Abstract: An isolation and flattening technique for a semiconductor substrate having active devices, such as a bipolar transistor, and a MISFET, formed thereon, is disclosed.

Abstract: A semiconductor memory device has a plurality of divided memory blocks, each of which has its X-system addresses assigned so that an equal number of word lines in a plurality of sets of memory mats and sense amplifiers may be selected. Each memory block is equipped with a plurality of internal voltage drop circuits for generating a supply voltage from the outside into the operating voltages of the sense amplifiers.

Abstract: Means for changing-over address signals is provided in an address input portion, and the order of the signals to be input to an address decoder is changed according to external control signals. Alternatively, a reading output circuit is provided which reads data in bit unit different from that of the writing input circuit. Thus, data can be read and written even when the number of bits of data differs between in case of accessing a built-in memory of an LSI inside the LSI and in case of accessing it from outside the LSI.

Abstract: Herein disclosed is a semiconductor integrated circuit device fabricating process for forming MISFETs over the principal surface in those active regions of a substrate, which are surrounded by inactive regions formed of an element separating insulating film and channel stopper regions, comprising: the step of for forming a first mask by a non-oxidizable mask and an etching mask sequentially over the principal surface of the active regions of the substrate; the step of forming a second mask on and in self-alignment with the side walls of the first mask by a non-oxidizable mask thinner than the non-oxidizable mask of the first mask and an etching mask respectively; the step of etching the principal surface of the inactive regions of the substrate by using the first mask and the second mask; the step of forming the element separating insulating film over the principal surface of the inactive regions of the substrate by an oxidization using the first mask and the second mask; and the step of forming the channel s

Abstract: A multi-port memory device has a memory cell array including one or more memory blocks each of which has a plurality of memory cells arranged in rows and columns, and a plurality of dummy cells, with one dummy cell being provided for each row of memory cells in each of the memory blocks so that the dummy cells are connected with associated ones of the word lines extending in the row direction. The dummy cells are further connected with dummy cell bit lines extending in the column direction. Sense amplifiers are connected to receive outputs of those memory cells in the memory cell array which are selected in a memory cell selection operation and outputs of those dummy cells among the plurality of dummy cells which are selected in the memory cell selection operation for amplifying differences between the selected memory cell outputs and the selected dummy cell outputs. Precharging and shielding arrangements are also provided for improved operation.

Abstract: In a nonvolatile semiconductor memory device, a high voltage is selectively exerted between a word line to which the control gates of nonvolatile semiconductor memory elements are coupled and a source line to which the sources of the nonvolatile semiconductor memory elements are coupled, whereby charges stored in the floating gates are extracted through the source line. In addition, the nonvolatile semiconductor memory elements to be erased are provided with a source potential having ramp-rate characteristics such that the sources are gradually raised from a low voltage to the high voltage. Thus, the erasure of a predetermined part of the memory array of the memory device becomes possible in accordance with the division of the source lines or that of the word lines, and an excessive intense electric field can be prevented from acting between the floating gates and the sources because a ramp rate is used for the erasing high voltage.

Abstract: A multiport memory is provided which permits both random access and serial access. In order to reduce parasitic capacitance and improve operating speed, the serial input/output lines are each divided into two parts at their middle points. Sense amplifiers for the serial input/output lines are provided at upper and lower ends of the serial access memory elements to respectively amplify signals from the divided lines. Additional features are provided for improving both the serial and random operation. For example, during the serial read mode, the column selector for random access is simultaneously operated, and read data passing through the random access column selector is used as head data for the serial output operation to be delivered through the serial output circuit. Also, a serial selector can be controlled by a select signal formed by a Gray Code counter to improve operating speed.

Abstract: There is provided in connection with a semiconductor memory, such as of the pseudostatic RAM, a layout of the circuit components thereof including a method of testing the memory. There is provided an oscillation circuit which is capable of withstanding bumping of the power source voltage (varying) which effects stabilization regarding the operation of the circuits included therewith including a refresh timer circuit. There is also provided for testing a refresh timer circuit and a semiconductor memory which includes a refresh timer circuit. There is further provided for an output buffer which is capable of high speed operation with respect to memory data readout, a voltage generating circuit which is capable of stable operation and a fuse circuit, such as provided in connection with redundant circuitry in the memory and which is characterized as having a configuration of a fuse logic gate circuit employing complementary channel MOSFETs together with a fuse.

