Abstract: A control unit determines whether or not confirmation of a type of a tape processing unit is necessary, and performs identification processing of the type of the tape processing unit when confirmation of the type of the tape processing unit is determined as necessary. Then, this identification processing of the type is performed and the control unit determines whether or not an electronic component handleable by this tape processing unit coincides with an electronic component of a component arrangement number in a feeder base, to perform control for performing an extraction operation for an electronic component in a storage tape with an adsorption nozzle when the electronic component is determined as coinciding.

Abstract: A terminal communication apparatus has a terminal communication control portion rendering an immediate communication control portion sequentially transmitting serial data to another terminal communication apparatus bitwise when receiving a packet as bitwise serial data and a normal communication control portion performing processing on the packet after accumulating the serial data until the serial data reaches a packet length when receiving the bitwise serial data switchable, performing processing with the immediate communication control portion in a case of receiving a time adjustment packet containing time adjustment data posting a timing of synchronization in the other terminal communication apparatus and performing processing with the normal communication control portion in a case of receiving a packet other than the time adjustment packet. Thus, synchronization of control object devices can be enabled without previously investigating communication delay times.

Abstract: A component supply device loaded with a component supply tape for exposing and supplying an electronic component from the component supply tape with respect to a component mounting device mounting the electronic component on a substrate includes a replenishing unit performing replenishment of a new component supply tape when a preceding component supply tape is exhausted and a sensor senses exhaustion of the preceding component supply tape while a confluent portion where a channel for the preceding component supply tape and a channel for the new component supply tape join with each other is formed between the sensor and the replenishing unit. A buckling prevention mechanism moves in response to an operation of the preceding component supply tape or the new component supply tape for preventing buckling when the new component supply tape is transported to the component supply device by the replenishing unit is arranged on the confluent portion.

Abstract: A feeder and a feeder control method, as well as an electronic component device, reliably engaging a supply tape in a loading operation even if there is an accumulated pitch error between sprocket holes. Third, second and first sprockets are arranged successively from an insertion port. The sprocket hole on a forward end portion of the inserted supply tape is fitted with a third tooth of the third sprocket in the loading operation. The supply tape is rotated by rotation of the third sprocket until fitting with a second tooth of the second sprocket, and the rotation of the third sprocket is stopped after the second tooth fits with the sprocket hole on the forward end portion.

Abstract: In recent years, frames have gotten larger in size and thinner, and warping of the frames has posed a problem. If a warp of a frame is large, there is a high possibility that fetching the frame may fail. If fetching the frame fails, that is, if the frame cannot be fetched, the lead time of mounting gets longer. Further, the frame that cannot be fetched has to be manually removed by an operator. Therefore, a man-hour increases. According to the present invention, before a loader feeder fetches a frame from a frame magazine, a loader lifter is moved in a Y direction. Thereafter, the loader feeder fetches the frame from the frame magazine.

Abstract: For providing a die bonder, a bonding head device and a collet position adjusting method for enabling an automatic correction (adjustment) of errors, including height and inclination thereof, when exchanging a collet, with a simple structure thereof, in the bonding head device, having a holder 41h for guiding a vacuum for suction in an inside thereof, a shank 41s and a collet 41c, detachably attached at a tip of the holder, for adjusting the position of the collet after exchange of the collet, a reverse-side surface of that collet is photographed, before exchanging it, by a reverse-side surface photographing camera 42, which is disposed below the bonding head device, and after the exchange of the collet, the reverse-side surface of that collet exchanged, and then correction is made on positions of the collets, so that pictures photographed before/after the exchange thereof come to be coincident with.

Abstract: An object of the present invention is to provide a collet cleaning method and a die bonder using the same in which a collet can be cleaned without adding a new unit, and foreign substances with high adhesive power can be reliably removed without scattering the foreign substances. A die bonder includes a pickup device, a bonding head unit having a collet that absorbs dies from a wafer at the timing of lifting of the pickup device, and a control unit that controls the pickup device and the bonding head unit. The collet is moved to a position of a dicing tape at which no dies of the wafer held by a wafer ring exist to be brought into contact with the adhesive surface of the dicing tape, so that foreign substances attached to the tip end of the collet are removed.

Abstract: The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same. The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.

Abstract: With a die bonder or a bonding method, the die is adsorbed by the collet, the dicing tape to which the die is adsorbed is thrust up, the die adsorbed by the collet, and thrust up is peeled from the dicing tape, and the peeled die is bonded to the substrate. When the decrease in the air leak flow rate through the gap between the collet and the die upon the thrust up is smaller than the decrease in the normal peel by a predetermined amount, it is judged that a deflection occurs in the die.

Abstract: A die bonder comprises a storage unit which stores the image of the wafer taken by an imaging unit, a recognition pattern included the outline of a die formed on the wafer, and a recognition program, and a monitor-processing unit which gets the position on the wafer, of the die whose map data indicates normal, in the way that the die is matched with the recognition pattern by executing the recognition program, and that the center position of the die is gotten. Thus, the die bonder can recognize the position of the die without regard to the condition of dies on the wafer.

