Patents Assigned to Hitachi Techno
  • Patent number: 5415693
    Abstract: A paste applicator for drawing a paste pattern on a substrate has X- and Y-axis tables, on which the substrate is mounted, and a paste reservoir tube, a nozzle, a nozzle support and an optical displacement meter all fixed to a Z-axis table in opposite relation to the substrate. The paste reservoir tube and the nozzle are communicated with each other by a horizontal portion of the nozzle support. The horizontal portion is extended to a position below the optical displacement meter so that the nozzle is located close to a measuring point of the optical displacement meter. This arrangement places the nozzle as close as possible to the measuring point of the optical displacement meter, whereby an error between data measured by the optical displacement meter and an actual nozzle-to-substrate gap is substantially eliminated to assure that the paste is applied to the substrate in a desired pattern and configuration.
    Type: Grant
    Filed: September 29, 1993
    Date of Patent: May 16, 1995
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Tomio Yoneda, Shigeru Ishida, Haruo Mishina
  • Patent number: 5391987
    Abstract: A synchronous position correction system for a self-controlled linear synchronous motor train includes a position detector for detecting a positional relationship between a propulsion winding provided on a track and a field pole provided on the train which is formed by a plurality of cars. A synchronous operation of the formed train is performed at a phase which is obtained by correcting a phase detected by the position detector on the basis of a difference between an average phase of the whole of the formed train and the phase detected by the position detector, at a phase which is obtained by correcting the phase detected by the position detector on the basis of a difference between the phase of a speed electromotive force of the whole of the formed train and the phase detected by the position detector, or at a phase which is detected by the position detector in conjunction with the position of a central car of the formed train.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: February 21, 1995
    Assignees: Hitachi, Ltd., Hitachi Techno Engineering Co., Ltd.
    Inventors: Shigeyoshi Koike, Tetsuro Noguchi
  • Patent number: 5358166
    Abstract: A reflow soldering apparatus comprises a preheating chamber and a reflow chamber, both of which are furnished with a plurality of means for circulating a hot gas being composed of a cross flow blower, a divergent nozzle, a heater, a temperature sensor, a temperature controller, and a power regulator etc. The cross-flow blowers above a conveyer are arranged in a back to back manner and the blowers beneath the conveyer are arranged in a face to face manner, and soldering is performed by impinging the hot gas upon a circuit substrate being transferred by the conveyer.A reflow soldering apparatus having a small temperature fluctuation in the preheating chamber and the reflow chamber, high reliability in the soldering by maintaining a desired temperature profile, and preferable economy is provided.
    Type: Grant
    Filed: April 7, 1993
    Date of Patent: October 25, 1994
    Assignee: Hitachi Techno Engineering Co. Ltd.
    Inventors: Haruo Mishina, Masato Itagaki
  • Patent number: 5333774
    Abstract: A vapor reflow soldering apparatus includes a unit for delivering an article processed to a vapor generating tank for generating saturated vapor of thermal medium, for allowing the article to be to come in contact with the saturated vapor, and for heating and melting solder of the article. A thermal medium recovery system collects thermal medium which flows in the article delivery path. There is also provided an arrangement for leading at least one part of exhaust gas containing mist from a recovery tank of the thermal medium recovery system for collecting and cooling thermal medium to the outlet-side delivery path for delivering the article. The exhaust gas with mist is blown off to the article being processed. The gas containing the mist is obtained by cooling the thermal medium in vapor phase state. The blown off gas containing mist to increases the cooling speed for the soldered part and the bonding strength, and reduces the consumption of thermal medium.
    Type: Grant
    Filed: March 16, 1993
    Date of Patent: August 2, 1994
    Assignee: Hitachi Techno. Engineering Co., Ltd.
    Inventors: Haruo Mishina, Shinya Yamama
  • Patent number: 5332439
    Abstract: Disclosed is a screen printing apparatus for filling minute through-holes in a board with conductive paste or the like by screen printing. When screen printing is performed with this screen printing apparatus, the board is placed on a stage through the intermediation of a film which is supplied to the stage by means of adhesive pads. The adhesive pads are brought into contact with the uppermost one of a plurality of stacked films to catch it by adhesion and then transfer the film to a position above the stage. Films are caught one after another by adhesion.
