, magnesium, or potassium. The epitaxy layer is disposed on the polymer layer. The epitaxy layer is bonded to the substrate via the polymer layer.

Abstract: An illumination system is provided, including a light emitting device and a control device, wherein the control device is coupled to the light emitting device so as to capture a situation data in a remote end and generate a situation signal correspondingly. The light emitting device receives the situation signal and generates a simulating situation.

Abstract: A method for forming a multi-material thin film includes providing a multi-material donor substrate comprising single crystal silicon and an overlying film comprising GaN. Energetic particles are introduced through a surface of the multi-material donor substrate to a selected depth within the single crystal silicon. The method includes providing energy to a selected region of the donor substrate to initiate a controlled cleaving action in the donor substrate. Then, a cleaving action is made using a propagating cleave front to free a multi-material film from a remaining portion of the donor substrate, the multi-material film comprising single crystal silicon and the overlying film.

Abstract: A frangible projectile with a specific gravity similar to a lead projectile. The projectile comprises 34-94%, by weight, binder. The binder comprises poly ether block amide resin. The projectile further comprises 6-66%, by weight, ballast. The ballast comprises at least one member selected from a group consisting of tungsten, tungsten carbide, molybdenum, tantalum, ferro-tungsten, copper, bismuth, iron, steel, brass, aluminum bronze, beryllium copper, tin, aluminum, titanium, zinc, nickel silver alloy, cupronickel and nickel. The projectile can be prepared with a particularly preferred specific gravity of 5-14 and more preferably 11-11.5.

Abstract: A spray coating apparatus including a containing tank, a spray nozzle, and a detection unit is provided. The containing tank contains a glue. The spray nozzle is connected to the containing tank to spray and coat the glue on a work piece. The detection unit detects specification data of the glue on the work piece.

Abstract: A light emitting device including a carrier, a substrate, at least one electrode pair, at least one light emitting diode (LED) and at least one positioning element is provided. The substrate is disposed on the carrier and has a body portion and at least one bending portion. The bending portion connects to the body portion. The bending portion is not coplanar with the body portion. The electrode pair is located on the body portion of the substrate. The LED is disposed on the body portion of the substrate and electrically connected to the electrode pair. The positioning element is disposed on the bending portion of the substrate for fixing the substrate on the carrier.

Abstract: A system for dewatering a stream of slurry has a first and a second separator. The first separator removes objects above a first size, to produce a stream of primary treated slurry. The second separator removes objects above a second size from the primary treated stream, the second size being smaller than the first size. Optionally, a third separator removes objects above a yet smaller third size from the stream of secondary treated slurry. The first separator has a plurality of sieve mat supports alternately connected to a main support frame section and a movable support frame section so that the flexible sieve mat can be agitated by the movable support frame section, a collector being provided for collecting the primary treated slurry passing through the flexible sieve mat. In an optional step, water contained in the separated solids is removed.

Abstract: A semiconductor light emitting device including a first type doped semiconductor layer, a light emitting layer, a second type doped semiconductor layer, and a reflection layer is provided. The first type doped semiconductor layer has a mesa portion and a depression portion. The light emitting layer is disposed on the mesa portion and has a first surface, a second surface and a first side surface connecting the first surface with the second surface. The second type doped semiconductor layer is disposed on the light emitting layer and has a third surface, a fourth surface and a second side surface connecting the third surface with the fourth surface. Observing from a viewing direction parallel to the light emitting layer, the reflection layer covers at least part of the first side surface and at least part of the second side surface. A flip chip package device is also provided.

Abstract: A light emitting diode including a first doped layer, a light emitting layer, a second doped layer and a substrate is provided. A plurality of first grooves penetrate through the second doped layer and the light emitting layer. Thus, a partial surface of the first doped layer is exposed. At least one of the plurality of first grooves extends to edges of the second dope layer and the light emitting layer. An insulating layer is disposed over a part of second doped layer and extends to sidewalls of the first grooves. A first contact is set in the first grooves and electrically connected to the first doped layer. A second contact is set on the second doped layer and electrically connected to the second doped layer. By the first grooves, the first contact can be electrically connected to the first doped layer for improving current spreading.

Abstract: A device for welding plastic tubes includes a pair of tube holders each of which has a tube clamp which includes an upper jaw and a lower jaw. The jaws in both of the tube clamps of both tube holders have smooth tube contacting walls to permit the tubing to slip through either side when the tube holders and tubes are being moved from a loading station to a stripping station to increase the length of fluid free area in the clamped tubes. A cutting/welding station provides for cutting the tubes and welding them together.

Abstract: The present invention relates to a composition useful for pain relief. The composition is high concentration capsaicinoid topical composition comprising an analgesic agent that eliminates or reduces the burning or stinging sensation or erythema of the capsaicinoid.

Abstract: The present invention provides for the harvesting of specific materials in multiple stages of filtration of bone graft materials from a Reamer-Irrigator-Aspirator (RIA) Device, specifics of interconnected stages, related filtration materials, and techniques. The harvesting process collects large material in a first stage, and other materials of a limited geometric size in at least a second stage of filtration. Such material captured in the second stage may contain plasma, cellular elements including stem cells as well as growth factors and other particulate matter of a specific geometrically limited size, using various filtration approaches including centrifugation in some embodiments. Further embodiments of the invention provide for an improved tubing interface and management approach to ease use in the operating room. Filtration materials may include collagen based filters and may allow direct implant of small scale and larger scale matter in specific portions within the collagen itself.

Abstract: An apparatus and a method for capping and sealing a vial with a cap assembly including a deformable annular seal, e.g., a ferrule, is disclosed. The apparatus comprises a base for holding the vial, a pressure applying platen, plural sealing rollers and associated electronic circuitry and motors. The platen is arranged to be moved relative to the base, whereupon it engages and applies a force to the cap assembly. The load cell measures the force applied and provides a signal indicative thereof to the electronic circuitry. The electronic circuitry determines when a desired amount of force has been applied to control the operation of the rollers, whereupon the rollers apply a force to the annular seal to permanently crimp the annular seal on the vial.

Abstract: Devices and methods are provided for processing adipose tissue with a hand-held device. This device may include a processing chamber, a cannula, a vacuum source, a digestion area, and a product cell concentration chamber.