Abstract: A large number of pads, to which component leads are to be soldered, are formed on an insulating substrate so as to constitute a pad array. Colder layers are precoated on the pads. Each of the pads has a component lead mounting portion where a component lead is to be mounted, and a component lead non-mounting portion where no component lead is to be mounted. The component lead non-mounting portion includes a wide part having a width greater than that of the component lead mounting portion.

Abstract: The invention provides a sizing agent with good stability, particularly which is rapid in getting started in the neutral zone and a method of producing the same.A sizing agent for papermaking in neutral zone is characterized by a main component of said sizing agent being selected from the group consisting of a diester of rosin-based substances having a dicarboxylic acid or acid anhydride group expressed by the following formula (I), ##STR1## (in which R.sub.1 represents a rosin acid residue or maleopimaric acid, R.sub.2 represents a dihydric alcohol residue and R.sub.3 represents a maleopimaric acid residue); and 2) a polyester reaction product expressed by the following formula (I'), ##STR2## (in which R'.sub.1 and R'.sub.5 represent a rosin acid residue or an .alpha.,.beta.-unsaturated polybasic carboxylic acid added rosin residue, at least one of them represents .alpha.,.beta.-unsaturated polybasic carboxylic acid added rosin residue, R'.sub.2 and R'.sub.4 represent polyhydric alcohol residues, R'.sub.

Abstract: A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H<W, that a pad array is formed in which a width of each of the pads located at two ends of the pad array is larger than that of a pad located therebetween, and that the pad width W and a pad-to-pad distance D satisfy a relation W>D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.

Abstract: A soldering flux composition comprising, as a flux base resin, a modified amine compound obtained by reacting (i) at least one member selected from the group consisting of vinyl group-containing compounds, carboxyl group-containing compounds and epoxy group-containing compounds (ii) with an amine compound having an active hydrogen.

Abstract: The present invention relates to a size composition which shows an excellent sizing effect in neutral to weakly acidic papermaking.Alkanol tertiary amine and fortified rosin, incorporated in the size composition of the present invention, even when prepared as dispersions using a dispersant, are extremely poor in sizing performance in the neutral pH range, whereas the size composition obtained by mixing these components in a ratio according to the present invention and dispersing them using a surfactant specified by the present invention offers an excellent sizing in the neutral to weakly acidic pH range.

Abstract: [Object] A fatty acid-related polyunsaturated compound can be selectively purified using an industrially operable successive method under moderate conditions. [Content] A highly purified fatty acid-related polyunsaturated compound is obtained by a process comprising steps of forming a complex with silver on account of the high degree of unsaturation of the fatty acid-related polyunsaturated compound, isolating the complex from other fats on account of the hydrophilicity of the complex and then applying dissociating procedures to the complex to obtain the fatty acid-related polyunsaturated compound as a target substance on account of the hydrophobicity of the fatty acid-related polyunsaturated compound. As to the procedures for dissociation, addition of a dissociating agent and reduction of silver are disclosed. As to the dissociating agent, various compounds which produce insoluble composition with silver other then water are disclosed.

Abstract: Disclosed is a soldering flux which prevents a release of an active ion contained in an activator when exposed to a high-temperature atmosphere maintaining at a temperature higher than 80.degree. C., for example, an atmosphere of an engine room of an automobile, and thus makes washing unnecessary. This soldering flux comprises, together with an activator, (1) a thermoplastic resin having a softening point not lower than 80.degree. C., and/or (2) an epoxy group-containing compound, a radical-polymerizable unsaturated double bond-containing compound or a blocked isocyanate group-containing compound, or (3) a thermosetting resin composed of a carboxyl group-containing resin and an epoxy resin and/or a thermosetting resin containing carboxy and epoxy groups.

Abstract: The present invention relates to an deinking agent used for reproduction of printed waste papers such as newspapers, magazines, leaflets and the like, and mainly contains one or more additives selected from the group comprising(a) additives made by adding one or more selected from alkylene oxides to at least one selected from dimer acids and polymer acids of higher unsaturated fatty acids having a carbon number of 16-20;(b) additives made by adding one or more selected from alkylene oxides to at least one selected from partial esters which are made of an alcohol having a carbon number of 1-18 and dimer acids and polymer acids of higher unsaturted fatty acids having a carbon number of 16-20;(c) additives made by adding one or more selected from alkylene oxides to one or more selected from dicarboxylic acids or dicarboxylic acid monoesters.

Abstract: A solder precipitating composition comprises a powder of a metal having the highest ionization level among metals constituting a solder alloy to be prepared, and a salt between a carboxylic acid and a remaining metal of the solder alloy. The composition is applied to a surface on which the solder is to be precipitated, and the solder is precipitated, thereby performing soldering.

