Abstract: A novel plasma treatment system (200) including one or more novel computer codes. These codes provide a high density plasma for plasma immersion ion implantation applications.

Abstract: In an enterprise-hosted multimedia telecommunications center, a client-facing interactive single-media pre-processing interface has an answering facility adapted for greeting and pre-instructing a client making a contact to the pre-processing interface, an identifying facility adapted for identifying the client through one or both of data accompanying the contact and information elicited from the client, and a discrimination facility adapted for offering the client one or more communication choices based on the client identification established by the identifying facility. In one embodiment the pre-processing interface is a WEB page. Also in a preferred embodiment, client transaction history is recorded in an enterprise data repository, including current projects, and clients are offered choices based on transaction history. In one such embodiment, live calls are reserved for clients engaged in current projects.

Abstract: A cluster tool assembly 10, 200, 300 using plasma immersion ion implantation chamber. In some embodiments, the cluster tool assembly also includes a controlled cleaving process chamber, as well as others.

Abstract: In a process for storing data from a database in a store of an information system, wherein access to the database is possible via a program running in an EDP system, the structure of the data stored in the database is built up by the following process steps: storing a plurality of objects representing images of concrete or abstract objects in a first store region; storing a plurality of relations between the objects in a second store region; storing a plurality of characteristics for describing the objects and the relations between them in a third and fourth store region; storing a plurality of connections between the objects and the characteristics in a fifth store region; and storing a plurality of connections between the relations and the characteristics in a sixth store region, where the six regions represent physically or logically bounded store regions. The invention also relates to the corresponding data structure and an information system.

Abstract: An apparatus for sharing redundancy circuits between memory arrays within a semiconductor memory device includes at least two main memory arrays comprised of a plurality of memory cells aligned in rows and/or columns and a shared redundancy circuit. The redundancy circuits preferably include a plurality of redundancy rows and a redundancy decoder which is configured for accessing the redundancy rows whenever a read or write operation involves use of a defective row within the main memory arrays for which a redundant row has been substituted. Preferably, each main memory array has access to the shared redundancy circuit. The shared redundancy circuit is used for substituting defective rows within a corresponding main memory array. The shared redundancy circuit provides extra redundant capacity to both of the main memory arrays.

Abstract: A computer simulation system adapted for simulating a telephony call center comprises individual software modules simulating separate entities of the call center in the simulated call center, and a graphical user interface (GUI). In the GUI the individual software modules are presented as icons movable and connectable on the screen to alter characteristics of the simulated call center. In a preferred embodiment the simulation system is adapted for testing computer telephony integration (CTI) applications. In this embodiment one of the software module icons comprises a (CTI) link interface library adapted to provide communication between the simulated call center and the CTI application in a manner that the simulated call center will behave as a specific switch type in a specific instance. Also in a preferred embodiment one of the individual software modules is a telephony objects module representing a telephony switch and connected telephony devices, agents, and associated behavior.

Abstract: In a specific embodiment, the present invention provides a novel process for smoothing a surface of a separated film. The present process is for the preparation of thin semiconductor material films. The process includes a step of implanting by ion bombardment of the face of the wafer by means of ions creating in the volume of the wafer at a depth close to the average penetration depth of the ions, where a layer of gaseous microbubbles defines the volume of the wafer a lower region constituting a majority of the substrate and an upper region constituting the thin film. A temperature of the wafer during implantation is kept below the temperature at which the gas produced by the implanted ions can escape from the semiconductor by diffusion. The process also includes contacting the planar face of the wafer with a stiffener constituted by at least one rigid material layer.

Abstract: Novel isolated DNA sequences associated with the lignin biosynthetic pathway are provided, together with DNA constructs including such sequences. Methods for the modulation of lignin content and structure in plants and methods for producing plants having altered lignin content and structure, are also disclosed, the methods comprising and incorporating one or more of the polynucleotides disclosed herein into the genome of a plant.

Abstract: A telephony call center system has Data Network Telephony (DNT)-capable telephone apparatus at agent stations connected on a Local Area Network (LAN), a data router at the call center connected on the LAN with a data port connected to a data network capable of transmitting Data Network Telephony (DNT) calls, and a Computer Telephony Integration (CTI) Server connected by a CTI link to the data router. A bridge unit is connected to the same data network at a remote (network) location by a data network port, and to a Connection Oriented/Switched Telephony (COST) network by a second port. The bridge unit further includes conversion circuitry for converting data dynamically between DNT and COST telephone calls, and control routines adapted to receive a first call from one of the COST and DNT networks, to place a call associated with the received call on the network other than the network on which the call is received, and to dynamically convert data between the associated calls.

Abstract: A personal telephone call router adapted to execute on a personal computer (PC) connected to a local area network (LAN) wherein the LAN is also connected to a computerized telephony switching system has a graphic user interface allowing an individual user to route incoming calls from his/her PC by drag-and-drop techniques. In some embodiments the user may also customize routing rules for incoming calls. In preferred embodiments incoming calls are directed in the telephony switch to a virtual routing destination. In some cases each individual user is associated with a specific virtual destination, and in others data associated with each call is broadcast on the LAN to be filtered at each PC on the Lan running a personal router according to an embodiment of the invention.

