Abstract: Disclosed is a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, and a prepreg, a laminate, and a wiring board formed using the resin composition. The resin composition comprises an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.

Abstract: Provided is a friction material composition comprising: a binder; a fibrous base material; an abrasive material; an inorganic filler; and an organic filler, wherein the friction material composition further comprises: at least one selected from the group consisting of zinc, a cellulose fiber as the fibrous base materials and a flame retardant fiber as the fibrous base materials; an iron-based fiber as the fibrous base material in an specified amount; and an inorganic abrasive material having a Mohs hardness of 8 or higher and a particle size of 1 ?m or larger as the abrasive material in an amount of 1 wt % or less.

Abstract: A wireless transmission system includes a wireless HDMI transmitter and a wireless HDMI receiver. The wireless HDMI transmitter includes a carrier oscillator provided for each channel of an HDMI transmission path to output a carrier signal in a millimeter band, an OOK modulator provided for each carrier oscillator to perform on-off keying modulation on a carrier signal outputted by its corresponding carrier oscillator, and an input circuit provided for each channel of the HDMI transmission path to input a digital signal outputted by a source device to the OOK modulator. Radio signals have different planes of polarization from their adjacent channels.

Abstract: Disclosed is a suspended particle device having a higher response speed of particles upon shutdown of the device. The suspended particle device includes a first substrate; a first electrode arranged on a surface of the first substrate; a second substrate; a second electrode arranged on a surface of the second substrate; and a suspension arranged between the first substrate and the second substrate, in which the suspension includes particles and a disperse medium, the particles are dispersed in the disperse medium, an orientation of the particles is controlled by an alternate-current voltage to be applied between the first electrode and the second electrode, and “a” which represents a frequency of an alternate-current voltage in a driving period is greater than “b” which represents a frequency of an alternate-current voltage in a shutdown period.

Abstract: A method of amplifying a nucleic acid includes combining a first linear primer with a polymerase and a circular probe. The circular probe contains at least one antisense sequence to a second nucleic acid sequence and at least one antisense sequence to the first linear primer. The method also includes producing at least one repeat of an antisense copy of the circular probe by rolling circle amplification. The antisense copy contains at least the second nucleic acid sequence. The method further includes generating more than one second linear primers from each copy of the second nucleic acid sequence; and hybridizing the second linear primers to more than one of the circular probes. A ribbon probe includes a circular probe and a lock probe. The lock probe contains at least a cleavable linker, and the circular probe and the lock probe are unable to dissociate without cleaving the cleavable linker.

Abstract: Band electrode arrays, methods of manufacturing, and a method of using are disclosed. The arrays have individually addressable band electrodes such that diffusion layers of the band electrodes overlap. An exemplary method of manufacturing may comprise: a first insulating layer is disposed on a substrate; a first band electrode is disposed on the first insulating layer; a second insulating layer is disposed on the first insulating layer and completely covers the first band electrode; a second band electrode is disposed on the second insulating layer; a third insulating layer is disposed on the second insulating layer and completely covers the second band electrode; the first and second band electrodes are electrically insulated from each other and individually addressable; cross-sectional surfaces of the first and second band electrodes are exposed on the test surface; and these exposed cross-sectional surfaces substantially overlap each other in a direction perpendicular to the substrate.

Abstract: A polishing agent for copper polishing, comprising (A) an inorganic acid with divalent or greater valence, (B) an amino acid, (C) a protective film-forming agent, (D) an abrasive, (E) an oxidizing agent and (F) water, wherein the content of the component (A) is at least 0.08 mol/kg, the content of the component (B) is at least 0.20 mol/kg, the content of the component (C) is at least 0.02 mol/kg, and either or both of the following conditions (i) and (ii) are satisfied. (i): The proportion of the content of the component (A) with respect to the content of the component (C) is 2.00 or greater. (ii): It further comprises (G) at least one kind selected from among organic acids and their acid anhydrides.

Abstract: A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

Abstract: In a configuration to join thermoelectric elements with an electrode in a thermoelectric module, reduction in junction reliability between the thermoelectric elements and the electrode is suppressed in a high-temperature environment and in an environment in which vibration and shock are imposed as load, to efficiently transmit the outer-circumferential temperature to the thermoelectric elements. In a thermoelectric module in which a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric element are alternately arranged by aligning the surfaces thereof on the high-temperature side and the surfaces thereof on the low-temperature side, to electrically connect the thermoelectric elements in series to each other; the p-type thermoelectric elements and the n-type thermoelectric element are joined via an intermediate layer with a deformable stress relaxation electrode, to thereby absorb stress taking place during the module assembling process and the module operation by the electrode.