Abstract: A paste-like composition containing a lead salt of an organic acid and tin powder is applied on a pad array portion of a circuit board. Then, the paste-like compsition is heated so as to cause precipitation, thereby forming a solder layer formed of a Sn-Pb alloy substantially only on the pads. This precipitation is performed in a state that a liquid pool is formed on the pad array portion when the paste-like composition is liquefied by heating, and the tin powder is settled in the liquid pool. When an electronic part is mounted on the pads, first, preparatory solder layers are formed on the pads by the above-mentioned precipitation process. After a paste-like composition is applied on the preparatory solder layers, the electronic part is put on the paste-like composition. Then, the paste-like composition is heated, thereby soldering leads of the electronic part to the pads.

Abstract: Disclosed is a novel method for the production of a substance which accelerates the hatching of potato cyst nematode eggs using root cells of plants of Solanaceae family.In this method, the cultivation of the root cells may be carried out in a specific medium, or, alternatively, the cells obtained by transformation of the root cells with Ri plasmid T-DNA is used.The disclosed method can be applied for the prevention of the damage by the cyst nematodes in potato cultivation.

Abstract: A conductive high molecular composition which comprises a non-conductive polymer component incorporated with a metal salt, characterized in that the metal salt is a salt of a metal with an acid substance selected from an organic carboxylic acid, rosin and a rosin derivative. This composition has an insulating property in normal state but functions as an electroconductive material only in the event it is interposed between slightly spaced metals and heated. Thus, the composition can be used not only as an insulating binder but also for imparting conductivity only in the desired spots of electronic parts, keeping the other areas of the parts electrically insulated. The composition thus possessing a specific dual function is particularly useful in the field of electronic industry.

Abstract: A method for forming a metal film on the surface of a substrate metal, which comprises soaking a substrate metal or a non-metal support carrying the substrate metal thereon in a solution of a metal salt in a high boiling point solvent under heating conditions, characterized in that the metal salt is a salt of the metal to be formed on the surface of the substrate metal with an acidic substance selected from an organic carboxylic acid, a rosin and a rosin derivative. The metal is precipitated from the solution exclusively on the surface of the substrate metal without forming any solid metal particle in the solution or on the substrate metal. Thus, the method is applicable to the formation of a soldering alloy as a film on the surface of a substrate metal without leaving thereon any free metal particle which may cause short circuits in electronic circuits.

Abstract: A conductive high molecular composition which comprises a non-conductive polymer component incorporated with a metal salt, characterized in that the melt salt is a salt of a metal with an acid substance selected from an organic carboxylic acid, rosin and a rosin derivative. This composition has an insulating property in the normal state but functions as an electroconductive material only in the event it is interposed between slightly spaced metals and heated. Thus, the composition can be used not only as an insulating binder but also for imparting conductivity only in the desired spots of electronic parts, keeping the other areas of the parts electrically insulated. The composition thus possessing a specific dual function is particularly useful in the electronic industry field.

Abstract: A rubber composition in which a metal salt between a resin acid and cobalt is blended in a content of from 0.05 to 0.7 part by weight in terms of the content of a metal element with respect to 100 parts by weight of rubber containing not less than 70% by weight of at least one rubber of natural rubber and a synthetic polyisoprene rubber; as the metal salt is used a cobalt resinate which has a melting point in a range of 140.degree. to 180.degree. C., an oxidation degree of not more than 60% in a gas chromatography (GLC), and not more than 2,000 ppm of a sulfur concentration in the metal salt; when the metal salt is divided into a dissolved portion and an undissolved portion by using toluene and water, the undissolved portion in both toluene and water has a characteristic absorption of around 3,600 cm.sup.-1 in an infrared absorption spectrum (IR); and when elevated in temperature at a rate of 5.degree. C./min.

Abstract: A method of manufacturing an aqueous O/W dispersion of fortified rosin for use in the sizing of paper by mixing the same with water and a dispersing agent by first forming a dispersion of the W/O type in the presence of the dispersing agent and then turning the first dispersion to an O/W type by sequential addition of water thereto, wherein said dispersing agent has the general formula: ##STR1## in which R is a straight- or branched-chain alkyl group having 4 to 24 C atoms, n is an integer of 6 to 20, and M.sup.+ is a cation selected from the group consisting of Na.sup.+, K.sup.+, and NH.sub.4.sup.+.

Abstract: A process for recovery of iodine from waste containing iodine or iodine compound, comprising the steps of burning the waste in a cumbustion chamber, and scrubbing out the iodine or iodine compound in the resulting combustion gas with a basic aqueous solution of sodium thiosulfate.

Abstract: Method of preparing an emulsifier useable in emulsion polymerization processes, comprising the steps of subjecting rosin, polyunsaturated fatty acid or mixture thereof to disproportionation reaction, in the presence of a catalyst of iron iodide, and then neutralizing with alkali, and use of such emulsifier in emulsion polymerization processes.