Abstract: A multi-media call center has agent stations with telephones and multi-media computer platforms, wherein the telephones and computer platforms are connected by a bridge circuit adapted to allow audio data to be shared between the telephones and the computer platforms. The computer platforms are also adapted to process computer-simulated calls. In various embodiments all or portions of calls of either type may be recorded, pre-recorded audio may be played back to callers, the system may respond to pre-determined key phrases uttered by callers, and the system may respond to an agent's voice commands.

Abstract: A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) in a selected manner through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define a donor substrate material (12) above the selected depth and the particles for a pattern at the selected depth. An energy source is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.

Abstract: A plasma treatment system (200) for implantation with a novel susceptor with shielding (203). The system (200) has a variety of elements such as a chamber in which a plasma is generated in the chamber. The system (200) also has a susceptor disposed in the chamber to support a substrate. A shield (203) is disposed adjacent to the susceptor for blocking impurities that may possibly be introduced from a backside of the susceptor. The shield allows fewer impurities to be sputtered from the backside of the susceptor. In a specific embodiment, the chamber has a plurality of substantially planar rf transparent windows (26) on a surface of the chamber. The system (200) also has an rf generator (66) and at least two rf sources in other embodiments.

Abstract: A telephone call-routing system comprises an initial call-processing unit with a first telephone line adapted for receiving calls from customers, and includes a call-routing processor adapted for routing incoming calls to selected destinations; and a remote call-in center having a computerized telephony switch connected to a plurality of telephones at operator workstations and adapted to route calls to individual ones of the telephones, and also connected by a first outside telephone line to a telephone network.

Abstract: A personal telephone all router adapted to execute on a personal computer (PC) connected to a local area network (LAN) wherein the LAN is also connected to a computerized telephony switching system has a user interface allowing an individual user to customize routing rules for incoming calls. The interface in a preferred embodiment is a window displayable on a computer screen of the PC, allowing the user to review and edit personal routing rules in a high-level language. Data, such as caller ID and the like, associated with incoming calls received at the computerized telephony switching system is broadcast on the LAN prior to routing the incoming calls, and the broadcast data is utilized by individual editions of the personal telephone call router to prepare and send routing instructions on the LAN to the computerized switching system to route the incoming calls.

Abstract: A process for forming a novel substrate material. The process includes providing a substrate, e.g., silicon wafer. The substrate has a stressed layer at a selected depth underneath a surface of the substrate. The stressed layer is at the selected depth to define a substrate material to be removed above the selected depth. The stressed layer comprises a deposited layer and an implanted region. The substrate also comprises a device layer overlying the stressed layer. The process includes forming a plurality of integrated circuit devices on the substrate material. A thermal treatment process at a temperature greater than about 400 degrees Celsius is included in the process of forming the integrated circuit devices. Next, the process includes providing energy to a selected region of the substrate to initiate a controlled cleaving action at the selected depth in the substrate, whereupon the cleaving action is made using a propagating cleave front to free a portion of the material to be removed from the substrate.

Abstract: A telephone call-routing system comprises an initial call-processing unit adapted for receiving calls from customers, and includes a processor system adapted for eliciting information from a caller. In a preferred embodiment calls are forwarded to telephony switches at selected remote call-in centers over telephone lines, and the elicited information from each call is forwarded in parallel over digital communication links separate from the telephone lines to telephony servers at the remote call-in centers to which the calls are forwarded. In a preferred embodiment, at the remote call-in centers the telephony switches are connected to plural telephones at workstations, and the telephony servers are connected to the telephony switches and on networks to display terminals proximate the individual telephones to which calls are routed.

Abstract: A server connected to a data network for transmitting files over the data network to one of a plurality of destination servers is adapted to spawn a software agent in response to a file to be transmitted and meeting certain preset criteria, such as file size. The software agent is associated with the file by at least the file's destination, and is transmitted over one or more routes to the destination to collect routing information, and returns to the source server. The associated file is then transmitted using the information collected. In an alternative embodiment the agent also collects validation information at the destination and returns same to the source server. The agent may also, in some embodiments, negotiate reserved bandwidth and security protocols or other validation information for transmission of the associated file at certain intermediate servers.

Abstract: A method for chemically bonding semiconductor wafers and other materials to one another without exposing wafers to wet environments, and a bonding chamber for in situ plasma bonding are disclosed. The in situ plasma bonding chamber allows plasma activation and bonding to occur without disruption of the vacuum level. This precludes rinsing of the surfaces after placement in the chamber, but allows for variations in ultimate pressure, plasma gas species, and backfill gases. The resulting bonded materials are free from macroscopic and microscopic voids. The initial bond is much stronger than conventional bonding techniques, thereby allowing for rougher materials to be bonded to one another. These bonded materials can be used for bond and etchback silicon on insulator, high voltage and current devices, radiation resistant devices, micromachined sensors and actuators, and hybrid semiconductor applications. This technique is not limited to semiconductors.