Patents Assigned to Harima Chemicals Inc.
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Patent number: 7262511Abstract: The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g.Type: GrantFiled: August 18, 2005Date of Patent: August 28, 2007Assignees: Harima Chemicals, Inc., Toshiba CorporationInventors: Katsuhisa Osako, Naoto Shioi, Daisuke Itoh, Hideyuki Gotoh, Yorishige Matsuba, Kazuki Tateyama, Yasunari Ukita, Masao Segawa, Takuo Kikuchi
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Publication number: 20060286301Abstract: A method of preparing substrates, including the steps of depositing metal particulates into a pillar form at a prescribed position of a substrate (1) by the use of a fine inkjet method, and then sintering the resultant to form a metal pillar (2).Type: ApplicationFiled: September 10, 2004Publication date: December 21, 2006Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE, HARIMA CHEMICALS, INC.Inventors: Kazuhiro Murata, Hiroshi Yokoyama, Daisuke Itoh, Akihito Izumitani, Noriaki Hata, Yosishige Matsuba
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Patent number: 7081214Abstract: This invention provides a low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked; the conductive paste of the invention uses, as conductive media, in combination with metal fillers having an average particle diameter of 0.Type: GrantFiled: September 26, 2001Date of Patent: July 25, 2006Assignees: Harima Chemicals, Inc., ULVAC, Inc.Inventors: Yorishige Matsuba, Yoshihisa Misawa, Hideyuki Goto, Masayuki Ueda, Katsuhisa Oosako, Masaaki Oda, Norimichi Saito, Toshihiro Suzuki, Noriyuki Abe
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Patent number: 7070829Abstract: To provide a method for producing a sensing film for gas sensors by sintering particles comprising a metal or a metal oxide on a substrate, where the sensing film for gas sensors having excellent sensor properties such as sensitivity and responsibility can be easily and simply formed. A nano-meter order particle (100), a dispersant (110) for preventing aggregation of the particles (100), and a scavenger (120) for trapping the dispersant (110) at the sintering are mixed in a solvent (130) to prepare a paste body (140), and this paste body (140) is coated on a base material and fired, thereby forming a sensing film.Type: GrantFiled: March 12, 2003Date of Patent: July 4, 2006Assignees: DENSO Corporation, Harima Chemicals, Inc., Ulvac, Inc.Inventors: Masashi Totokawa, Yorishige Matsuba, Yoshihisa Misawa, Hideyuki Gotoh, Katsuhisa Osako, Masaaki Oda, Norimichi Saito, Toshihiro Suzuki, Noriyuki Abe
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Publication number: 20060113355Abstract: The purpose of the present invention is provide a method of forming a flux layer on an aluminum plate member, wherein a heating step for drying after a spray-coating of a flux composition can be omitted. The invention relates to a flux layer 2 composed of solid constituents of 5-25 g/m2 formed on a surface of an aluminum plate member 1, by spray-coating a flux composition from a nozzle 20 to the plate member 1 with a thickness of 0.2-1.6 mm, which was press-molded and heated for degreasing in a heat-degreasing oven 10, while a temperature of the plate member 1 is kept from 120 to 180° C. under the remaining heat after completing a heating step for degreasing, and naturally drying for volatilizing volatile constituents of the flux composition utilizing the remaining heat.Type: ApplicationFiled: November 28, 2005Publication date: June 1, 2006Applicants: DENSO Corporation, Harima Chemicals, Inc.Inventors: Koji Onouchi, Shoei Teshima, Ichiro Taninaka
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Publication number: 20060038304Abstract: The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g.Type: ApplicationFiled: August 18, 2005Publication date: February 23, 2006Applicants: HARIMA CHEMICALS, INC., TOSHIBA CORPORATIONInventors: Katsuhisa Osako, Naoto Shioi, Daisuke Itoh, Hideyuki Gotoh, Yorishige Matsuba, Kazuki Tateyama, Yasunari Ukita, Masao Segawa, Takuo Kikuchi
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Patent number: 6923875Abstract: According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.Type: GrantFiled: January 15, 2003Date of Patent: August 2, 2005Assignee: Harima Chemicals, Inc.Inventors: Kazuki Ikeda, Hiroshi Tanaka, Hisao Irie, Keigo Obata, Takao Takeuchi, Naoya Inoue
