Patents Assigned to Harima Chemicals Inc.
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Patent number: 9006296Abstract: According to the present invention, a metal nanoparticle dispersion suitable to multiple layered coating by jetting in the form of fine droplets is prepared by dispersing metal nanoparticles having an average particle size of 1 to 100 nm in a dispersion solvent having a boiling point of 80° C. or higher in such a manner that the volume percentage of the dispersion solvent is selected in the range of 55 to 80% by volume and the fluid viscosity (20° C.) of the dispersion is chosen in the range of 2 mPa·s to 30 mPa·s, and then when the dispersion is discharged in the form of fine droplets by inkjet method or the like, the dispersion is concentrated by evaporation of the dispersion solvent in the droplets in the course of flight, coming to be a viscous dispersion which can be applicable to multi-layered coating.Type: GrantFiled: September 10, 2004Date of Patent: April 14, 2015Assignees: Harima Chemicals, Inc., SIJ Technology, Inc., National Institute of Advanced Industrial Science and TechnologyInventors: Daisuke Itoh, Akihito Izumitani, Noriaki Hata, Yorishige Matsuba, Kazuhiro Murata, Hiroshi Yokoyama
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Patent number: 8816031Abstract: The present invention provides a method for preparing a water soluble polymer, which comprises: a first step of polymerizing: (a) 60 to 99.5 mol % of at least one selected from acrylamide and methacrylamide, (b) 0.5 to 20 mol % of at least one selected from ?,?-unsaturated monocarboxylic acid, ?,?-unsaturated dicarboxylic acid and salts thereof, and (c) 1 to 20 mol % of at least one selected from a water soluble cationic monomer and a salt thereof, (d) 0.01 to 1 mol % of a chain transfer agent, and (e) 0.005 to 5 mol % of a crosslinkable monomer, in the presence of a persulfate-based catalyst to obtain a prepolymer; and a second step of further adding the persulfate-based catalyst to the prepolymer obtained in the first step and the residual monomer, followed by the polymerization and termination of the polymerization.Type: GrantFiled: March 6, 2006Date of Patent: August 26, 2014Assignee: Harima Chemicals, Inc.Inventors: Yoshiharu Kimura, Takahiro Fujiwara
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Publication number: 20140178581Abstract: The present invention provides a process for simply and easily producing fine metal particles or fine metal oxide particles in the form of a dry powder which can be used as extremely fine particles in a good dispersion state without causing coagulation for a long time even if not stored in a dispersion solvent.Type: ApplicationFiled: January 17, 2014Publication date: June 26, 2014Applicant: HARIMA CHEMICALS, INC.Inventors: Daisuke Itoh, Masayuki Ueda, Noriaki Hata, Yorishige Matsuba
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Patent number: 8758475Abstract: The present invention provides a process for simply and easily producing fine metal particles or fine metal oxide particles in the form of a dry powder which can be used as extremely fine particles in a good dispersion state without causing coagulation for a long time even if not stored in a dispersion solvent.Type: GrantFiled: October 20, 2004Date of Patent: June 24, 2014Assignee: Harima Chemicals, Inc.Inventors: Daisuke Itoh, Masayuki Ueda, Noriaki Hata, Yorishige Matsuba
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Publication number: 20140083567Abstract: The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule.Type: ApplicationFiled: October 7, 2011Publication date: March 27, 2014Applicant: HARIMA CHEMICALS, INC.Inventors: Teruyoshi Hamagawa, Youichi Kukimoto, Taku Hasegawa, Hitoshi Sakurai
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Patent number: 8679263Abstract: Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component 4 is mounted on a main surface 1a of a substrate having an electrode section 2 and an insulating film 3, and the electrode section 2 and the electronic component 4 are electrically bonded to each other through a solder section 5, and a flux residue 6 exuded from the solder section 5 is present between the electronic component 4 and the insulating film 3. The flux contains an acrylic resin, an activating agent, and a thixotropic agent having a hydroxyl group. The glass transition point of the acrylic resin is not higher than ?40° C., or not lower than the softening temperature of the flux residue. The flux residue has a maximum value of 300×10?6/K or less of linear thermal expansion coefficient within a temperature range from ?40° C.Type: GrantFiled: February 19, 2009Date of Patent: March 25, 2014Assignee: Harima Chemicals, Inc.Inventor: Masami Aihara