Abstract: In a clock wiring of a semiconductor integrated circuit device or a printed wiring, a shield clock wiring to be connected with the same drive source as a drive source to be connected with the clock wiring is laid adjacent to the whole or partial length of the clock wiring.

Abstract: A single chip microprocessor 1 includes a CPU 2 and a sub-processor 5 for software implementation of peripheral functions of the microprocessor 1. Sub-processor 5 includes electrically writable internal storage devices microprogram memory unit 13 and sequence control memory unit 62 for storing the software. Peripheral functions are defined and/or modified by writing software into the memory units 13 and 62. Accordingly, the time it takes to define and/or modify the peripheral functions is the time it takes to program the memory units 13 and 62. The sub-processor 5 also includes an execution unit 16 for executing a plurality of tasks and an address control circuit 14 for providing addresses to the microprogram memory unit 13. Additionally, the microprogram memory unit 13 provides microinstructions to the execution unit 16. The sequence control memory unit 62 is part of the address control circuit 14 which also includes a plurality of address registers MAR0 to MAR11.

Abstract: A semiconductor device is provided having a semiconductor pellet that is arranged on a substantially central part of a film base in which a metal plate is overlaid with an insulating member, while inner leads are arranged on a peripheral part of the film base in a state in which they are electrically isolated from the metal plate of the film base. External terminals for a power source among external terminals of the semiconductor pellet and middle parts of the metal plate of the film base, as well as inner leads for the power source among the inner leads and peripheral parts of the metal plate are electrically connected by pieces of bonding wire, respectively.

Abstract: A non-inverting buffer circuit device suited for an input buffer circuit of a semiconductor memory is provided so that the number of logic gate stages can be reduced to realize a high speed operation. The circuit is designed in such a way that an MOS transistor at an input stage drives a bipolar transistor at an output stage to produce an output. An n-channel MOS transistor and a p-channel MOS transistor connected in parallel between the base and the collector of the bipolar transistor are on/off controlled by an inverted signal of the input digital signal and a non-inverted signal thereof, respectively. In another aspect, the input buffer circuit includes an inverted signal outputting circuit, and a non-inverted signal outputting circuit in the set mode the input signal in the non-inverted state and outputting in the reset mode the signal at the prescribed potential.

Abstract: Each of a plurality of memory arrays is divided into a plurality of memory mats MAT00L-MAT07L to MAT10R-MAT17R in directions in which word lines and bit lines extend. First common data lines, that is, sub-IO lines, are provided which correspond to these memory mats and which are disposed in parallel to the word lines. Bit lines designating the corresponding memory mats are selectively connected to the first common data lines. Second common data lines, that is, main IO line groups MIOG0-MIOG7, are also provided and are disposed in parallel to the bit lines. Designated sub-IO lines are selectively connected to the second common data lines. Moreover, a plurality of main amplifiers forming a main amplifier unit MAU0 are orderly arranged in the direction in which the bit lines extend.

Abstract: There is provided a technique capable of reducing the electrode resistance by widening the effective area of an electrode in a cell for a standard potential supply connected to the memory cell. There is also provided a technique capable of reducing the memory cell area by reducing the area necessary for separation between the electrode in a cell for the standard potential supply and adjacent other electrodes. Two transfer MOS transistors of a first conductivity type and two driver MOS transistors are provided. A conductive layer for fixing the source potential of the driver MOS transistors to standard potential is so disposed above the transfer and driver MOS transistors as to the wholly cover the memory cell. Separation is carried out by using a photo-mask having an optically transparent substrate provided within the same transmissive portion with a pattern of a plurality of so-called phase shifter regions for inversion of the phase of transmitting light.

