Patents Assigned to Hakko Corporation
  • Publication number: 20200130085
    Abstract: A smartphone, tablet or mobile computer based soldering system control method and apparatus to allow a user or supervisor of users to monitor and control the operating parameters of soldering devices or measuring device. The control method and apparatus has features for cartridge management, temperature calibration and control, user performance and wireless interactive control. The control method may interactively control soldering devices connected directly to a power supply and optionally soldering device components of a soldering system that includes a control station to provide power to the soldering device.
    Type: Application
    Filed: October 30, 2018
    Publication date: April 30, 2020
    Applicant: Hakko Corporation
    Inventors: Mitsuhiko Miyazaki, Yasumasa Igi, Nobuharu Boh
  • Publication number: 20200030902
    Abstract: A heating tool having a temperature sensor fixed within a tip of the heating tool with maximum heat conductivity to the temperature sensor.
    Type: Application
    Filed: June 25, 2019
    Publication date: January 30, 2020
    Applicant: Hakko Corporation
    Inventors: KENJI MATSUZAKI, KENTA NAKAMURA
  • Publication number: 20200016674
    Abstract: A soldering and de-soldering station and systems including enhanced features for the soldering heating tools and load detection functionality.
    Type: Application
    Filed: July 10, 2018
    Publication date: January 16, 2020
    Applicant: Hakko Corporation
    Inventors: Kenji Matsuzaki, Hitoshi Takeuchi, Kenta Nakamura
  • Publication number: 20190376851
    Abstract: The invention is directed to embodiments of a temperature sensor for use with a temperature measuring device, for example a digital thermometer. The temperature sensor includes at least two and preferably three wires joined at a thermocouple. The temperature sensor is designed to be mounted on terminals of the digital thermometer sensor to allow precise temperature measurements for a thermal device, for example a soldering tool or de-soldering tool.
    Type: Application
    Filed: May 22, 2019
    Publication date: December 12, 2019
    Applicant: Hakko Corporation
    Inventors: Hiroyuki Masaki, Tomoyo Maeshima
  • Publication number: 20190341753
    Abstract: A handheld device for thermal cartridges which may include a wire stripping cartridge for stripping insulation from sections of an insulated electrical wire, or a thermal tweezer cartridge for de-soldering and removing electrical components, and more particularly a hand-operated electrically heated thermal devices with a replaceable cartridges.
    Type: Application
    Filed: May 3, 2018
    Publication date: November 7, 2019
    Applicant: Hakko Corporation
    Inventors: Hisao Nemoto, Tomoyo Maeshima, Norihisa Sekimori
  • Publication number: 20190299311
    Abstract: A cartridge for a soldering system that is capable of being powered by a 400 Watt power supply and which includes a pair of sensors to provide precise and rapid control over the temperature of the soldering cartridge tip.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 3, 2019
    Applicant: Hakko Corporation
    Inventors: Toshikazu Mochizuki, Hitoshi Takeuchi, Koji Miyahara
  • Patent number: 10413985
    Abstract: A controller and a control method for a hot air blower used in the field of solder reworking. The controller allows a user to change the control parameters effectively while using the hot air blower.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: September 17, 2019
    Assignee: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hitoshi Takeuchi, Yasumasa Igi, Kenta Nakamura
  • Patent number: 10406619
    Abstract: A heater cartridge comprises a heater contained within a distal section of housing pipe near a working portion, such as soldering iron tip or a blade for stripping wire. The wall thickness of the housing pipe is generally thin to limit heat transfer to a proximal section of the housing pipe near where a user's hand would be normally located. The wall thickness is thinner in a region near the heater as compared to a region expected to have a high bending moment.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: September 10, 2019
    Assignee: Hakko Corporation
    Inventor: Mitsuhiko Miyazaki
  • Publication number: 20190134730
    Abstract: A cordless, hand held soldering iron operable with a control station providing wireless temperature control functionality and a charging station.
    Type: Application
    Filed: September 26, 2018
    Publication date: May 9, 2019
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Kenta Nakamura
  • Publication number: 20190047066
    Abstract: A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.
    Type: Application
    Filed: August 8, 2018
    Publication date: February 14, 2019
    Applicant: Hakko Corporation
    Inventors: Kenji Matsuzaki, Hitoshi Takeuchi, Kenta Nakamura
  • Publication number: 20180193937
    Abstract: A controller and a control method for a hot air blower used in the field of solder reworking. The controller allows a user to change the control parameters effectively while using the hot air blower.
    Type: Application
    Filed: December 22, 2016
    Publication date: July 12, 2018
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hitoshi Takeuchi, Yasumasa Igi, Kenta Nakamura
  • Publication number: 20180161903
    Abstract: The present invention defines a tool including a heating device including a method and apparatus to allow the user to check whether, or be notified when, the soldered electronic component is completely removed from a substrate after the solder is sufficiently melted.
    Type: Application
    Filed: December 13, 2016
    Publication date: June 14, 2018
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Publication number: 20180036819
    Abstract: The invention details the designs of cleaning pad assemblies for use with heating tools including for example soldering cartridges and soldering irons. The cleaning pads of the assembly are designed to effectively remove and clean the solder from heating tools during and at the end of soldering operations, and allow the collection of the removed solder.
    Type: Application
    Filed: August 3, 2017
    Publication date: February 8, 2018
    Applicant: Hakko Corporation
    Inventor: Mitsuhiko Miyazaki
  • Patent number: D805567
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: December 19, 2017
    Assignee: HAKKO CORPORATION
    Inventor: Toshiyuki Kita
  • Patent number: D818509
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: May 22, 2018
    Assignee: HAKKO CORPORATION
    Inventors: Mitsuhiko Miyazaki, Tomoaki Harada
  • Patent number: D829519
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: October 2, 2018
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Hisao Nemoto, Kenta Nakamura
  • Patent number: D829520
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: October 2, 2018
    Assignee: HAKKO CORPORATION
    Inventor: Mitsuhiko Miyazaki
  • Patent number: D841066
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: February 19, 2019
    Assignee: HAKKO CORPORATION
    Inventor: Toshiyuki Kita
  • Patent number: D877219
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: March 3, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Mitsuhiko Miyazaki
  • Patent number: D879849
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: March 31, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Toshiyuki Kita