Abstract: The present invention provides a bonding device and a bonding method with a high operation ratio by solving the problems of conventional techniques. In the present invention, a collet holder grasping a used collet is inserted from a first opening portion with the upper face open; the used collet is engaged with first engagement portions provided at the first opening portion of a discarding unit; the used collet is removed from the collet holder to be discarded by lifting the collet holder; the collet holder is inserted from a second opening portion with the upper face open of a supplying unit; the uppermost unused collet among plural stacked unused collets is grasped; and the uppermost unused collet ejected from the first opening portion is attached to the collet holder.

Abstract: A horizontal axis drive mechanism includes a first linear motor including a first fixed section and a first movable section fixing a load section and moving the load section in the horizontal direction, a support body supporting the first fixed section, a first linear guide arranged between the support body and the first fixed section and moving the first fixed section, a rotation conversion type counter including a rotating body rotatably supported by the support body and a converting means converting movement of the first fixed section in the horizontal direction into rotation of the rotating body, and a control section controlling the position of the first movable section in the horizontal direction.

Abstract: A die bonding apparatus includes a work supply/transfer portion for transferring a substrate; a bonding portion for conducting bonding of a die on the substrate; a wafer supply portion for supplying a wafer having the die thereon; and a controller portion for controlling equipment, wherein the wafer supply portion has a push-up unit for pushing up a dicing tape from a lower part, for separating the die from the dicing tape, and the push-up unit has a suction opening portion, which is configured to suck the dicing tape with vacuum, a push-up portion, which is made of an elastic body, sealing a fluid or a power therein, and is configured to push up the dicing tape, a cylinder, which is configured to apply pressure to the push-up portion, and an air supply means for supplying an air for changing the pressure within the cylinder through control of the controller portion.

Abstract: RFID tags are attached to tools of a preform head, a bonding head, and a push-up unit, and information related to each tool such as a dimension of a processing-target die is stored into the RFID tags. When a tool is mounted, an operator inputs manufacturing conditions related to the tool. When information related to the tool read from the RFID tag by an RFID reader/writer and the manufacturing conditions related to the tool do not match each other, a message about wrong mounting of the tool is displayed on a monitor. Further, an operation history of the tool is written into the RFID tag by the RFID reader/writer when the production is completed. The operation history is read when the next production is started, and if the values of the operation history exceed predetermined numbers of times, a message is displayed on the monitor.

Abstract: An object of the present invention is to provide a pickup device that can securely peel a die or to provide a reliable die bonder or a pickup method using the pickup device. To achieve the object, the present invention is provided with a characteristic that when a die to be peeled out of plural dies (semiconductor chips) applied to a dicing film is thrust up and is peeled from the dicing film, the dicing film in a predetermined part in a circumference of the die is thrust up and a peeling starting point is formed, the dicing film in a part except the predetermined part is thrust up, and the die is peeled from the dicing film.

Abstract: A central communication unit 110 and a terminal communication unit 120 are provided with a priority order number storing unit 115 and fifo type storing units, and perform communication according to the priority order of data communication stored in the priority order number storing unit 115. At this time the priority order and the layout of respective devices of control objects are optimized and set through a software processing in a host computer according to the communication cycle and response performance required for the devices of control objects, thereby, the plurality of devices of control objects requiring different communication cycles and response performances can be connected on one network.

Abstract: The present invention provides a reliable die bonder that can accurately bond a die and a semiconductor manufacturing method. The present invention is provided with a bonding head that adsorbs a die from a wafer and bonds it to a substrate, a positioning mechanism that is provided with a first adjustment mechanism that positions a position of the die at predetermined accuracy, and positions the bonding head, a positioning controller that controls the positioning mechanism and a second adjustment mechanism that is provided to the bonding head, and adjusts a position of the die at higher accuracy than the first adjustment mechanism.

Abstract: A two-shaft drive mechanism includes a processing unit, a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit, a support body that fixes the first fixed portion, a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move, and a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body.

Abstract: The present invention provides die bonder and bonding method by which a bonding load from a high load to a low load is obtained or high-speed mounting is attained. In a die bonder or a bonding method in which a bonding head is ascended/descended by a first ascending/descending drive shaft unit, a die is picked up, the picked-up die is installed onto a workpiece, and after installed, a load is exerted on the die by the bonding head to bond the die to the workpiece, whether the load is higher/lower than a predetermined load is determined, and in bonding, when the load is higher than the predetermined load, the high load is exerted by the first ascending/descending drive shaft unit, and when the load is lower than the predetermined load, the low load is exerted by a second ascending/descending drive shaft unit.

Abstract: There is provided a motor control system and motor control method which can shorten settling time by restraining vibration and deviation relative to an advancing direction during operation. Moreover, according to the present invention, it is possible to cause a motor to be operated with an ideal track and, since it is possible to always monitor a present position, it is made easy to cause a plurality of axes to be synchronously operated. The motor control system is provided with a unit generating command waveforms from a jerk data which has significant effects on the vibration relative to the advancing direction, and a unit performing a real time real position control of regenerating future command waveforms according to a deviation amount, while always performing jerk-limit, whereby the vibration and the deviation relative to the advancing direction when the motor operates at high speed are restrained.