Abstract: A polishing agent for copper polishing, comprising (A) an inorganic acid with divalent or greater valence, (B) an amino acid, (C) a protective film-forming agent, (D) an abrasive, (E) an oxidizing agent and (F) water, wherein the content of the component (A) is at least 0.08 mol/kg, the content of the component (B) is at least 0.20 mol/kg, the content of the component (C) is at least 0.02 mol/kg, and either or both of the following conditions (i) and (ii) are satisfied. (i): The proportion of the content of the component (A) with respect to the content of the component (C) is 2.00 or greater. (ii): It further comprises (G) at least one kind selected from among organic acids and their acid anhydrides.

Abstract: The present invention relates to a metal polishing slurry containing abrasive grains, a metal-oxide-dissolving agent, and water, wherein the abrasive grains contain two or more abrasive grain species different from each other in average secondary particle diameter. Using the metal polishing slurry of the present invention, a metal polishing slurry can be obtained which gives a large polishing rate of an interlayer dielectric layer, and is high in the flatness of the polished surface. This metal polishing slurry can provide suitable method for a semiconductor device which is excellent in being made finer and thinner and in dimension precision and in electric characteristics, is high in reliability, and can attain a decrease in costs.

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract: The present invention is directed to polymeric materials including a copolymer of at least a first and second monomer that have desirable electrical and optical properties, such as a low band gap and near infrared (NIR) absorption, respectively. More specifically, the present invention is directed to polymeric materials with charge neutrality that display increased solubility in aqueous media while retaining their electrical and optical properties. The polymeric materials in accordance with the present invention can be modified with any desired functional group to tailor the polymer materials for a specific application. Also described are methods of making the polymeric materials in accordance with the present invention.

Abstract: A single crystal heat treatment method having a step of heating a single crystal of a specific cerium-doped silicate compound in an oxygen-poor atmosphere at a temperature T1 (units: ° C.) that satisfies the conditions represented by formula (3) below 800?T1<(Tm1?550)??(3) (wherein Tm1 (units: ° C.) represents the melting point of the single crystal).

Abstract: An optical connecting structure has an optical fiber, a pressing member having a circular outer cross section, and an optical member, wherein the optical member has an optical element, an optical fiber stopper structure, and an optical fiber holding groove, wherein the optical fiber stopper structure is positioned between the optical element and the optical fiber holding groove, wherein the optical fiber is inserted along the optical fiber holding groove so as to contact with the optical fiber stopper structure, and wherein the pressing member is arranged on the optical fiber holding groove mutually perpendicular, the pressing member presses the upper surface of the optical fiber to a direction of a bottom of the optical fiber holding groove, and the optical fiber and the optical element are thereby optically connected.

Abstract: A polishing slurry including an oxidant, a metal oxide dissolver, a metal inhibitor and water and having a pH from 2 to 5. The polishing slurry having a high metal-polishing rate, reducing etching rate and polishing friction, results in the production, with high productivity, of semiconductor devices reduced in dishing and erosion in metal wiring.

Abstract: A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower.

Abstract: A method including preparing a polishing slurry for CMP for polishing at least a conductor layer and a conductive substance layer in contact with the conductor layer, wherein the absolute value of the potential difference between the conductive substance and the conductor at 50±5° C. is 0.25 V or less in the polishing slurry when a positive electrode and a negative electrode of a potentiometer are connected to the conductive substance and the conductor, respectively. The polishing slurry for CMP preferably comprises at least one compound selected from heterocyclic compounds containing any one of hydroxyl group, carbonyl group, carboxyl group, amino group, amide group and sulfinyl group, and containing at least one of nitrogen and sulfur atoms.

Abstract: Provided are a polishing slurry for metal films and a polishing method which restrain the generation of erosion and seams, and makes the flatness of a surface polished therewith or thereby high. The slurry and the method are a polishing slurry, for metal films, comprising abrasive grains, a methacrylic acid based polymer and water, and a polishing method using the slurry, respectively.