Patents Assigned to Hitachi High-Tech Instruments Co., Ltd.
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Patent number: 8099860Abstract: The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more than ?, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more than ?, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position.Type: GrantFiled: February 25, 2008Date of Patent: January 24, 2012Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Akio Watanabe, Takuya Imoto, Yoshiharu Fukushima
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Patent number: 8079137Abstract: An electronic component is mounted on a printed board by a first head and a second head collaboratively. The first head is prioritized to the second head for moving operations. The range which allows the second head to move is defined in consideration with all the positions where the electronic components held by the first head are to be mounted on the printed board such that no collision occurs between the first head in operation and the second head.Type: GrantFiled: March 24, 2009Date of Patent: December 20, 2011Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Kazuyoshi Ieizumi, Seiji Oonishi, Koiti Izuhara, Hisayoshi Kashitani
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Patent number: 8079138Abstract: In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head H1 or a mounting head H2. To prevent collision between the two mounting heads H1, H2, position information from a linear encoder E is fed back to not only the servo amplifier, but also the motion controller. Once determining that the two mounting heads H1, H2 collide, the motion controller applies brake to the mounting heads H1, H2 to avoid collision therebetween, regardless of the command from the host computer.Type: GrantFiled: March 24, 2009Date of Patent: December 20, 2011Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Hisayoshi Kashitani, Kazuyoshi Ieizumi
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Publication number: 20110072654Abstract: There is a need for providing an electronic component mounting apparatus, a component supply apparatus, and an electronic component mounting method capable of reducing inadvertent insertion of component supply tape and ensuring high reliability or capable of reducing wrong insertion of component supply tape, supplying new electronic component tape, and ensuring a high operation rate. Supply tape is inserted into an insertion entry of a component supply apparatus. An electronic component mounted on the supply tape is absorbed and is mounted on a printed board. Information about the electronic component mounted on the supply tape is read. Based on the read information, the component supply apparatus for inserting the supply tape is selected. The insertion entry is opened while it is closed when no supply tape is mounted.Type: ApplicationFiled: September 14, 2010Publication date: March 31, 2011Applicant: Hitachi High-Tech Instruments Co., LtdInventors: Kazuyoshi OYAMA, Tsutomu YANAGIDA, Yoshinao USUI
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Publication number: 20110030203Abstract: The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources.Type: ApplicationFiled: October 21, 2010Publication date: February 10, 2011Applicant: Hitachi High-Tech Instruments Co., Ltd.Inventors: Yutaka Mitsumochi, Yoshihiro Onoguchi, Masami Iizuka, Hiroomi Kobayashi, Kazuyoshi Oyama, Hisayoshi Kashitani, Koichi Izuhara
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Patent number: 7885723Abstract: Technology is provided for changing a mounting angle of a component to reduce the amount of relative displacement between a mounting head and a board. A component, for which a mounting angle can be changed, is specified based on information stored in a mounting data storage area and a component data storage area according to a predetermined component mounting order. A mounting time in a mounting path with the mounting angle of the specified component being changed is calculated for each mounting angle to specify the mounting path requiring the shortest mounting time.Type: GrantFiled: July 5, 2007Date of Patent: February 8, 2011Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Takafumi Chida, Attila Lengyel, Ken Igarashi, Haruhiko Yamaguchi, Manabu Okamoto, Koichi Izuhara
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Patent number: 7849588Abstract: An electronic component mounting apparatus includes a component feeding device that supplies an electronic component to a pickup position, a suction nozzle that picks up the electronic component supplied to the pickup position and mounts the picked up electronic component on a printed board, a height level detection device that measures height levels of the printed board positioned in a mounting position, a monitor graphically that displays a warping state of a sample printed board positioned in the mounting position based on height level measurements by the height level detection device on predetermined positions of the sample printed board, a setting device that sets measurement positions for actual mounting operations using the monitor, a converting device that converts the set measurement positions into coordinates on the printed board, and a memory that stores the converted coordinates of the set measurement position.Type: GrantFiled: April 25, 2008Date of Patent: December 14, 2010Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventor: Seiji Onishi
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Patent number: 7841073Abstract: The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources.Type: GrantFiled: April 25, 2008Date of Patent: November 30, 2010Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Yutaka Mitsumochi, Yoshihiro Onoguchi, Masami Iizuka, Hiroomi Kobayashi, Kazuyoshi Oyama, Hisayoshi Kashitani, Koichi Izuhara
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Publication number: 20100186223Abstract: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.Type: ApplicationFiled: March 19, 2010Publication date: July 29, 2010Applicant: Hitachi High-Tech Instruments Co., Ltd.Inventors: Akio Watanabe, Akihiro Kawai, Tetsuji Ono, Makio Kameda, Kazuyoshi Oyama, Kazuyoshi Ieizumi
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Patent number: 7721424Abstract: The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.Type: GrantFiled: January 27, 2006Date of Patent: May 25, 2010Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Akira Aoki, Makio Kameda, Yoshiharu Fukushima, Katsuyuki Seto, Hideaki Fukushima
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Patent number: 7712208Abstract: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.Type: GrantFiled: November 29, 2006Date of Patent: May 11, 2010Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Akio Watanabe, Akihiro Kawai, Tetsuji Ono, Makio Kameda, Kazuyoshi Oyama, Kazuyoshi Ieizumi
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Patent number: 7581310Abstract: The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.Type: GrantFiled: February 10, 2005Date of Patent: September 1, 2009Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Yoshiharu Fukushima, Takahiro Nagata, Katsuyuki Seto