    Type: Grant
    Filed: August 18, 1992
    Date of Patent: July 26, 1994
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Hiroyuki Watanabe, Tetsuji Machita
  • Patent number: 5301294
    Abstract: An address bus control system is provided of the type in which a controller including a central processing unit is connected through an address bus and a data bus to hardware modules which control equipment to be controlled. An address space defined by an address bus includes a discrimination space for discriminating the attribute of the hardware module and a function space for allocating and clearing an address space for a function interface of the hardware module. The attribute of a hardware module connected to a connector having a corresponding address is recognized using the discrimination space. The function interface of each hardware module is assigned a space within the function space in accordance with the contents of the discrimination space in concern, or the assigned space is canceled.
    Type: Grant
    Filed: April 23, 1991
    Date of Patent: April 5, 1994
    Assignees: Hitachi Ltd., Hitachi Techno Engineering Co., Ltd.
    Inventors: Takahiro Kawai, Masatsugu Shinozaki, Hitoshi Sadamitsu, Tadashi Kyoda, Katsuya Takanashi, Hironori Uchida
  • Patent number: 5297480
    Abstract: A high vacuum hot press for producing a multi-layer board. The high vacuum hot press includes a pair of heat insulating members each comprising a heat insulating material and a thin metallic cover defining an evacuated hermetic space accommodating therein the heat insulating material. The heat insulating members are arranged on respective surfaces, facing each other on a pair of bolsters. A pair of hot plates are placed on the heat insulating members, respectively. A multi-layer workpiece is disposed between the hot plates in a sealed space in a sealing unit. The multi-layer work includes wafers and an adhesive base material. The sealed space is evacuated to a high vacuum by an evacuating unit, and the multi-layer workpiece is heated by a heating unit under a high vacuum.
    Type: Grant
    Filed: May 6, 1992
    Date of Patent: March 29, 1994
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Akimi Miyashita, Hazime Sato, Mutsumasa Fujii, Isao Koromegawa, Katsunori Shibata
  • Patent number: 5231339
    Abstract: In a slip frequency control system hitherto widely employed as a control system for an induction motor type electric rolling stock (in which a slip frequency is determined from a current deviation, an inverter frequency is calculated from the slip frequency and a motor rotation frequency, and the inverter frequency is multiplied by a predetermined correction factor to determine a modulation rate, thereby operating an inverter), a motor output torque decreases in a low speed region. It is difficult to make the correction for this decrease of torque by detecting the torque. In the present invention made considering that a torque curve and sin .phi. (.phi.: the internal impedance angle of a motor) obtained from the result of simulation resemble each other, the decrease of sin .phi. is regarded as being the decrease of torque and a voltage to frequency ratio is corrected so as to compensate for the decrease of sin .phi..
    Type: Grant
    Filed: March 18, 1991
    Date of Patent: July 27, 1993
    Assignees: Hitachi, Ltd., Hitachi Techno Engineering Co., Ltd.
    Inventors: Yasuharu Kishimoto, Sadao Asaba, Kenichi Nakata, Shigeo Kawatsu
  • Patent number: 5203487
    Abstract: In a method and a system in which while carrying objects to be treated to a preheating chamber and a reflow chamber adjacent thereto, hot gases are blown against the objects to be treated by cross flow blowers provided in the preheating chamber and the reflow chamber to melt solder so as to solder electronic parts on a circuit substrate; a free air introducing port is controllably provided in the vicinity of an intake port of the cross flow blower in the preheating chamber, and an exhaust port and an exhaust fan for exhausting gases having an amount corresponding to the free air taken from the free air introducing port, out of the preheating chamber are provided.
    Type: Grant
    Filed: March 25, 1992
    Date of Patent: April 20, 1993
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Haruo Mishina, Masato Itagaki, Masahumi Wada
  • Patent number: 5197384
    Abstract: A screen printer which has a cleaning device for cleaning a mask which is formed with at least a hole of a printing pattern. The cleaning device includes a spatula member and an airstream generating device. The spatula member is moved along the surface of the mask in contact therewith so as to scrape ink adhered to the mask surface. The airstream generating device generates an airstream passing through the hole of the mask so as to remove ink within the hole of the mask.