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Publication number: 20140053954Abstract: The present invention is a flux for soldering, containing a base resin and an activating agent, in which the base resin contains a thermoplastic acrylic resin obtained by polymerizing a monomer component containing a long chain alkyl(meth)acrylate, the long chain alkyl moiety of the long chain alkyl(meth)acrylate has a branched structure having 12 to 23 carbon atoms, and the acrylic resin has a weight average molecular weight of 30000 or less. A solder paste composition of the present invention improves wettability, storage stability and crack resistance in residue portions, and printability for fine portions without adhering to a squeegee when printed.Type: ApplicationFiled: July 11, 2011Publication date: February 27, 2014Applicant: HARIMA CHEMICALS, INC.Inventors: Kousuke Inoue, Tetsuyuki Shigesada, Takumi Shiomi, Masao Murata
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Publication number: 20140023872Abstract: The present invention relates to a method for producing a cationic surface sizing agent, and contains a first step of obtaining a copolymer (A) by solution-polymerizing a monomer mixture containing a monomer having a tertiary amino group (a), a specific (meth)acrylic acid ester (b) and styrenes (c) in the specific proportion in the presence of a chain transfer agent; a second step of obtaining a copolymer (B) by polymerizing the copolymer (A) and a hydrophobic monomer (d), in order to have a specific proportion of the copolymer (A), in an oxidation-reduction system using a water-soluble free-radical initiator and a heavy metal salt in the absence of a surfactant; and a third step of obtaining a quaternary ammonium salt of the copolymer (B) by quaternizing a tertiary amino group present in the copolymer (B).Type: ApplicationFiled: August 18, 2011Publication date: January 23, 2014Applicant: HARIMA CHEMICALS, INC.Inventors: Takuji Sodeyama, Yoko Hayashi, Kazushige Inaoka
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Publication number: 20140017505Abstract: The present invention relates to a method for producing a cationic surface sizing agent, and contains a first step of obtaining a copolymer (A) by solution-polymerizing a monomer mixture which contains a monomer having a tertiary amino group (a) in the amount of 15 to 45% by weight, a (meth)acrylic acid ester (b) in the amount of 15 to 85% by weight, and styrenes (c) in the amount of 0 to 70% by weight in the presence of a chain transfer agent; a second step of obtaining a copolymer (B) by polymerizing the copolymer (A) and a nonionic hydrophilic monomer (d); a third step of obtaining a copolymer (C) by polymerizing the copolymer (B) and a hydrophobic monomer (e) in the absence of a surfactant; and a fourth step of obtaining a quaternary ammonium salt of the copolymer (C) by quaternizing a tertiary amino group present in the copolymer (C).Type: ApplicationFiled: August 18, 2011Publication date: January 16, 2014Applicant: HARIMA CHEMICALS, INC.Inventors: Takuji Sodeyama, Yoko Hayashi, Kazushige Inaoka
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Patent number: 8414739Abstract: There is provided a filled paper containing a coated filler obtained by coating a filler with a acrylamide copolymer (composite PAM) comprising (A) an anionic polysaccharide and (B) a cationic and/or an amphoteric acrylamide copolymer. The composite PAM is obtained, for example, by mixing the component (A) and the component (B). Since the filler is treated with a combination of the components (A) and (B) different from each other in charge properties and structure, suitable coagulation effect can be attained and the coated filler has excellent affinity for pulp slurry. Therefore, even in the case of a highly filled paper, a large paper strengthening effect can be attained by using a small amount of the chemical agent.Type: GrantFiled: March 16, 2006Date of Patent: April 9, 2013Assignees: Harima Chemicals, Inc., Nippon Paper Industries Co., Ltd.Inventors: Yoshiharu Kimura, Takao Sezaki, Yuko Iijima, Koji Kutsuwa
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Patent number: 8349135Abstract: To effectively impart sizing performance to paper, while reducing the amounts of an internal sizing agent and aluminum sulfate, a papermaking additive comprises a mixture of an amphoteric copolymer having a hydrophobic group whose quaternization ratio is 40% by mole or more, and in which the ratio of the anion equivalent to the cation equivalent is 0.1 to 90%, and a calcium carbonate filler. The filler is one in which suitable water repellency is imparted to the filler. Hence, by adding this to pulp slurry, followed by a wet papermaking, the filler is efficiently adsorbed onto pulp fibers having anionic property, so that effective sizing performance can be imparted to the paper by using a smaller amount thereof than the internal sizing agent, while reducing the amounts of the internal sizing agent and the aluminum sulfate.Type: GrantFiled: January 16, 2008Date of Patent: January 8, 2013Assignees: Harima Chemicals, Inc., Nippon Paper Industries Co., Ltd.Inventors: Kazunari Sakai, Tomohiko Nakata, Yoshiharu Hashiguchi, Takashi Yamaguchi, Masaki Ito, Yasunobu Ooka
