Patents Assigned to HITACHI HIGH-TECH CORPORATION
  • Patent number: 11898968
    Abstract: Disclosed is a solution for quickly specifying an optical condition of a wafer to be inspected, and in particular, accelerating optical condition setting after obtaining a customer wafer.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: February 13, 2024
    Assignee: Hitachi High-Tech Corporation
    Inventors: Taichi Maeda, Yuko Sasaki
  • Patent number: 11898974
    Abstract: A charged particle beam device includes a detector 109 converting a photon emitted by a scintillator into an electric signal and a signal processing unit 110 processing the electric signal from the detector 109. The signal processing unit 110 detects a peak position of the electric signal, steepness of a rising section associated with the peak position, and steepness of a falling section associated with the peak position and classifies the peak position based on the steepness of the rising section and the steepness of the falling section.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: February 13, 2024
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Hiroshi Oinuma, Wen Li, Masashi Wada
  • Patent number: 11901192
    Abstract: To provide an etching processing method and an etching processing apparatus which allow an aluminum oxide film to be etched with high accuracy and with a high selectivity to each of a silicon oxide film and a silicon nitride film, the etching processing method includes the step of placing, in a processing chamber, a wafer having the aluminum oxide film disposed on an upper surface thereof, maintaining the wafer at a temperature of ?20° C. or less, and supplying vapor of hydrogen fluoride from a plurality of through holes in a plate-like member disposed above the upper surface of the wafer with a predetermined gap being provided therebetween only for a predetermined period to etch the aluminum oxide film.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: February 13, 2024
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Hiroto Otake, Takashi Hattori
  • Patent number: 11899437
    Abstract: The present disclosure proposes a diagnostic system capable of properly identifying the cause of even an error for which multiple factors or multiple compound factors may be accountable. The diagnostic system according to the present disclosure is provided with a learning device for learning at least one of a recipe defining operations of an inspection device, log data describing states of the device, or specimen data describing characteristics of a specimen in association with error types of the device, and estimates the cause of the error by using the learning device (refer to FIG. 4).
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: February 13, 2024
    Assignee: Hitachi High-Tech Corporation
    Inventors: Fumihiro Sasajima, Masami Takano, Kazuhiro Ueda, Masayoshi Ishikawa, Yasuhiro Yoshida
  • Publication number: 20240047179
    Abstract: A plasma treatment apparatus includes a treatment chamber 2 and a gas supply device 30 for supplying a treatment gas into the treatment chamber 2. The gas supply device 30 includes: a mass flow controller box 40 having an intake port 41 and an exhaust port 42; a plurality of pipes 43 to each of which a mass flow controller (43a) is attached; and a plurality of pipes 52 which are connected to the pipes 43 in the mass flow controller box 40 and connected to a plurality of pipes 54 as supply sources of the treatment gas by a plurality of joints 53 outside the mass flow controller box. At least one of the joints 53 is covered by a pipe cover 60 so that the joint 53 is hermetically sealed. The inside of the pipe cover 60 and the inside of the mass flow controller box 40 are communicated by a communicating member (circumferential pipe 61, tube 62).
    Type: Application
    Filed: May 27, 2021
    Publication date: February 8, 2024
    Applicant: Hitachi High-Tech Corporation
    Inventors: Kentaro Kiyosue, Kohei Sato, Ryoichi Isomura, Koji Nagai, Tsutomu Matsuyoshi
  • Patent number: 11894213
    Abstract: An ion milling device capable of high-speed milling is realized even for a specimen containing a material having an imide bond. Therefore, the ion milling device includes: a vacuum chamber 6 configured to hold a specimen 3 in a vacuum atmosphere; an ion gun 1 configured to irradiate the specimen with a non-focused ion beam 2; a vaporization container 17 configured to store a mixed solution 13 of a water-soluble ionic liquid and water; and nozzles 11, 12 configured to supply water vapor obtained by vaporizing the mixed solution to a vicinity of a surface of the specimen processed by the ion beam.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: February 6, 2024
    Assignee: Hitachi High-Tech Corporation
    Inventors: Asako Kaneko, Hisayuki Takasu
  • Patent number: 11892706
    Abstract: An observation device captures images at focal positions inside a sample container with an optical system that includes an objective lens; an objective lens actuator; an irradiation unit; a reflection light intensity detector; a focus controller that positions the focal point of the objective lens on a reflection surface imparting a peak in the reflected light intensity; and a counting unit. The focus control unit drives the objective lens actuator and positions the focal point on a reflection surface when a peak is detected in the reflected light intensity; and the counting unit counts the reflection surface when the focus control unit has positioned the focal point on the reflection surface. The computation unit determines whether or not the focal point is positioned at the focal position, and causes the optical system to capture images if the focal point is positioned at the focal position.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: February 6, 2024
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Akira Masuya, Tadao Yabuhara, Hiroko Fujita
  • Patent number: 11894211
    Abstract: The invention provides an electron beam apparatus that reduces a time required for an electron gun chamber to which a sputter ion pump and a non-evaporable getter pump are connected to reach an extreme high vacuum state. The electron beam apparatus includes an electron gun configured to emit an electron beam and the electron gun chamber to which the sputter ion pump and the non-evaporable getter pump are connected. The electron beam apparatus further includes a gas supply unit configured to supply at least one of hydrogen, oxygen, carbon monoxide, and carbon dioxide to the electron gun chamber.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: February 6, 2024
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Erina Kawamoto, Soichiro Matsunaga, Souichi Katagiri, Keigo Kasuya, Takashi Doi, Tetsuya Sawahata, Minoru Yamazaki
  • Publication number: 20240033741
    Abstract: The present invention provides a thermal cycler capable of rapidly and efficiently heating and cooling a reaction liquid. The thermal cycler according to the present invention comprises: a temperature control block where a reaction vessel can be installed, a thermoelectric conversion unit capable of heating and cooling, a temperature sensor that measures the temperature of the temperature control block, an insulating substrate that is in contact at one surface with the thermoelectric conversion unit, and a heat radiating unit that is provided on the other surface of the insulating substrate and serves for discharging the heat of the thermoelectric conversion unit to the outside, wherein the temperature control block is heated and cooled by controlling a current or voltage supplied to the thermoelectric conversion unit on the basis of the temperature of the temperature adjustment block measured by the temperature sensor.