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Publication number: 20090211086Abstract: The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.Type: ApplicationFiled: May 1, 2009Publication date: August 27, 2009Applicant: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.Inventors: Akira AOKI, Makio Kameda, Yoshiharu Fukushima, Katsuyuki Seto, Hideaki Fukushima
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Patent number: 7546678Abstract: This invention provides an electronic component mounting apparatus which can detects an electronic component held by a suction nozzle without fail after a mounting operation of electronic components on a printed board and perform various processes in a case where the electronic component is held by the suction nozzle.Type: GrantFiled: September 29, 2004Date of Patent: June 16, 2009Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Jun Asai, Akira Aoki, Shigeru Kuribara, Akihiro Kawai
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Patent number: 7533459Abstract: The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional shifting amount of an electronic component on a suction nozzle before the electronic component is mounted on a printed board is stored in a RAM each time the component is picked up at a component feeding unit until a pickup count number reaches a predetermined pickup number, and a CPU calculates an average of the positional shifting amounts. When the pickup count number reaches the predetermined pickup number, the CPU obtains a temporary coefficient by adding an initial value to a value obtained by multiplying a negative coefficient by the pickup count number, and calculates a feedback value by multiplying the temporary coefficient by the average.Type: GrantFiled: April 25, 2005Date of Patent: May 19, 2009Assignee: Hitachi High-Tech Instruments, Co., Ltd.Inventors: Yoshinori Kano, Takeshi Tomifuku, Yoshinori Okamoto, Yoshinao Usui, Ikuo Takemura
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Publication number: 20090119912Abstract: This invention is directed to prevention of reduction of a pickup rate of an electronic component when a component feeding unit is dismounted from a feeder base and mounted back thereon. A CPU sends a feeding command to a component feeding unit feeding an electronic component belonging to a first step number, and drives a servomotor and a drive motor of the feeding unit to perform a component feeding operation and so on. After then, when the CPU judges that the feeding unit is dismounted from the feeder base and mounted back thereon, the CPU drives a X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing to the image.Type: ApplicationFiled: January 6, 2009Publication date: May 14, 2009Applicant: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.Inventors: Akio Watanabe, Akihiro Kawai, Tetsuji Ono, Makio Kameda, Kazuyoshi Oyama
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Patent number: 7513389Abstract: The invention provides an electronic component feeding device which can stably feed electronic components, and an electronic component mounting apparatus having the electronic component feeding device. In a component feeding unit, an opening provided in a suppressor for picking electronic components is formed in a size corresponding to electronic components stored in a storage tape of 16 mm pitch so as to employ storage tapes of four types, i.e., 4 mm pitch, 8 mm pitch, 12 mm pitch, and 16 mm pitch. When the storage tape of 4 mm pitch is employed, a component pickup position of a suction nozzle and a feed stop position of a head electronic component have been conventionally in a center of the opening.Type: GrantFiled: March 23, 2004Date of Patent: April 7, 2009Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Takahiro Kitajima, Masahiro Sugita
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Patent number: 7503366Abstract: The invention provides a component feeding device where heat generation of a drive circuit is minimized and a printed board mounted with this drive circuit is miniaturized by forming an inexpensive structure using a single microcomputer and by energizing each of the servomotors only when necessary. In a component feeding unit of a dual lane type, a CPU in a microcomputer controls a start of driving of one of servomotors by energizing the servomotor through a drive circuit based on a component feeding signal for one lane outputted from a CPU of an electronic component mounting apparatus, and the CPU in the microcomputer controls one of the servomotors so that the servomotor is not energized when a component feeding signal for another lane is inputted before a predetermine time passes after a delay timer starts timekeeping when receiving a detection signal about rotation of the servomotor by a predetermined amount from an encoder detecting a rotation amount of the servomotor.Type: GrantFiled: February 10, 2005Date of Patent: March 17, 2009Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Kazuyoshi Oyama, Shigeru Kageyama, Kazuhiro Nagao, Tsutomu Yanagida
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Publication number: 20090031559Abstract: The invention is directed to manufacturing a divided board without wasting an electronic component by judging whether or not a shortage of electronic components of a given type to be mounted on divided board portions will occur during the mounting before mounting electronic components on the divided board. A printed board having three board portions is carried onto an XY table from a supply conveyer and positioned by positioning means. Then, for each of component feeding units, a CPU judges whether or not the number of remaining electronic components is smaller than the number of necessary electronic components for manufacturing all the divided board portions. When the number is judged smaller, for example, when the number of remaining electronic components of Fdr. No. “102” is judged to be two that is less than three, the CPU calculates that the number of manufacturable divided board portions is two.Type: ApplicationFiled: July 29, 2008Publication date: February 5, 2009Applicant: Hitachi High-Tech Instruments Co., Ltd.Inventors: Yoshihiro KAWABATA, Shigeo KATSUTA, Koichi IZUHARA, Akio WATANABE, Toshiaki WADA
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Publication number: 20080263858Abstract: The invention realizes setting of measurement positions suitable for a warping state of a printed board and an easy work of setting the measurement positions. A printed board as a measurement sample is positioned three-dimensionally in X, Y and vertical directions on a positioning portion, and then a backup base is lifted up to apply backup pins to the back surface of the board and support the board horizontally. Then, the warping state of the board is measured by a height level detection device, and based on the measurement result the CPU displays the board on a monitor three-dimensionally or by contour lines. Once an operator sets measurement positions on the screen, the CPU converts each of the set positions into coordinates on the board, writes the coordinates of the set positions in the top of mounting data, and stores the data in the RAM.Type: ApplicationFiled: April 25, 2008Publication date: October 30, 2008Applicant: Hitachi High-Tech Instruments Co., Ltd.Inventor: Seiji Onishi