Abstract: A vapor reflow type soldering apparatus comprises a vapor generating tank disposed substantially centrally in the apparatus for receiving therein a thermal medium and saturated vapor of said thermal medium; a preheating chamber arranged upstream of the vapor generating tank; a cooling chamber arranged downstream of the vapor generating tank; an inlet side passage connecting the vapor generating tank and the preheating chamber; an outlet side passage connecting the vapor generating tank and the cooling chamber; a conveyor extending horizontally through the preheating chamber, the inlet side passage, the vapor generating tank, the outlet side passage and the cooling chamber, wherein the conveyor can vary the width thereof; an outlet side exhaust port provided at the outlet side passage; an inlet side cooler arranged beneath the inlet side passage and having a cover at an upper position thereof; an outlet side cooler arranged beneath the outlet side passage and extending close to the outlet side exhaust port; a

Abstract: A vapor reflow type soldering apparatus comprising a tank that is filled with saturated vapor of a heat medium and a passage extending through the tank. An article to be processed is transferred through the passage and is brought into contact with the saturated vapor so that a solder material on the article is heated and molten. Also, a discharge gas collecting unit is provided in the apparatus and includes a chilled water system through which water at a constant temperature is caused to flow. The heat medium is collected out of the discharge gas from the apparatus and is returned back to a tank. A flux separating unit is connected to the chilled water system of the discharge gas unit through a pipes and switching valves. The chilled water in the chilled water system is selectively introduced into the flux separating unit to cool the heat medium within the tank, and a flux molten into the heat medium is removed from the molten solder material.

Abstract: A method and apparatus for printing an electronic circuit on a board by screen printing. A board to be printed is transported from a supply/discharge station to a positioning station and then to a printing station and is returned to the supply/discharge station. At the positioning station spaced from the printing station, positioning of the board is effected by an image processor and an XY.theta. table. The board thus positioned is transported to the printing station while the board is kept in the positioned state. At the printing station, a screen printing is effected on the thus correctly positioned board.

Abstract: An apparatus for fixing electronic parts to a printed circuit board is disclosed which comprises a vapor generating tank or boiling and generating a thermal medium and a returning tank for receiving the thermal medium containing flux. The vapor generating tank and the returning tank are separated from each other. By utilizing the level difference between the vapor generating tank and the returning tank, the thermal medium is charged into a flux separator and discharged therefrom. Thus, the mixture of the flux into the thermal medium may be reduced and its maintenance work may readily be carried out, thereby reducing a running cost of the apparatus.

Abstract: An apparatus for fitting electronic parts to a printed circuit board is disclosed which comprises a collector for collecting thermal medium adhered to a conveyor that is travelling out of a vapor tank. Thus, it is possible to prevent generation of poisonous gas and to enhance a safety aspect of the apparatus. Also, since it is possible to collect the thermal medium, the running cost may be reduced.

Abstract: A grinder for use in a grinding apparatus, comprising a pair of rotary and stationary discs facing each other, in which the rotary disc is rotated through a shaft by a drive motor, and in which a large number of grinding material particles are embedded in the surface of the discs to form microbites to grinding surfaces of the discs, and the strength of the grinding surface of the stationary disc is inferior to that of the rotary disc. The grinding is accomplished by fine cutting which is carried out by microbits formed of superhard grinding material particles having a sharp edge, rather than by mashing or abrasion. The grinder is formed as a cassette type so as to be replaced readily and quickly by new one. The grinder is provided with a clearance adjustor for adjusting the clearance between the rotary disc and the stationary disc.

Abstract: A vapor reflow type soldering apparatus is provided with a vapor generating tank in which liquefied thermal medium is heated to be converted into vapor. An article or part to be processed is delivered through the vapor generating tank by a conveyor, and a soldering material of the article is heated and molten by the vapor of the thermal medium. The soldering apparatus is further provided with at least one unit or system for introducing the liquefied thermal medium into the vapor generating tank. The liquefied thermal medium is delivered through a pipe provided at a position where heat-exchange between the liquefied thermal medium of the pipe and the high temperature thermal medium is possible to be effected. The liquefied thermal medium is introduced into the vapor generating tank after it has been preheated through the heat exchange with the high temperature thermal medium.