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Publication number: 20120308792Abstract: A red fluorescence conversion composition includes a color conversion material (A) which absorbs light in a blue region and emits light having a fluorescence emission maximum in yellow-orange regions; a color conversion material (B) which absorbs light in the yellow-orange regions and emits light having a fluorescence emission maximum in the red region; and a matrix resin (C) for dispersing the color conversion materials (A) and (B). The color conversion material (A) is a condensed polycyclic compound made of a 5-membered ring compound having a conjugated system, and a 6-membered ring compound having a conjugated system with the 5-membered ring compound. The 5-membered ring compound contains at least one kind of atom selected from a hetero atom, a selenium atom, and a boron atom. A red fluorescence conversion film is made of the composition.Type: ApplicationFiled: October 28, 2010Publication date: December 6, 2012Applicants: SHARP CORPORATION, HARIMA CHEMICALS, INC.Inventors: Shinichi Kawashima, Takeshi Ishida, Shinichiro Isobe, Shuntaro Mataka
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Publication number: 20120291921Abstract: A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.Type: ApplicationFiled: December 6, 2010Publication date: November 22, 2012Applicants: ARAKAWA CHEMICAL INDUSTRIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA, HARIMA CHEMICALS, INC., FUJITSU TEN LIMITED, KOKI COMPANY LIMITED, DENSO CORPORATIONInventors: Eiji Iwamura, Kazushi Gotoh, Shinsuke Nagasaka, Takayasu Yoshioka, Masayoshi Utsuno, Atsuo Nakamura, Teruo Okochi, Masaki Sanji, Takuji Sukekawa, Kenshi Ikedo, Yoshiyuki Andoh, Takeshi Shirai, Kimiaki Mori, Rie Wada, Kensuke Nakanishi, Masami Aihara, Seishi Kumamoto
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Publication number: 20120291922Abstract: A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.Type: ApplicationFiled: December 6, 2010Publication date: November 22, 2012Applicants: ARAKAWA CHEMICAL INDUSTRIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA, HARIMA CHEMICALS, INC., FUJITSU TEN LIMITED, KOKI COMPANY LIMITED, DENSO CORPORATIONInventors: Eiji Iwamura, Kazushi Gotoh, Fumio Ishiga, Takayasu Yoshioka, Masayoshi Utsuno, Atsuo Nakamura, Teruo Okochi, Masaki Sanji, Takuji Sukekawa, Kenshi Ikedo, Yoshiyuki Andoh, Takeshi Shirai, Kimiaki Mori, Rie Wada, Kensuke Nakanishi, Masami Aihara, Seishi Kumamoto
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Patent number: 8241462Abstract: To provide a papermaking internal sizing agent capable of efficiently imparting sizing performance even in neutral papermaking which uses calcium carbonate as filler, and uses no aluminum sulfate or uses a small amount of aluminum sulfate, and also provide a paper or a paperboard obtained by using the papermaking internal sizing agent. The papermaking internal sizing agent comprises as an effective ingredient an amphoteric copolymer having hydrophobic groups and cationic groups, at least a part of the cationic groups being quaternized. Preferably, the amphoteric copolymer is obtained by polymerizing monomer ingredients that it essentially contain a hydrophobic monomer (A), a cationic monomer (B), and an anionic monomer (C) and that an anion equivalent of the monomer (C) is 0.1 to 90% of a cation equivalent of the monomer (B), in which a rate of quaternizing of the cationic groups is not less than 40% by mole. The paper or the paperboard contains the above papermaking internal sizing agent.Type: GrantFiled: March 6, 2008Date of Patent: August 14, 2012Assignees: Harima Chemicals, Inc., Nippon Paper Industries Co., Ltd.Inventors: Kazunari Sakai, Takahiro Fujiwara, Kazushige Inaoka, Takashi Yamaguchi, Masaki Ito, Yasunobu Ooka
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Publication number: 20120175020Abstract: A low silver solder alloy of the present invention comprises 0.05-2.0% by mass of silver; 1.0% by mass or less of copper; 3.0% by mass or less of antimony; 2.0% by mass or less of bismuth; 4.0% by mass or less of indium; 0.2% by mass or less of nickel; 0.1% by mass or less of germanium; 0.5% by mass or less of cobalt (provided that none of the copper, the antimony, the bismuth, the indium, the nickel, the germanium, and the cobalt is 0% by mass); and the residue is tin. According to the present invention, the long-term reliable low silver solder alloy is provided, wherein the low silver solder alloy permits the cost reduction by decreasing the Ag content, and has the excellent stretch, melting point, and strength, and also has the high fatigue resistance (thermal fatigue resistance).Type: ApplicationFiled: May 12, 2011Publication date: July 12, 2012Applicant: Harima Chemicals, Inc.Inventors: Yoji Imamura, Kazuki Ikeda, Jin Yu Piao, Tadashi Takemoto