    Type: Application
    Filed: December 18, 2020
    Publication date: February 1, 2024
    Applicant: Hitachi High-Tech Corporation
    Inventors: Nobuyuki ISOSHIMA, Tatsuya KOBARI, Masashi SHIBAHARA, Toshiki YAMAGATA, Yoko MAKINO, Wataru SATOH
  • Publication number: 20240036052
    Abstract: The present invention provides a cancer test method and a cancer test system for evaluating cancer in a subject. Specifically, the present invention provides a method for testing cancer in a subject, including: preparing a database that has stored a marker panel on which information of multiple cancer markers with respect to multiple healthy subjects and cancer patients is registered, the database including discrimination information that classifies a measured value of each cancer marker, into any of three groups: within the reference range, higher than the reference range, and lower than the reference range; analyzing, with respect to measured values of one or more cancer markers of the subject, and evaluating cancer in the subject on the basis of a result of the analysis.
    Type: Application
    Filed: September 9, 2020
    Publication date: February 1, 2024
    Applicant: HITACHI HIGH-TECH CORPORATION
    Inventors: Minoru Sakairi, Mayumi Abe, Takashi Ishigaki
  • Patent number: 11885824
    Abstract: An automatic analyzer keeps the inside of a reagent cooler that stores a reagent vessel clean. The automatic analyzer includes: a reagent cooler that stores a reagent vessel containing a reagent to be reacted with a sample at a predetermined temperature. A reagent vessel replacement unit includes an opening configured to put the reagent vessel into and take the regent vessel out of the reagent cooler, wherein the opening is opened and closed to replace the reagent vessel. A positive pressure unit positively pressurizes the inside of the reagent cooler with respect to a periphery of the reagent cooler when the opening is opened.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: January 30, 2024
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Takahiro Kumagai, Kazuhiro Noda, Nobuya Fukuda
  • Patent number: 11887814
    Abstract: Provided is a plasma processing method capable of improving an etching selectivity of a material to be etched with respect to a mask material and reducing a roughness of a side wall of a mask pattern. The plasma processing method of selectively depositing a deposition film on the mask material with respect to the material to be etched includes controlling an etching parameter so that an incubation time of the mask material is shorter than an incubation time of the material to be etched.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: January 30, 2024
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Mamoru Yakushiji, Kenichi Kuwahara, Masaaki Taniyama
  • Patent number: 11887780
    Abstract: The present invention comprises: an object to be conveyed that has at least one permanent magnet 10; a magnetic pole 25 that has a core 22 comprising a second magnetic body and a winding 21 wound around the outer periphery of the core 22; a drive circuit 50 for supplying a current to the winding 21 of the magnetic pole 25; a current detection unit 30 for detecting the value of the current flowing through the winding 21; and a computation unit 40 for estimating the position of the permanent magnet 10 on the basis of the current value detected by the current detection unit 30 and controlling the value of the current supplied from the drive circuit 50 to the winding 21 on the basis of information about the estimated position of the permanent magnet 10.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: January 30, 2024
    Assignee: Hitachi High-Tech Corporation
    Inventors: Yasuaki Aoyama, Hiroyuki Kobayashi, Satoru Kaneko, Takeshi Tamakoshi, Ryosuke Hoshi, Katsuhiro Kambara, Hiroshi Watanabe, Kuniaki Onizawa
  • Patent number: 11879902
    Abstract: An object of the present invention is to provide a test method capable of efficiently performing a step of evaluating a surface state of a dispensing probe provided in a dispensing apparatus. In the test method according to the present invention, a first solution in which a coloring matter is dissolved is dispensed to a first container in advance by a first dispensing probe, a second solution in which a coloring matter is not dissolved is dispensed to a second container in advance by the first dispensing probe and then the first solution and the second solution are respectively sucked and discharged by a second dispensing probe. After that, a surface state of the second dispensing probe is evaluated by acquiring an amount of the coloring matter collected by the second solution (see FIG. 2).