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Patent number: 6894096Abstract: A resin varnish for printing ink is produced by condensing phenol and formaldehyde in an ink solvent to obtain an ink solvent solution of resole initial condensate, after which the resole initial condensate and a rosin ester containing 30-60 wt % non-aromatic conjugate resin acid and 20-60 wt % aromatic resin acid are reacted at 100-250° C. in a system containing ink solvent or in a system containing ink solvent and drying oil. A high-viscosity, high-molecular-weight ink resin is produced efficiently by reacting, with resole initial condensate in ink solvent, a rosin ester containing specified contents by percentage of conjugate acid and aromatic resin acid. The resin varnish obtained has very few decomposition components and nonuniformly gelled components, so it also is suitable for screen printing ink and letterpress printing ink, in addition to offset printing ink.Type: GrantFiled: May 15, 2003Date of Patent: May 17, 2005Assignee: Harima Chemicals, Inc.Inventors: Keiji Sasakura, Hiroshi Toyoda
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Publication number: 20040242837Abstract: The present invention provides a rosin modified phenolic resin obtained by reacting a rosin, a phenol-formaldehyde initial condensate and a polyhydric alcohol, wherein the phenol-formaldehyde initial condensate is obtained by reacting phenols with formaldehyde in an ester of an animal and vegetable oil fatty acid and a monoalcohol and the proportion of the ester is from 5 to 200% by weight based on the total amount of the phenols and formaldehyde charged, a gel varnish and a printing ink, which contain the same, and a method for producing a rosin modified phenolic resin.Type: ApplicationFiled: May 17, 2004Publication date: December 2, 2004Applicant: HARIMA CHEMICALS, INC.Inventors: Hiroshi Toyoda, Satoru Yaguchi
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Publication number: 20040209451Abstract: The present invention provides a solder deposition method that includes the step of forming a dam around an electrode on a substrate, the step of applying a solder precipitating composition to the substrate, and the step of depositing solder on the surface of the electrode while heating the solder precipitating composition applied. This solder deposition method is suitable for forming large bumps at fine pitches. In particular, it is capable of depositing solder in a desired height precisely and easily, and yet preventing occurrence of voids.Type: ApplicationFiled: January 29, 2004Publication date: October 21, 2004Applicant: HARIMA CHEMICALS, INC.Inventors: Youichi Kukimoto, Hitoshi Sakurai, Seishi Kumamoto, Kenshu Oyama
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Publication number: 20040181026Abstract: The present invention provides a rosin modified phenolic resin having a weight average molecular weight of 3,000 to 400,000, which is obtained by reacting a monoester with a polyhydric alcohol and a phenol formaldehyde initial condensate, said monoester being prepared by partially esterifying a rosin and an animal and vegetable oil fatty acid with a monoalcohol, and a method for producing the same. Also the present invention provides a gel varnish comprising the resin, an animal and vegetable oil component, and a gelling agent, and a printing ink comprising the gel varnish. Printing is conducted using the printing ink.Type: ApplicationFiled: March 9, 2004Publication date: September 16, 2004Applicant: HARIMA CHEMICALS, INC.Inventors: Hiroshi Toyoda, Tadahisa Chiyoda
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Publication number: 20030236331Abstract: A resin varnish for printing ink is produced by condensing phenol and formaldehyde in an ink solvent to obtain an ink solvent solution of resole initial condensate, after which the resole initial condensate and a rosin ester containing 30-60 wt % non-aromatic conjugate resin acid and 20-60 wt % aromatic resin acid are reacted at 100-250° C. in a system containing ink solvent or in a system containing ink solvent and drying oil. A high-viscosity, high-molecular-weight ink resin is produced efficiently by reacting, with resole initial condensate in ink solvent, a rosin ester containing specified contents by percentage of conjugate acid and aromatic resin acid. The resin varnish obtained has very few decomposition components and nonuniformly gelled components, so it also is suitable for screen printing ink and letterpress printing ink, in addition to offset printing ink.Type: ApplicationFiled: May 15, 2003Publication date: December 25, 2003Applicant: Harima Chemicals, Inc.Inventors: Keiji Sasakura, Hiroshi Toyoda