    Type: Grant
    Filed: May 24, 1991
    Date of Patent: March 30, 1993
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Satoshi Yawata, Haruo Mishina
  • Patent number: 5195024
    Abstract: Disclosed herein is a programmable controller comprising a central processing unit (CPU) and a delay element. The CPU operates on simulated input information in accordance with a sequence program. The result of the operation by the CPU is sent to the delay element. The delay element in turn supplies the operational result with a delay time setting and feeds the result back to the CPU as simulated input information. The delay element is also capable of setting any delay time for simulation as desired.
    Type: Grant
    Filed: May 31, 1990
    Date of Patent: March 16, 1993
    Assignees: Hitachi, Ltd., Hitachi Techno Engineering Co., Ltd.
    Inventors: Naohiro Kurokawa, Yasusuke Sakurai
  • Patent number: 5182121
    Abstract: A hot press including a displaceable sleeve for surrounding materials of a multi-layer substrate under a reduced pressure condition, a gas pressurizing condition and a heating condition with thermal plates. Upper and lower sealing units seal an interior of the sleeve, with a mechanism lowering and raising the sleeve. A pilot check mechanism prevents a lower bolster from raising/lowering upon the reduced pressure condition and the gas pressure condition, and a retainer maintains the lowered or raised condition of the sleeve. The multi-layer substrate is formed under the reduced pressure condition and the gas pressure condition. Accordingly, the atmosphere and moisture between the materials of the multi-layer substrate and volatile composition are removed. Additionally, a void generated during the heat and pressure process by the heating plates is eliminated from the multi-layer substrate.
    Type: Grant
    Filed: October 9, 1990
    Date of Patent: January 26, 1993
    Assignees: Hitachi, Ltd., Hitachi Techno Engineering Co., Ltd.
    Inventors: Akimi Miyashita, Mutsumasa Fujii, Minoru Kubosawa, Keiichiro Torii, Nobuaki Ooki, Kiyonori Kogawa, Masami Kawaguchi, Hideyasu Murooka, Masayuki Kyooi
  • Patent number: 5177528
    Abstract: The present invention provides an aligning apparatus which is capable of aligning auxiliary connecting plates such as a testing fixture plate so as to fit to both sides of a substrate. A camera 13a monitors aligning marks provided on a substrate 6 and a first auxiliary connecting plate (i.e. a lower surface testing fixture plate) 8 to carry out an aligning operation by moving the substrate 6 by means of an XY.THETA. table 5. A first plate-fitting member (a vacuum suction member) 32 fixes the substrate 6 and the first auxiliary connecting plate 8. On the other hand, a camera 13b monitors aligning marks provided on the substrate 6 and a second auxiliary connecting plate (i.e. an upper surface testing fixture plate) 11 to carry out an aligning operation by moving the second auxiliary connecting plate 11 by means of the XY.THETA. table 5. A second plate-fitting member (a vacuum suction member) 33 fixes the substrate 6 and the second auxiliary connecting plate 11.
    Type: Grant
    Filed: May 26, 1992
    Date of Patent: January 5, 1993
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Isao Koromegawa, Terumi Ogawa, Masashi Takagaki, Hironori Toyoshima
  • Patent number: 5176078
    Abstract: A screen printing machine comprises a conveyor for conveying a substrate to a positioning station, an XY.theta. table on which the substrate is to be put, and a printing device for printing a pattern onto the substrate in a printing station. The XY.theta. table is movable in an XY.theta. plane in the positioning station and also movable along a Z-direction perpendicular to the XY.theta. plane. The machine further comprises a device for moving the printing device between the printing station and a waiting station, an image processing device and a driving device for the XY.theta. table. The image processing device recognizes a position of the substrate and calculates the respective amount of movement of the XY.theta. table in the XY.theta. plane necessary for making the predetermined relative positional relation between the printing device and the substrate. The driving device moves the XY.theta. table, based on the amounts of movement calculated by the image processing device.