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: January 23, 2024
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Akihiro Nojima, Takamichi Mori, Isao Yamazaki, Tetsuji Kawahara, Youichi Aruga
  • Publication number: 20240017263
    Abstract: Provided is an automated analysis device with which sufficient reaction process data can be acquired irrespective of the scale of the device, and with which it is possible to ensure freedom of the device configuration. An automated analysis device 100 is provided with: a reaction disk 1 which circumferentially accommodates a plurality of reaction vessels 2; a specimen dispensing mechanism 11 which dispenses a specimen into the reaction vessels 2; a reagent dispensing mechanism 7 which dispenses a reagent into the reaction vessels 2; a measuring unit 4 which measures a reaction process of a mixture of the specimen and the reagent in the reaction vessels 2; and a cleaning mechanism 3 which cleans the reaction vessels 2 after measurement.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 18, 2024
    Applicant: Hitachi High-Tech Corporation
    Inventors: Akihiro YASUI, Akihisa MAKINO, Masashi AKUTSU, Hiroyuki MISHIMA, Yoshihiro SUZUKI
  • Publication number: 20240019407
    Abstract: A method of controlling a liquid chromatograph that estimates the maximum value of the pressure reached during measurement before actually measuring a sample. The method includes a pump having a gradient function that feeds liquid while changing the composition of a plurality of eluents, according to gradient liquid feeding conditions, a sample filling unit for filling a sample, a separation column, an analysis flow channel connecting the pump to the separation column, and a pressure sensor which detects a pressure within the analysis flow channel during liquid feeding by the pump. A maximum pressure presumed during measurement is calculated based on an initial pressure as a pressure within the analysis flow channel when the pump starts feeding liquid and the gradient liquid feeding conditions and that when the maximum pressure presumed is determined to be a predetermined upper pressure limit, the sample filling is not performed.
    Type: Application
    Filed: December 7, 2021
    Publication date: January 18, 2024
    Applicant: Hitachi High-Tech Corporation
    Inventor: Shinya ITO
  • Patent number: 11875978
    Abstract: A plasma processing apparatus 1 that performs, on a wafer 16 in which a multilayer film in which an insulating film and a film to be processed containing a metal are alternately laminated is formed on a substrate, plasma etching of the film to be processed, includes: a processing chamber 10 which is disposed inside a vacuum container; a sample stage 14 which is disposed inside the processing chamber and on which the wafer is placed; a detection unit 28 which detects reflected light obtained by the wafer reflecting light emitted to the wafer; a control unit 40 which controls plasma processing on the wafer; and an end point determination unit 30 which determines an etching end point of the film to be processed based on a change in an amplitude of vibration in a wavelength direction of a light spectrum of the reflected light, and the control unit receives determination of the end point made by the end point determination unit and stops the plasma processing on the wafer.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: January 16, 2024
    Assignee: Hitachi High-Tech Corporation
    Inventors: Tsubasa Okamoto, Tatehito Usui, Miyako Matsui, Shigeru Nakamoto, Naohiro Kawamoto, Atsushi Sekiguchi
  • Publication number: 20240013873
    Abstract: The present disclosure relates to a computer implemented method of managing sample processing priorities in a diagnostic laboratory comprising at least one sample processing device connected to a host system. The method comprises generating a communication message between the host system and the at least one sample processing device related to a sample processing order received in association with a sample, the message comprising one of at least two priority identifiers (R, S) indicative of respective sample processing priorities from lower priority to higher priority according to the received sample processing order. The method further comprises identifying the sample by the at least one sample processing device and processing the sample by the at least one sample processing device according to the sample processing priority (S, R) in the message.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 11, 2024
    Applicants: Roche Diagnostics Operations, Inc., Hitachi High-Tech Corporation
    Inventors: Daniel Laubert, Rita Sachse, Dennis Aldorf, Werner Rapp, Ralf Herzog, Kenichi Yagi, Satoru Chida
  • Patent number: 11869745
    Abstract: An object of the invention is to provide a charged particle beam device capable of increasing the contrast of an observation image of a sample as much as possible in accordance with light absorption characteristics that change for each optical parameter. The charged particle beam device according to the invention changes an optical parameter such as a polarization plane of light emitted to the sample, and generates the observation image having a contrast corresponding to the changed optical parameter. An optical parameter that maximizes a light absorption coefficient of the sample is specified according to a feature amount of a shape pattern of the sample (refer to FIG. 5).
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: January 9, 2024
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Minami Shouji, Natsuki Tsuno, Hiroya Ohta, Daisuke Bizen
  • Publication number: 20240005682
    Abstract: Representative features which are representative features for deciding the types or states of objects are extracted, the types or states of the objects are identified on the basis of the representative features to classify the objects, and the object classification results and the representative features are output in association with an image.
    Type: Application
    Filed: November 12, 2021
    Publication date: January 4, 2024
    Applicant: HITACHI HIGH-TECH CORPORATION
    Inventors: Yasuki KAKISHITA, Hideharu HATTORI, Taku SAKAZUME