Abstract: A multiport memory is provided which permits both random access and serial access. In order to reduce parasitic capacitance and improve operating speed, the serial input/output lines are each divided into two parts at their middle points. Sense amplifiers for the serial input/output lines are provided at upper and lower ends of the serial access memory elements to respectively amplify signals from the divided lines. Additional features are provided for improving both the serial and random operation. For example, during the serial read mode, the column selector for random access is simultaneously operated, and read data passing through the random access column selector is used as head data for the serial output operation to be delivered through the serial output circuit. Also, a serial selector can be controlled by a select signal formed by a Gray Code counter to improve operating speed.

Abstract: According to one aspect of the present invention, a semiconductor chip, which can be mounted in a zigzag in-line type package (ZIP) partially using a tabless lead frame, includes bonding pads arranged on the chip so that the chip can be applied also to other different types of packages. These different types of packages include a small out-line J-bent type package (SOJ) which uses a lead frame with tab, and a dual in-line type package (DIP) which uses a tabless lead frame. Further, a plurality of bonding pad pairs are provided amongst the bonding pads on the chip, each pad of such bonding pad pairs having the same function as the other pad associated therewith thereby duplicating a common function in different bonding pads on the semiconductor chip so as to make the semiconductor chip compatible with a variety of or different types of packages.

Abstract: A non-shared system with respect to an outside and an inside cache in a multi-processor system has multi-layer hierarchical cache. An invalidation address on a main memory address bus 31 in company with the rewriting of a main memory 30 is transmitted via a first and a second path 35, 36 to inside caches 11,21 so as to invalidate these inside caches 11, 21. The invalidation address is transmitted to the outside caches 12, 22 via the bidirectional connections between the main memory address bus 31 and outside caches 12, 22 so as to invalidate these outside caches 12, 22. It is extremely improbable for the address of access for writing to the transmitted to the main memory address bus 31 because the outside caches 12, 22 are operated in either copy back or write once system.

Abstract: A Bi.CMOS semiconductor memory device is provided which includes an arrangement to simultaneously select a plurality of memory cells, followed by using a 3 bit Z addressing arrangement to determine a read or write operation for the simultaneously selected memory cells. To speed up the word line selection, a static selection type operation is used with the word line selecting voltage being greater than signal amplitude of the data lines during the write operation. Also, to speed up the read operation, separate common I/O lines are provided for the read and write operations. Read signals are transmitted as current signals, and then converted to voltage signals for improving reading speed. Also, improved arrangements are provided for resistance structure, logic circuitry, input circuitry, fuse cutting circuitry, drive circuitry, power circuitry, electrostatic protection circuitry, layout structure and testing methods for the semiconductor device.

Abstract: A method of fabrication comprising forming a semiconductor integrated circuit device LSI which has a microcomputer CPU furnished with an EPROM, determining a program for controlling the microcomputer CPU and to be set in the EPROM (performing an initial evaluation) while information is being written into and erased from the EPROM built in the semiconductor integrated circuit device LSI, and thereafter forming a semiconductor integrated circuit device LSI in which the EPROM of the first-mentioned semiconductor integrated circuit device LSI is replaced with a mask ROM. In replacing the EPROM with the mask ROM, peripheral circuits required for both the EPROM and the mask ROM have their circuit arrangements held basically the same, and specific peripheral circuits for use in only the EPROM have their circuit regions left as they are as logically inactive regions.

Abstract: An output circuit is provided which includes a first switch coupled between a first power supply terminal and an output terminal, a second switch coupled between the first power supply terminal and the output terminal, an arrangement to set the output terminal at a high impedance state, and a first variable delay coupled to a first input terminal for turning on the first switch and the second switch with different timing from each other and for turning off the first switch and the second switch simultaneously. In addition, the output circuit includes a third switch coupled between the output terminal and a second power supply terminal, a fourth switch coupled between the output terminal and the second power supply terminal, and a second variable delay coupled to a second input terminal for turning on the third switch and the fourth switch with different timing from each other and for turning off the third switch and the fourth switch simultaneously.