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Publication number: 20120073741Abstract: An adhesive composition for forming an adhesive layer for temporarily fixing a substrate, such as a wafer, to a support when processing the substrate, the adhesive composition including a resin (A) produced by polymerizing a monomer component containing a cycloolefin-based monomer, at least one terpene-based resin, rosin-based resin, or petroleum resin (resin B), and an organic solvent capable of dissolving the resins (A) and (B). The resin (A) has a glass transition point of 60° C. or higher, the resin (B) has a softening point of 80 to 160° C. and a molecular weight of 300 to 3000, and the blending ratio of the resin (A) to the resin (B) is (A):(B)=80:20 to 55:45 (mass ratio).Type: ApplicationFiled: May 20, 2010Publication date: March 29, 2012Applicants: HARIMA CHEMICALS, INC., TOKYO OHKA KOGYO CO., LTD.Inventors: Takahiro Asai, Hirofumi Imai, Koki Tamura, Takahiro Yoshioka, Nobuyuki Matsuoka, Mariko Watanabe, Takahiko Tsukuda
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Patent number: 8075706Abstract: A paste composition for aluminum brazing of the invention contains 40 to 65% by weight of a metal powder for brazing (a), 5 to 35% by weight of a fluoride type flux (b), 1 to 10% by weight of a methacrylic acid ester type polymer (c), and 10 to 40% by weight of an organic solvent (d); and the component (d) is a hydrocarbon type organic solvent having no aromatic ring and no hydroxyl group and the composition is in a paste-like state having a viscosity of 6,000 to 200,000 mPa·s at 23° C. and accordingly, the storage stability and applicability (practically, discharge property and pressure stability by using a dispenser) and brazing property can be improved in good balance.Type: GrantFiled: December 19, 2008Date of Patent: December 13, 2011Assignees: Harima Chemicals, Inc., Denso CorporationInventors: Tomoaki Akazawa, Masaki Teruse, Ichiro Taninaka, Shoei Teshima, Kinya Yamamoto, Akira Itoh, Ken Muto
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Patent number: 8021580Abstract: The present invention provides a conductive metal paste, available for fabrication of a metal fine particle sintered product layer, which has excellent adhesion to a surface of an underlying substrate such as a glass substrate and also has good conductivity. The conductive metal paste according to the present invention contains, per 100 parts by mass of the metal fine particles whose average particle size is 1 to 100 nm, 10 to 60 parts by mass in total of one or more compounds which are used in a coating molecular layer on a surface of a metal fine particle and which have a group capable of coordinate bonding to a metal element contained in the metal fine particles via a lone pair held by a nitrogen, oxygen, or sulfur atom, and also contains one or more metal compounds which are reduced by heating up to 250° C. or higher to be able to precipitate a metal atom such that a total amount of metals contained in the metal compound is within a range from 0.Type: GrantFiled: June 23, 2004Date of Patent: September 20, 2011Assignee: Harima Chemicals, Inc.Inventors: Masayuki Ueda, Hiroshi Saito, Kazuo Hosoya, Noriaki Hata, Yorishige Matsuba
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Patent number: 7988826Abstract: The invention improves a sizing effect even on paper containing no internal sizing agent and improves productivity by making solution polymerization in a small amount of an organic solvent. The invention provides a cationic surface sizing agent composed of a copolymer obtained by solution polymerization of (a) 15 to 35% by weight of a tertiary amino group-containing monomer, (b) 30 to 85% by weight of C1 to C4 alkyl(meth)acrylate, and (c) 1 to 50% by weight of styrenes in an organic solvent in the presence of a chain transfer agent. The copolymer may be subjected to cationization treatment with a quaternization agent. As a constituent monomer of the copolymer, 0 to 20% by weight of another copolymerizable vinyl monomer (d) may be contained. The cationic surface sizing agent is applied to paper.Type: GrantFiled: March 30, 2006Date of Patent: August 2, 2011Assignee: Harima Chemicals, Inc.Inventors: Kazushige Inaoka, Tomohiko Nakata, Yoshiharu Hashiguchi