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Publication number: 20030159761Abstract: According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.Type: ApplicationFiled: January 15, 2003Publication date: August 28, 2003Applicant: HARIMA CHEMICALS, INC.Inventors: Kazuki Ikeda, Hiroshi Tanaka, Hisao Irie, Keigo Obata, Takao Takeuchi, Naoya Inoue
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Patent number: 6234381Abstract: The present invention is a water-based binder used when manufacturing aluminum brazed products such as engine radiators, condensers for car air conditioners, and the like. The water-based binder is obtained by saponifying an ester methacrylate polymer that has an acid value and a glass transition temperature within specified ranges. In the presence of an alcohol that is water soluble and volatile and has a flash point higher than a specified temperature, the brazing composition, in which this binder and flux and the like are mixed, does not have the risk of catching on fire or exploding and also has excellent wettability and can be uniformly coated onto an aluminum material.Type: GrantFiled: November 17, 1999Date of Patent: May 22, 2001Assignees: Denso Corporation, Harima Chemicals, Inc.Inventors: Yoshiharu Hasegawa, Shoei Teshima, Ichiro Taninaka, Hikaru Shibata
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Patent number: 5986017Abstract: A toner binder comprising a crosslinked polyester resin obtained by using 0.1 to 3 mol % of trimellitic acid and 0.1 to 5 mol % of an epi-bis type epoxy in combination as crosslinking components, said binder having a number average molecular weight (Mn) in the chromatogram determined by a gel permeation chromatography on the non-gel portion of the polyester resin, of 2,000 to 4,000, a ratio (Mw/Mn) of the weight average molecular weight to the number average molecular weight of 10 to 25 and a (percent gel) of the residue unsoluble in tetrahydrofuran solvent of 1 wt % or less. A toner composition for flash fixing comprising the above-described binder as an essential constituent component. The toner and the toner binder exhibit good fixability and void resistance upon flash fixing and produce little fixing odor.Type: GrantFiled: September 14, 1995Date of Patent: November 16, 1999Assignees: Fujitsu Limited, Harima Chemicals, Inc.Inventors: Yoshimichi Katagiri, Hitoshi Kusaba, Yasuharu Takeuchi, Yuzo Horikoshi, Makoto Koshi, Hiroichi Ishihara, Yoshiaki Ishibashi, Yoshihiro Makuta, Jun Saito, Hiroaki Naito
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Patent number: 5907007Abstract: A non-washing soldering flux which is capable of minimizing corrosion and insulation defects due to precipitation of metal salts and cracking of the base resin is disclosed. The flux includes an activator including a dibasic acid with a molecular weight of 250 or less, and a monobasic acid with a molecular weight of from 150 to 300 and/or a dibasic acid with a molecular weight of from 300 to 600. The dibasic acid of molecular weight 250 or less in the flux exhibits sufficient activity, thus ensuring satisfactory solderability. The monobasic acid of molecular weight from 150 to 300 and the dibasic acid of molecular weight from 300 to 600 which are combined therewith promote the activity while also uniformly dispersing the metal salt of the low molecular weight dibasic acid in the flux residue, allowing it to be enveloped by the hydrophobic base resin. For greater cracking resistance, the flux includes at least an acrylic resin of molecular weight 10,000 or less and an activator.Type: GrantFiled: March 18, 1997Date of Patent: May 25, 1999Assignees: Denso Corporation, Harima Chemicals, Inc.Inventors: Naoki Ito, Masanori Takemoto, Masami Aihara, Tatsushi Onishi
