Abstract: A smartphone, tablet or mobile computer based soldering system control method and apparatus to allow a user or supervisor of users to monitor and control the operating parameters of soldering devices or measuring device. The control method and apparatus has features for cartridge management, temperature calibration and control, user performance and wireless interactive control. The control method may interactively control soldering devices connected directly to a power supply and optionally soldering device components of a soldering system that includes a control station to provide power to the soldering device.
Type:
Application
Filed:
October 30, 2018
Publication date:
April 30, 2020
Applicant:
Hakko Corporation
Inventors:
Mitsuhiko Miyazaki, Yasumasa Igi, Nobuharu Boh
Abstract: A soldering and de-soldering station and systems including enhanced features for the soldering heating tools and load detection functionality.
Abstract: The invention is directed to embodiments of a temperature sensor for use with a temperature measuring device, for example a digital thermometer. The temperature sensor includes at least two and preferably three wires joined at a thermocouple. The temperature sensor is designed to be mounted on terminals of the digital thermometer sensor to allow precise temperature measurements for a thermal device, for example a soldering tool or de-soldering tool.
Abstract: A handheld device for thermal cartridges which may include a wire stripping cartridge for stripping insulation from sections of an insulated electrical wire, or a thermal tweezer cartridge for de-soldering and removing electrical components, and more particularly a hand-operated electrically heated thermal devices with a replaceable cartridges.
Abstract: A cartridge for a soldering system that is capable of being powered by a 400 Watt power supply and which includes a pair of sensors to provide precise and rapid control over the temperature of the soldering cartridge tip.
Type:
Application
Filed:
March 28, 2018
Publication date:
October 3, 2019
Applicant:
Hakko Corporation
Inventors:
Toshikazu Mochizuki, Hitoshi Takeuchi, Koji Miyahara
Abstract: A controller and a control method for a hot air blower used in the field of solder reworking. The controller allows a user to change the control parameters effectively while using the hot air blower.
Abstract: A heater cartridge comprises a heater contained within a distal section of housing pipe near a working portion, such as soldering iron tip or a blade for stripping wire. The wall thickness of the housing pipe is generally thin to limit heat transfer to a proximal section of the housing pipe near where a user's hand would be normally located. The wall thickness is thinner in a region near the heater as compared to a region expected to have a high bending moment.
Abstract: A cordless, hand held soldering iron operable with a control station providing wireless temperature control functionality and a charging station.
Abstract: A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.
Abstract: A controller and a control method for a hot air blower used in the field of solder reworking. The controller allows a user to change the control parameters effectively while using the hot air blower.
Abstract: The present invention defines a tool including a heating device including a method and apparatus to allow the user to check whether, or be notified when, the soldered electronic component is completely removed from a substrate after the solder is sufficiently melted.
Abstract: The invention details the designs of cleaning pad assemblies for use with heating tools including for example soldering cartridges and soldering irons. The cleaning pads of the assembly are designed to effectively remove and clean the solder from heating tools during and at the end of soldering operations, and allow the collection of the removed solder.