    Type: Grant
    Filed: May 26, 1992
    Date of Patent: January 5, 1993
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Makoto Homma, Norio Beppu
  • Patent number: 5176076
    Abstract: A screen printer effects a printing by moving a squeegee in contact with a screen to force a printing paste through a printing pattern formed on the screen. The squeegee is held by a squeegee head. The squeegee head includes a support member for supporting the squeegee in such a manner as to move the squeegee upward and downward, and at least one moving member which swingably supports the support member and is movable together with the support member. When the squeegee is to be exchanged, only the support member is angularly movable relative to the moving member so as to provide a sufficient space above the screen to facilitate the exchange of the squeegee.
    Type: Grant
    Filed: February 4, 1991
    Date of Patent: January 5, 1993
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Nobuyuki Azuma, Noriaki Mukai, Yasusuke Hayashi
  • Patent number: 5163599
    Abstract: A reflow soldering apparatus having a pre-heating chamber and a reflow chamber, wherein a hot gas recirculation system including a cross-flow blower, a diverging nozzle and a heater is provided in the reflow chamber or both in the pre-heating chamber and the reflow chamber, so that a hot gas such as heated air is uniformly applied to the object such as a combination of a substrate and an electronic parts carried by the substrate, whereby uniform distributions of temperature and flow velocity of the hot gas are attained. The hot gas recirculation means may be arranged so as to vary the angle at which the hot gas impinges upon the substrate and the breadth over which the hot gas is applied.
    Type: Grant
    Filed: October 2, 1990
    Date of Patent: November 17, 1992
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Haruo Mishina, Masato Itagaki, Masahumi Wada
  • Patent number: 5156325
    Abstract: In case of suspending an apparatus upon the completion of soldering operation, from not smaller than 50% to less than 95% of a thermomedium in a reflow section is transferred to a filtering tank and the remaining thermomedium is made to pass through a water separator in advance of suspending the apparatus, so that water in the thermomedium is removed. This water removing operation makes it possible to prevent the corrosion of the reflow section and the deterioration of the thermomedium. Additionally, a method is disclosed for preventing water to be mixed with the thermomedium by warming the reflow section before operation.
    Type: Grant
    Filed: December 20, 1990
    Date of Patent: October 20, 1992
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Haruo Mishina, Shinya Yamama
  • Patent number: 5150639
    Abstract: A method in which a thin continuous film for conveying a base plate put on the film and another thin continuous film stuck to the main surface of the plate are automatically cut out along the contour of the plate, wherein a cutter is moved to one end of each edge of the plate from an optional position distant from the edge and is thereafter moved to the other end of the edge from another optional position distant from the edge, and movement of the cutter is performed with regard to all the edges of the plate sequentially.
    Type: Grant
    Filed: October 7, 1991
    Date of Patent: September 29, 1992
    Assignees: Somar Corporation, Hitachi Techno Engineering Co., Ltd.
    Inventors: Fumio Hamamura, Katsuyoshi Watanabe
  • Patent number: 5146694
    Abstract: A vapor reflow type soldering apparatus with an upper supply hole of vapor for heating the upper surface of an article to be processed, the position of which is displaced to the downstream side along a direction of delivery with respect to that of a lower supply hole of vapor for heating the lower surface of the article, so that the temperature of the upper surface of the article to be processed can be raised more moderately than that of the lower surface thereof.
    Type: Grant
    Filed: October 2, 1990
    Date of Patent: September 15, 1992
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Haruo Mishina, Shinya Yamama
  • Patent number: 5078820
    Abstract: Apparatus and method for pressure and heat sticking a thin film to a base plate. The thin film and a base plate on a film like carrier are introduced into a vacuum chamber having upper and lower contact members for compressing the thin film, base member and carrier into a stratified body. The thin film and base plate are held separate from one another in the chamber. The lower contact member moves upward to contact the carrier and base plate and to compress the stratified body between it and the upper contact member. The upper contact member is convex in shape and made of an elastic material so that the contact pressure on the thin film and base plate starts near the center and spreads toward the periphery resulting in improved sticking of thin film to the base plate with no air bubbles and no wrinkling. The pressure is applied in a vacuum or reduced atmospheric pressure and heat is simultaneously applied. A further compression in the air at atmospheric pressure is carried out by a heat and pressure roller.
    Type: Grant
    Filed: March 24, 1989
    Date of Patent: January 7, 1992
    Assignees: Somar Corporation, Hitachi Techno
    Inventors: Fumio Hamamura, Yukio Oka