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Patent number: 5824722Abstract: The present invention provides a stabilizer comprising a substituted cyclohexene compound of a hindered piperidine type wherein the 1- and 2-positions on a cyclohexene ring are doubly bonded, a carbon atom situated at the 4-position and/or the 5-position of the cyclohexene ring contains a substituent having a C.dbd.O group at its alpha-position, at least one carbon atom of the cyclohexene ring located adjacent to said carbon atom having the C.dbd.O group has a hydrogen atom as a substituent, and at least one group containing a 2,2,6,6-tetramethyl-4-piperidyl group attached to the 3-, 4-, 5- or 6-position of the cyclohexene ring; and/or other substituted cyclohexene compound of a hindered piperidine and/or a compound of a hindered piperidine. The stabilizers of the present invention can exhibit improved properties in light stability and in bleed out resistance even without a phenol type antioxidant.Type: GrantFiled: February 27, 1997Date of Patent: October 20, 1998Assignees: Mitsubishi Chemical Corporation, Harima Chemicals, Inc.Inventors: Akiyoshi Ohnishi, Machiko Mekada, Noriaki Hata, Hiroyuki Suzuki, Hiroyuki Morikawa
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Patent number: 5780399Abstract: An oil-soluble polyester having a weight average molecular weight of 10,000 to 1 000,000, which is a polycondensate prepared by polycondensing the following ingredients (A), (B) and (C):(A) a divalent higher carboxylic acid ingredient,(B) a divalent alcohol ingredient comprising a glycol represented by the following formula:HO--CH.sub.2 --CR.sup.1 R.sup.2 --CH.sub.2 --OHwherein R.sup.1 and R.sup.2 represent a alkyl group, and the sum of carbon numbers in R.sup.1 and R.sup.2 is at least three, and(C) 0.1 to 15% by mole, based on the total of ingredients (A) and (B), of at least one multi-valent ingredient selected from a carboxylic acid with a valency of at least three and an alcohol with a valency of at least three. This oil-soluble polyester is useful as an additive for a lubricating oil.Type: GrantFiled: February 12, 1996Date of Patent: July 14, 1998Assignees: Nippon Zeon Co., Ltd., Harima Chemicals, Inc., Nippon Oil Company, Ltd.Inventors: Yoshihide Ishikawa, Shinsuke Hasegawa, Michio Miyamoto, Shizuo Kitahara, Yutaka Shikatani, Jinichi Igarashi
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Patent number: 5723417Abstract: An oil-soluble polyester having a weight average molecular weight of 10,000 to 1,000,000, which is a polycondensate prepared by polycondensing the following ingredients (A) and (B): (A) a dicarboxylic acid ingredient, and (B) a diol ingredient comprising (i) a hindered glycol represented by the following formula: HO--CH.sub.2 --CR.sup.1 R.sup.2 --CH.sub.2 --OH wherein R.sup.1 and R.sup.2 independently represent a linear or branched alkyl group, and (ii) an alkylene glycol having at least 4 carbon atoms in the main chain. This oil-soluble polyester is useful as an additive for a lubricating oil.Type: GrantFiled: February 12, 1996Date of Patent: March 3, 1998Assignees: Nippon Zeon Co., Ltd., Harima Chemicals, Inc., Nippon Oil Company, Ltd.Inventors: Shizuo Kitahara, Yutaka Shikatani, Junichi Igarashi, Yoshihide Ishikawa, Shinsuke Hasegawa, Michio Miyamoto
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Patent number: 5601228Abstract: The invention provides a solder-precipitating composition containing Sn-Pb alloy powder and an organic acid salt of Pb as essential components, and capable of precipitating solder as a result of substitution between Sn contained in the Sn-Pb alloy powder and Pb contained in the organic acid salt of Pb. Further, the invention provides a mounting method including the steps of supplying a conductor on a board with a solder-precipitating composition which contains Sn-Pb alloy powder and an organic acid salt of Pb as essential components, heating the solder-precipitating composition supplied on the conductor, to precipitate solder on the conductor and pre-coat the conductor with solder, as a result of substitution reaction between Sn in the Sn-Pb alloy powder and Pb ions in the organic acid salt of Pb, mounting a device on the solder pre-coated conductor, and melting the solder layer to securely mount the device on the conductor.Type: GrantFiled: August 2, 1995Date of Patent: February 11, 1997Assignees: The Furukawa Electric Co., Ltd., Harima Chemicals, Inc.Inventors: Takao Fukunaga, Kazuhito Higasa, Hirokazu Shiroishi, Seishi Kumamoto, Takahiro Fujiwara, Noriko Katayama